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1. 发明公开

EP3318861A3 GEL FILLED PORT PRESSURE SENSOR FOR ROBUST MEDIA SEALING 审中-公开
公开(公告)号：EP3318861A3
公开(公告)日：2018-08-29
申请号：EP17195307.8
申请日：2017-10-06
申请人： Honeywell International Inc.
发明人： KUSANALE, Vishal Shalitkumar , THANIGACHALAM, Palani , ECKHARDT, Todd , RICKS, Lamar Floyd , COOK, Jim , KASHYAP, Pavan R. , MURUGESAN, Vignesh
IPC分类号： G01L19/06
CPC分类号： G01L19/0627 , G01L7/08 , G01L19/0645 , G01L19/0654 , G01L19/143
摘要： Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

2. 发明授权

EP3273213B1 LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING POSITIONS 有权
公开(公告)号：EP3273213B1
公开(公告)日：2019-12-18
申请号：EP17178543.9
申请日：2017-06-28
申请人： Honeywell International Inc.
发明人： FRIBLEY, Josh M. , RICKS, Lamar Floyd , WADE, Richard , MACHIR, James F. , DAVIS, Richard Alan
IPC分类号： G01L1/18

3. 发明公开

EP3318861A2 GEL FILLED PORT PRESSURE SENSOR FOR ROBUST MEDIA SEALING 审中-公开
标题翻译：用于牢固介质密封的凝胶填充式端口压力传感器
公开(公告)号：EP3318861A2
公开(公告)日：2018-05-09
申请号：EP17195307.8
申请日：2017-10-06
申请人： Honeywell International Inc.
发明人： KUSANALE, Vishal Shalitkumar , THANIGACHALAM, Palani , ECKHARDT, Todd , RICKS, Lamar Floyd , COOK, Jim , KASHYAP, Pavan R. , MURUGESAN, Vignesh
IPC分类号： G01L19/06
CPC分类号： G01L19/0627 , G01L7/08 , G01L19/0645 , G01L19/0654 , G01L19/143
摘要： Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.
摘要翻译：实施例一般涉及用于检测压力的方法和系统。压力传感器组件可以包括传感器单元，该传感器单元在一侧具有压力输入端口，传感器单元包括印刷电路板; 固定到印刷电路板一侧的压力传感器; 支撑件，所述支撑件固定到所述印刷电路板的所述侧面，所述支撑件沿周向环绕所述压力传感器并且限定所述压力输入端口; 以及介质隔离层，其包括与所述压力传感器相邻地施加的第一介质隔离层和介于所述第一介质隔离层与所述压力输入端口之间的包括与所述第一介质隔离层不同的材料的第二介质隔离层，其中所述介质隔离层被配置为将由感测介质引起的压力传递到压力传感器。

4. 发明公开

EP3287752A1 LOW POWER OPERATIONAL METHODOLOGY FOR A FLOW SENSOR 有权
标题翻译：一种流量传感器的低功耗运算方法
公开(公告)号：EP3287752A1
公开(公告)日：2018-02-28
申请号：EP17186749.2
申请日：2017-08-17
申请人： Honeywell International Inc.
发明人： BECKE, Craig Scott , RICKS, Lamar Floyd , BENTLEY, Ian
IPC分类号： G01F1/69 , G01F1/698
CPC分类号： G01F1/69 , G01F1/692 , G01F1/6986
摘要： In an embodiment, a method of sensing a flow comprises performing a measurement cycle for a first period of time, powering off the at least one upstream resistive element and the at least one downstream resistive element for a second period of time, and performing another measurement cycle for a third period of time. Performing the measurement cycle comprises supplying a current to the upstream resistive element and the downstream resistive element arranged in a bridge, resistively heating the upstream resistive element and the downstream resistive element to a temperature above an ambient temperature, and detecting an imbalance in the bridge resulting from a temperature difference between the at least one upstream resistive element and the at least one downstream resistive element in response to the flow of a fluid past the flow sensor.
摘要翻译：在一个实施例中，感测流量的方法包括在第一时间段内执行测量周期，在第二时间段内将至少一个上游电阻元件和至少一个下游电阻元件断电，并且执行另一测量循环第三段时间。执行测量循环包括向上游电阻元件和布置在电桥中的下游电阻元件提供电流，将上游电阻元件和下游电阻元件电阻加热到环境温度以上的温度，并且检测电桥中的不平衡响应于经过流量传感器的流体的流量，从至少一个上游电阻元件和至少一个下游电阻元件之间的温度差开始。

