专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1465937A1 ORGANIC COMPOSITIONS 审中-公开
标题翻译：有机化合物
公开(公告)号：EP1465937A1
公开(公告)日：2004-10-13
申请号：EP03715927.4
申请日：2003-01-13
申请人： Honeywell International Inc.
发明人： APEN, Paul, G. , NAMAN, Ananth , LI, Bo , LAU, Kreisler , KOROLEV, Boris, A. , IWAMOTO, Nancy , BEDWELL, William, B.
IPC分类号： C08G61/02 , H01L21/312 , H01L21/316
CPC分类号： H01L21/02118 , C08G61/02 , C08L65/00 , H01L21/02126 , H01L21/02282 , H01L21/312 , H01L21/31695 , H05K1/0313 , Y10T428/31663
摘要： The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally at least one monomer of Formula (I) as set forth below and (2) at least one oligomer or polymer of Formula (II) set forth below where E is a cage compound (defined below); each Q is the same or different and selected from hydrogen, aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; GW is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material

2. 发明公开

EP1803149A2 TREATING AGENT MATERIALS 审中-公开
标题翻译：处理资源材料
公开(公告)号：EP1803149A2
公开(公告)日：2007-07-04
申请号：EP05806419.7
申请日：2005-09-07
申请人： Honeywell International, Inc.
发明人： BHANAP, Anil, S. , KOROLEV, Boris, A. , LEUNG, Roger, Y. , MUNOZ, Beth, C. , RAMOS, Teresa, A. , ROTH, Robert R. , APEN, Paul, G. , ENDISCH, Denis, H. , DANIELS, Brian, J. , NAMAN, Ananth , IWAMOTO, Nancy
IPC分类号： H01L21/3105
CPC分类号： H01L21/3105 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02219 , H01L21/02222 , H01L21/02282 , H01L21/02343 , H01L21/02359 , H01L21/76814
摘要： A treating agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent which may be an acid, a base, an onium compound, a dehydrating agent, and combinations thereof, and an optional solvent or mixture of a main solvent and a co-solvent.

3. 发明公开

EP1466356A2 ORGANIC COMPOSITIONS 审中-公开
标题翻译：有机组合物
公开(公告)号：EP1466356A2
公开(公告)日：2004-10-13
申请号：EP03729654.8
申请日：2003-01-14
申请人： Honeywell International Inc.
发明人： LI, Chan-En , ZHEREBIN, Ruslan , Sleiman Nassrin , GEBREBRHAN, Amauel , NAMAN, Annath , SIKONIA, John, G. , LAU, Kreisler , APEN, Paul, G. , KOROLEV, Boris , IWAMOTO, Nancy
IPC分类号： H01L21/316 , H01L21/312 , C08J9/26
CPC分类号： H01L21/02126 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/31695
摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.
摘要翻译：本发明提供了一种组合物，其包含：（a）介电材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基并且在相邻芳环上的至少两个烷基取代基之间存在键。优选地，介电材料为包含（a）热固性组分和（2）至少一种如下所示的式11的低聚物或聚合物的组合物，所述组分包含（1）任选的如下所示的式I的单体，其中Q，G，h ，I，I和W如下所述和（b）致孔剂。优选地，成孔剂选自未官能化的聚ace烯均聚物，官能化的聚ace烯均聚物，聚ace烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，1s聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，，脂族聚碳酸酯，聚砜，聚丙交酯及其共混物。本发明组合物特别适用于微芯片，多芯片模块，叠层电路板和印刷线路板中的介电基片材料。

4. 发明公开

EP1463770A1 ORGANIC COMPOSITION 有权
标题翻译：有机构成
公开(公告)号：EP1463770A1
公开(公告)日：2004-10-06
申请号：EP03702017.9
申请日：2003-01-07
申请人： Honeywell International Inc.
发明人： APEN, Paul, G. , ZHEREBIN, Ruslan , LI, Bo , KOROLEV, Boris, A. , LAU, Kreisler, S. , KANSCHIK-CONRADSEN, Andreas , KELLERMEIER, Bernd , DEMEL, Sonja , WERNER, Christian , SULLIVAN, Edward, J.
IPC分类号： C08G61/12
CPC分类号： C08G61/02 , C08G61/12
摘要： The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.

5. 发明授权

EP1463770B1 ORGANIC COMPOSITION 有权
标题翻译：有机构成
公开(公告)号：EP1463770B1
公开(公告)日：2007-07-04
申请号：EP03702017.9
申请日：2003-01-07
申请人： Honeywell International Inc.
发明人： APEN, Paul, G. , ZHEREBIN, Ruslan , LI, Bo , KOROLEV, Boris, A. , LAU, Kreisler, S. , KANSCHIK-CONRADSEN, Andreas , KELLERMEIER, Bernd , DEMEL, Sonja , WERNER, Christian , SULLIVAN, Edward, J.
IPC分类号： C08G61/12
CPC分类号： C08G61/02 , C08G61/12
摘要： The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.

6. 发明公开

EP1466355A2 ORGANIC COMPOSITIONS 审中-公开
标题翻译：有机组合物
公开(公告)号：EP1466355A2
公开(公告)日：2004-10-13
申请号：EP03721273.5
申请日：2003-01-14
申请人： Honeywell International Inc.
发明人： LI, Bo , SULLIVAN, Edward, J. , LAU, Kreisler, S. , APEN, Paul, G.
IPC分类号： H01L21/316 , H01L21/312 , C08J9/26 , C08G61/02
CPC分类号： C07C17/10 , C07C17/266 , C07C25/22 , C07C25/24 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L21/31695 , H01L23/145 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/024 , H05K1/0313 , H05K3/4676 , C07C23/46 , H01L2924/00
摘要： The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.
摘要翻译：本发明提供一种组合物，其包含（a）热固性组分，其包含：（1）任选的如下所示的式I的单体和（2）至少一种如下所示的式II的低聚物或聚合物，其中E，Q，G， h，l，j和w如下所述和（b）与热固性组分（a）结合的致孔剂。优选地，致孔剂选自未取代的聚降冰片烯，取代的聚降冰片烯，聚己内酯，未取代的聚苯乙烯，取代的聚苯乙烯，聚ace烯均聚物和聚nap烯共聚物。优选地，本发明组合物可以用作微芯片，多芯片模块，叠层电路板或印刷线路板中的电介质基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式