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1. 发明公开

EP0337465A2 Process for producing printed circuit board 失效
标题翻译：赫尔斯特伦·冯·莱特广场。
公开(公告)号：EP0337465A2
公开(公告)日：1989-10-18
申请号：EP89106641.7
申请日：1989-04-13
申请人： HITACHI, LTD. , Hitachi Chemical Co., Ltd.
发明人： Murakami, Kanji , Kawamoto, Mineo , Tadokoro, Akio , Akahoshi, Haruo , Narahara, Toshikazu , Toba, Ritsuji , Ishimaru, Toshiaki , Hayashi, Nobuyuki , Wajima, Motoyo
IPC分类号： H05K3/38 , H05K3/18 , H05K3/02
CPC分类号： H05K3/282 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/383 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124
摘要： The present invention provides a process for producing printed circuit boards which comprises the steps of

(a) roughening a surface of a copper layer (2) formed on an insulating board (1),
(b) coating the roughened surface of copper layer (2) with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats (4) on circuit-negative pattern portions of the copper layer (2),
(c) heat-treating the plating-resist coats (4),
(d) plating chemically the circuit-corresponding portions with copper (5),
(e) removing the plating-resist coats (4), and
(f) removing the copper layer (2) except the circuit-corresponding portions thereof.
摘要翻译：本发明提供一种制造印刷电路板的方法，其包括以下步骤：（a）使形成在绝缘板（1）上的铜层（2）的表面粗糙化，（b）将铜层（2）的粗糙化表面）具有含有可升华的铜腐蚀抑制剂的光致抗蚀剂层，根据电路图案将抗蚀剂层选择性地曝光于光化学射线，以形成和显影所得的抗蚀剂层，从而在电路图形成电镀抗蚀剂涂层（4）铜层（2）的阴图案部分，（c）对电镀抗蚀涂层（4）进行热处理，（d）用铜（5）对电路对应部分进行化学镀，（e）除去电镀抗蚀剂（4）和（f）除去除了电路对应部分之外的铜层（2）。 ñ

2. 发明授权

EP0630173B1 Process for preparing printed circuit board 失效
标题翻译：制备印刷电路板的过程
公开(公告)号：EP0630173B1
公开(公告)日：2002-08-14
申请号：EP94303930.5
申请日：1994-06-01
申请人： Hitachi Chemical Co., Ltd. , Hitachi, Ltd.
发明人： Ohta, Fumihiko , Nojiri, Takeshi , Tsuchikawa, Shinji , Nakano, Akio , Ishimaru, Toshiaki , Yamazaki, Hiroshi , Akaboshi, Haruo , Kawamoto, Mineo , Takahashi, Akio
IPC分类号： H05K3/18 , G03F7/033 , C23C18/16
CPC分类号： G03F7/033 , C23C18/1605 , C23C18/2013 , C23C18/2033 , C23C18/24 , C23C18/30 , C23C18/405 , H05K3/0076 , H05K3/184 , H05K2203/0793

3. 发明公开

EP0669793A3 A method for manufacturing printed circuit board 失效
标题翻译：一种用于制造电路板的过程。
公开(公告)号：EP0669793A3
公开(公告)日：1996-08-14
申请号：EP95301193.9
申请日：1995-02-23
申请人： HITACHI, LTD. , HITACHI CHEMICAL CO., LTD.
发明人： Satsu, Yuichi , Akahoshi, Haruo , Kawamoto, Mineo , Takahashi, Akio , Miyazaki, Masashi , Ishimaru, Toshiaki
IPC分类号： H05K3/10 , G03F7/085
CPC分类号： G03F7/085 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/384 , H05K2201/0347 , H05K2201/0355 , H05K2203/1105 , H05K2203/124 , Y10S430/155
摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1) ;
where, R 1 is any of H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R 2 is an alkyl group having 0-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2) ;
where, R 3 is either of H or an alkyl group having 1-6 carbon atoms, X is either of NH or S, and Z is either of N or C-Y, where Y is any of H, NH 2 , or SH.