5. 发明公开

EP3121566A1 A MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE 审中-公开
标题翻译： MEMS-LUFTSTROMSENSORCHIP MITZUSÄTZLICHEMKREISLAUF AUF DEM CHIP
公开(公告)号：EP3121566A1
公开(公告)日：2017-01-25
申请号：EP16184224.0
申请日：2012-08-30
申请人： Honeywell International Inc.
发明人： QASIMI, Mohammed Abdul Javvad , RICKS, Lamar Floyd
IPC分类号： G01F1/684 , G01F1/692 , G01F1/698 , G01F15/02
CPC分类号： G01F1/6845 , G01F1/692 , G01F1/698 , G01F15/02
摘要： A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.
摘要翻译：具有与MEMS芯片上的气流传感器集成的加热器控制电路，差分仪表放大器，温度补偿和/或偏移校正电路的MEMS气流传感器管芯。添加的电路可以放置在具有MEMS制造技术的基本气流模具上可用的空间上，而不需要扩大传感器芯片。具有附加电路的管芯可能导致具有减小的形状因数，改进的可靠性和更低成本的器件。

6. 发明公开

EP3187848A1 PRESSURE SENSOR ASSEMBLY 有权转让
标题翻译：压力传感器组件
公开(公告)号：EP3187848A1
公开(公告)日：2017-07-05
申请号：EP16204555.3
申请日：2016-12-15
申请人： Honeywell International Inc.
发明人： ECKHARDT, Todd , RICKS, Lamar Floyd
IPC分类号： G01L19/00 , G01L19/06 , G01L19/14
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0092 , G01L19/0627 , G01L19/142 , G01L19/148
摘要： A pressure sensor assembly having a sensor unit, a pressure port, and an electrical connector. The sensor unit may include a printed circuit board (PCB), a pressure sensor, a support, and a media isolation layer. The PCB may have a first side and an opposite second side, where the pressure sensor may be secured to the first side. The support may also be secured to the first side of the PCB and may circumferentially surround the pressure sensor and/or may define a media sensing opening. The media isolation layer (e.g., a gel or other material) may be provided in the media sensing opening and encase the pressure sensor, where the media isolation layer may transfer a pressure provided by the media in the pressure port to the pressure sensor and may act as a barrier between the media and the pressure sensor.
摘要翻译：一种压力传感器组件，其具有传感器单元，压力端口和电连接器。传感器单元可以包括印刷电路板（PCB），压力传感器，支撑件和介质隔离层。 PCB可以具有第一侧和相对的第二侧，其中压力传感器可以固定到第一侧。支撑件还可以固定到PCB的第一侧并且可以周向地围绕压力传感器和/或可以限定介质感测开口。介质隔离层（例如，凝胶或其他材料）可以被设置在介质感测开口中并且包封压力传感器，其中介质隔离层可以将由压力端口中的介质提供的压力传递到压力传感器，并且可以充当介质和压力传感器之间的屏障。

7. 发明公开

EP3719470A2 PRESSURE SENSOR WITH MULTIPLE PRESSURE SENSING ELEMENTS 审中-公开
公开(公告)号：EP3719470A2
公开(公告)日：2020-10-07
申请号：EP20167852.1
申请日：2020-04-02
申请人： Honeywell International Inc.
发明人： RICKS, Lamar Floyd , BENTLEY, Ian , COOK, Jim , FRIBLEY, Josh M.
IPC分类号： G01L19/14 , B81B7/00 , B81C1/00
摘要： A pressure sensor (100) is provided. The pressure sensor (100) includes a substrate (103), and a first pressure sensing element (127), a second pressure sensing element (129), and sensor conditioning circuitry (131) disposed on the first surface (105) of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.

8. 发明公开

EP3273213A3 LOW COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING POSITIONS 有权
公开(公告)号：EP3273213A3
公开(公告)日：2018-03-07
申请号：EP17178543.9
申请日：2017-06-28
申请人： Honeywell International Inc.
发明人： FRIBLEY, Josh M. , RICKS, Lamar Floyd , WADE, Richard , MACHIR, James F. , DAVIS, Richard Alan
IPC分类号： G01L1/18
摘要： A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

9. 发明公开

EP3136062A1 FLOW SENSOR ASSEMBLY WITH INTEGRAL BYPASS CHANNEL 有权
标题翻译： DURCHFLUSSSENSORANORDNUNG MIT INTEGRALEM UMGEHUNGSKANAL
公开(公告)号：EP3136062A1
公开(公告)日：2017-03-01
申请号：EP16189717.8
申请日：2012-01-31
申请人： Honeywell International Inc.
发明人： SPELDRICH, Jamie , RICKS, Lamar Floyd , BECKE, Craig Scott , WEICHAO, Feng
IPC分类号： G01F5/00 , G01F15/18 , G01F1/684
CPC分类号： G01F1/68 , G01F1/6842 , G01F1/6845 , G01F5/00 , G01F15/185
摘要： Flow sensor assemblies (38) having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly (38) includes a housing (40) with an inlet (88) flow port, an outlet flow port, a fluid channel (12) extending between the inlet flow port (88) and the outlet flow port (90), and a bypass channel (62) having a pair of taps (64) fluidly connected to the fluid channel (12) at separate locations. A flow sensor (10) for sensing a measure related to a flow rate of a fluid flowing through the fluid channel (12) can positioned in the bypass channel (62). A pressure differential between the two taps (64) of the bypass channel (62) can drive a fraction of a fluid flowing through the fluid channel (12) through the bypass channel (62). The flow sensor assembly (38) may be configured to achieve, control, and/or balance a desired fraction of fluid flow (14) through the bypass channel (62) and past the flow sensor (10).
摘要翻译：公开了具有增加的流量范围能力的流量传感器组件（38）。在一个说明性实施例中，流量传感器组件（38）包括具有入口（88）流动端口，出口流动端口，在入口流动端口（88）和出口（88）之间延伸的流体通道流动端口（90）和旁路通道（62），其具有在分开的位置处流体地连接到流体通道（12）的一对抽头（64）。用于感测与流过流体通道（12）的流体的流量相关的测量的流量传感器（10）可以位于旁路通道（62）中。旁路通道（62）的两个抽头（64）之间的压力差可以驱动通过旁通通道（62）流过流体通道（12）的流体的一部分。流量传感器组件（38）可以被配置成实现，控制和/或平衡通过旁路通道（62）并经过流量传感器（10）的流体流（14）的期望分数。

10. 发明公开

EP4033215A1 COST OVERMOLDED LEADFRAME FORCE SENSOR WITH MULTIPLE MOUNTING POSITIONS 有权
公开(公告)号：EP4033215A1
公开(公告)日：2022-07-27
申请号：EP22163097.3
申请日：2017-06-28
申请人： HONEYWELL INTERNATIONAL INC.
发明人： FRIBLEY, Josh M. , RICKS, Lamar Floyd , WADE, Richard , MACHIR, James F. , DAVIS, Richard Alan
IPC分类号： G01L1/18
摘要： A force sensor (100, 200, 300, 400, 500) comprising: a leadframe (102) comprising: a base having a first major surface and an opposing second major surface, with a base side wall extending between the first major surface and the opposing second major surface; a plurality of conductive traces supported by the base; a plurality of leads (116) each electrically coupled to one or more of the plurality of conductive traces, each of the plurality of leads having a lead end that is spaced from the base; a sense die (104, 204) electrically coupled to two or more of the plurality of conductive traces, the sense die comprising one or more piezoresistive sensing elements for sensing a force applied to the sense die, wherein the sense die comprises a first major surface and an opposing second major surface, with a sense die side wall extending between the first major surface and the opposing second major surface, and wherein the opposing second major surface of the sense die faces the first major surface of the base; and an encapsulant (108) engaging both the base and the sense die for providing structural rigidity to the force sensor, wherein the lead end of at least some of the plurality of leads extends outside of the encapsulant to allow for an electrical coupling of the lead end to an external component.

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