4. 发明公开

EP0630173A3 Process for preparing printed circuit board 失效
标题翻译：制备印刷电路板的过程
公开(公告)号：EP0630173A3
公开(公告)日：1996-07-03
申请号：EP94303930.5
申请日：1994-06-01
申请人： Hitachi Chemical Co., Ltd. , HITACHI, LTD.
发明人： Ohta, Fumihiko , Nojiri, Takeshi , Tsuchikawa, Shinji , Nakano, Akio , Ishimaru, Toshiaki , Yamazaki, Hiroshi , Akaboshi, Haruo , Kawamoto, Mineo , Takahashi, Akio
IPC分类号： H05K3/18 , G03F7/033 , C23C18/16
CPC分类号： G03F7/033 , C23C18/1605 , C23C18/2013 , C23C18/2033 , C23C18/24 , C23C18/30 , C23C18/405 , H05K3/0076 , H05K3/184 , H05K2203/0793
摘要： Disclosed is a process for preparing a printed circuit board, which comprises the steps of:
(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b); (2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and (3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.
摘要翻译：本发明公开了一种制备印刷电路板的方法，该方法包括以下步骤：（1）在需要沉积无电镀铜的必需部分的绝缘基板的表面上形成光敏层（a）40-80重量份的酸值为10-46mgKOH / g的乙烯基聚合的高分子量粘合剂，（b）20-60重量份的具有至少两个可聚合的化合物的树脂组合物（a）和（b）的总量为100重量份的分子内具有不饱和双键的光聚合引发剂，和（c）通过活性光照射产生自由基的光聚合引发剂，其量为0.1-10份基于100重量份的组分（a）和（b）的重量; （2）通过图像照射活性光线并用半水显影液显影，在基材表面上形成光敏树脂组合物的负图案; 和（3）通过在衬底的表面上使用光敏树脂组合物的负图案作为电镀抗蚀剂，通过无电镀铜形成电路图案。

5. 发明公开

EP0630173A2 Process for preparing printed circuit board 失效
标题翻译： Verfahren zur Herstellung einer Leiterplatte。
公开(公告)号：EP0630173A2
公开(公告)日：1994-12-21
申请号：EP94303930.5
申请日：1994-06-01
申请人： Hitachi Chemical Co., Ltd. , HITACHI, LTD.
发明人： Ohta, Fumihiko , Nojiri, Takeshi , Tsuchikawa, Shinji , Nakano, Akio , Ishimaru, Toshiaki , Yamazaki, Hiroshi , Akaboshi, Haruo , Kawamoto, Mineo , Takahashi, Akio
IPC分类号： H05K3/18 , G03F7/033 , C23C18/16
CPC分类号： G03F7/033 , C23C18/1605 , C23C18/2013 , C23C18/2033 , C23C18/24 , C23C18/30 , C23C18/405 , H05K3/0076 , H05K3/184 , H05K2203/0793
摘要： Disclosed is a process for preparing a printed circuit board, which comprises the steps of:

(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);
(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and
(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.
摘要翻译：公开了一种制备印刷电路板的方法，包括以下步骤：（1）在要沉积无电镀铜的必需部分上的绝缘基板的表面上形成光敏层树脂组合物，其包含（a）40至80重量份的酸值为10至46mgKOH / g的乙烯基聚合的高分子量粘合剂，（b）20至60重量份具有至少两个可聚合的不饱和双键，组分（a）和（b）的总量为100重量份，和（c）光聚合引发剂通过以0.1〜10重量份的量照射活性光而产生自由基基于100重量份的组分（a）和（b）的重量; （2）通过成像地照射活性光并用半显影液显影来在感光树脂组合物的表面上形成负图案; 和（3）通过使用感光性树脂组合物的负图案作为电镀抗蚀剂在基板的表面上通过化学镀铜形成电路图案。

6. 发明公开

EP0669793A2 A method for manufacturing printed circuit board 失效
标题翻译： Verfahren zur Herstellung einer Leiterplatte。
公开(公告)号：EP0669793A2
公开(公告)日：1995-08-30
申请号：EP95301193.9
申请日：1995-02-23
申请人： HITACHI, LTD. , HITACHI CHEMICAL CO., LTD.
发明人： Satsu, Yuichi , Akahoshi, Haruo , Kawamoto, Mineo , Takahashi, Akio , Miyazaki, Masashi , Ishimaru, Toshiaki
IPC分类号： H05K3/10 , G03F7/085
CPC分类号： G03F7/085 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/384 , H05K2201/0347 , H05K2201/0355 , H05K2203/1105 , H05K2203/124 , Y10S430/155
摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1) ;
where, R 1 is any of H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R 2 is an alkyl group having 0-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2) ;
where, R 3 is either of H or an alkyl group having 1-6 carbon atoms, X is either of NH or S, and Z is either of N or C-Y, where Y is any of H, NH 2 , or SH.
摘要翻译：一种印刷电路板的制造方法，其特征在于，使用由感光性树脂组合物层构成的负极图案，通过化学金属电镀形成配线图案作为电镀抗蚀剂，其特征在于，所述感光性树脂至少含有由以下所示的重复单元构成的直链状高分子通式（1）; 其中，R1是H，具有1-9个碳原子的烷基，具有1-9个碳原子的烷氧基，和具有1-9个碳原子的羧烷基，R2是具有0- 9个碳原子，n为重复单元的聚合数，以及由以下通式（2）表示的有机化合物。其中，R3为H或具有1-6个碳原子的烷基，X为NH或S，Z为N或C-Y，Y为H，NH2或SH中的任一个。

7. 发明授权

EP0337465B1 Process for producing printed circuit board 失效
标题翻译：一种用于生产印刷电路板的过程。
公开(公告)号：EP0337465B1
公开(公告)日：1994-10-26
申请号：EP89106641.7
申请日：1989-04-13
申请人： HITACHI, LTD. , Hitachi Chemical Co., Ltd.
发明人： Murakami, Kanji , Kawamoto, Mineo , Tadokoro, Akio , Akahoshi, Haruo , Narahara, Toshikazu , Toba, Ritsuji , Ishimaru, Toshiaki , Hayashi, Nobuyuki , Wajima, Motoyo
IPC分类号： H05K3/38 , H05K3/18 , H05K3/02
CPC分类号： H05K3/282 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/383 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124

8. 发明公开

EP0337465A3 Process for producing printed circuit board 失效
标题翻译：生产印刷电路板的工艺
公开(公告)号：EP0337465A3
公开(公告)日：1991-07-31
申请号：EP89106641.7
申请日：1989-04-13
申请人： HITACHI, LTD. , Hitachi Chemical Co., Ltd.
发明人： Murakami, Kanji , Kawamoto, Mineo , Tadokoro, Akio , Akahoshi, Haruo , Narahara, Toshikazu , Toba, Ritsuji , Ishimaru, Toshiaki , Hayashi, Nobuyuki , Wajima, Motoyo
IPC分类号： H05K3/38 , H05K3/18 , H05K3/02
CPC分类号： H05K3/282 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/383 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124
摘要： The present invention provides a process for producing printed circuit boards which comprises the steps of
(a) roughening a surface of a copper layer (2) formed on an insulating board (1), (b) coating the roughened surface of copper layer (2) with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats (4) on circuit-negative pattern portions of the copper layer (2), (c) heat-treating the plating-resist coats (4), (d) plating chemically the circuit-corresponding portions with copper (5), (e) removing the plating-resist coats (4), and (f) removing the copper layer (2) except the circuit-corresponding portions thereof.

9. 发明公开

EP0825809A3 Multilayer circuit board and photosensitive resin composition usable therefor 失效
标题翻译：多层印刷电路板和要使用感光性树脂组合物
公开(公告)号：EP0825809A3
公开(公告)日：2000-07-26
申请号：EP97112509.1
申请日：1997-07-22
申请人： HITACHI CHEMICAL CO., LTD.
发明人： Amou, Satoru , Suzuki, Masao , Suwa, Tokihito , Kawamoto, Mineo , Takahashi, Akio , Nemoto, Masanori , Fukai, Hiroyuki , Yokota, Mitsuo , Kobayashi, Shiro , Miyazaki, Masashi
IPC分类号： H05K3/46 , G03F7/027 , G03F7/038
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K3/4644 , H05K2201/0195 , H05K2201/0209 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board with blind via-holes (5) having a resolution in the range of 25 ∼ 80 µm and an aspect ratio in the range of 2.0 ∼ 0.6 for contacting the layers to each other thereby, wherein an insulating layer (1, 2) between said layers having the blind via-holes (5) has a glass transition temperature in the range of 150 ∼ 220 °C, and an epoxy group photosensitive resin composition being used therefor. A photosensitive resin composition having preferable resolution and heat resistance was found. A multilayer circuit board, of which thermal stress generated in the steps of a reflow process, a gold wire bonding process, and a repairing process in a bare chip mounting process, and peeling off the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses at the heating processes were suppressed, was obtained. Accordingly, decreasing size and weight of electronic apparatus became possible.

10. 发明公开

EP0825809A2 Multilayer circuit board and photosensitive resin composition usable therefor 失效
标题翻译： Mehrschichtige Leiterplatte und dazu verwendbare photoempfindliche Harzzusammensetzung
公开(公告)号：EP0825809A2
公开(公告)日：1998-02-25
申请号：EP97112509.1
申请日：1997-07-22
申请人： HITACHI CHEMICAL CO., LTD.
发明人： Amou, Satoru , Suzuki, Masao , Suwa, Tokihito , Kawamoto, Mineo , Takahashi, Akio , Nemoto, Masanori , Fukai, Hiroyuki , Yokota, Mitsuo , Kobayashi, Shiro , Miyazaki, Masashi
IPC分类号： H05K3/46 , G03F7/027
CPC分类号： H05K3/0023 , G03F7/038 , H05K1/0373 , H05K3/4644 , H05K2201/0195 , H05K2201/0209 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/31511 , Y10T428/31529
摘要： A multilayer circuit board with blind via-holes (5) having a resolution in the range of 25 ∼ 80 µm and an aspect ratio in the range of 2.0 ∼ 0.6 for contacting the layers to each other thereby, wherein an insulating layer (1, 2) between said layers having the blind via-holes (5) has a glass transition temperature in the range of 150 ∼ 220 °C, and an epoxy group photosensitive resin composition being used therefor.
A photosensitive resin composition having preferable resolution and heat resistance was found. A multilayer circuit board, of which thermal stress generated in the steps of a reflow process, a gold wire bonding process, and a repairing process in a bare chip mounting process, and peeling off the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses at the heating processes were suppressed, was obtained.
Accordingly, decreasing size and weight of electronic apparatus became possible.
摘要翻译：一种多层电路板，其具有分辨率在25〜80μm范围内的盲孔（5）和宽度比在2.0〜0.6范围内，用于使层彼此接触，其中绝缘层（1 ，2）具有盲通孔（5）的所述层之间的玻璃化转变温度在150〜220℃的范围内，并且使用环氧基感光性树脂组合物。发现具有优选的分辨率和耐热性的感光性树脂组合物。一种多层电路板，其中在回流工艺步骤中产生的热应力，金线接合工艺和裸芯片安装工艺中的修复工艺，以及剥离导体布线和由多层电路板引起的变形获得了加热过程中的机械应力。因此，电子设备的尺寸和重量减小成为可能。

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