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1. 发明授权

EP0873047B1 Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效
标题翻译：绝缘清漆和这些使用的多层印刷电路板的生产
公开(公告)号：EP0873047B1
公开(公告)日：2008-02-13
申请号：EP98106742.4
申请日：1998-04-14
申请人： Hitachi Chemical Co., Ltd.
发明人： Kobayashi, Kazuhito , Kumashiro, Yasushi , Takahashi, Atsushi , Morita, Koji , Tanabe, Takahiro , Yamamoto, Kazunori , Nakaso, Akishi , Arike, Shigeharu , Otsuka, Kazuhisa , Urasaki, Naoyuki , Fujimoto, Daisuke , Takano, Nozomu
IPC分类号： H05K3/46
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952

2. 发明公开

EP1229079A1 Thermosetting resin composition and use thereof 有权
标题翻译： HärtbareHarzzusammensetzung und ihre Verwendung
公开(公告)号：EP1229079A1
公开(公告)日：2002-08-07
申请号：EP02001902.2
申请日：2002-01-30
申请人： Hitachi Chemical Co., Ltd.
发明人： Tsuchikawa, Shinji , Kobayashi, Kazuhito , Mizuno, Yasuyuki , Fujimoto, Daisuke , Takano, Nozomu
IPC分类号： C08L35/06 , C08L63/00 , C08L79/04 , C08L25/00
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II):
wherein R 1 represents hydrogen, a halogen, or a C 1 -C 5 hydrocarbon group; R 2 represents a halogen or a C 1 -C 5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number,
and (2) a cyanate resin having at least two cyanate groups per molecule.
To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译：一种热固性树脂组合物，其包含（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1表示氢，卤素或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数，（2）每分子具有至少2个氰酸酯基的氰酸酯树脂。提供具有低介电常数和低介电损耗因数以及改进的耐热性的印刷线路板材料和用于电子设备的印刷线路板。

3. 发明授权

EP1229079B1 Thermosetting resin composition and use thereof 有权
标题翻译：固化性树脂组合物及其用途
公开(公告)号：EP1229079B1
公开(公告)日：2004-09-01
申请号：EP02001902.2
申请日：2002-01-30
申请人： Hitachi Chemical Co., Ltd.
发明人： Tsuchikawa, Shinji , Kobayashi, Kazuhito , Mizuno, Yasuyuki , Fujimoto, Daisuke , Takano, Nozomu
IPC分类号： C08L35/06 , C08L63/00 , C08L79/04 , C08L25/00
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00

4. 发明公开

EP2546287A1 Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same 审中-公开
标题翻译：热固性从而半互穿复合预浸料坯的树脂组合物和覆金属箔层压板
公开(公告)号：EP2546287A1
公开(公告)日：2013-01-16
申请号：EP12187201.4
申请日：2007-02-14
申请人： Hitachi Chemical Co., Ltd.
发明人： Mizuno, Yasuyuki , Fujimoto, Daisuke , Danjobara, Kazutoshi , Murai, Hikari
IPC分类号： C08J3/24 , C08J5/24 , H05K1/03 , C08L9/00 , C08L71/12
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.
The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

5. 发明授权

EP2407503B1 THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME 有权转让
公开(公告)号：EP2407503B1
公开(公告)日：2020-01-08
申请号：EP11184652.3
申请日：2007-02-14
申请人： Hitachi Chemical Co., Ltd.
发明人： Mizuno, Yasuyuki , Fujimoto, Daisuke , Danjobara, Kazutoshi , Murai, Hikari
IPC分类号： C08J3/24 , C08J5/24 , H05K1/03 , C08L9/00 , C08L71/12

6. 发明公开

EP2407503A1 Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权转让
标题翻译： WärmehärtendeHarzzusammensetzungen aus einem halbdurchdringenden Verbundstoff，Prepreg und metallverkleidete Laminatplatte damit
公开(公告)号：EP2407503A1
公开(公告)日：2012-01-18
申请号：EP11184652.3
申请日：2007-02-14
申请人： Hitachi Chemical Co., Ltd.
发明人： Mizuno, Yasuyuki , Fujimoto, Daisuke , Danjobara, Kazutoshi , Murai, Hikari
IPC分类号： C08J3/24 , C08J5/24 , H05K1/03 , C08L9/00 , C08L71/12
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.
The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译：提供一种可用于制造印刷电路板的热固性树脂组合物，在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并且满足剥离树脂组合物与金属箔之间的强度。本发明涉及含有聚苯醚（A）和丁二烯聚合物（B'）的聚苯醚改性丁二烯预聚物的热固性树脂组合物，其特征在于组分（A）的数均分子量在 7000到30000; 组分（B'）占侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％或更多的单元; 组分（B'）不是其中侧链中的1,2-乙烯基或组分（B'）分子中的一个或两个末端的化学修饰通过转化为环氧，乙二醇，苯酚，马来酸，（甲基）丙烯酸或氨基甲酸酯; 组分（B'）具有交联结构; 以及树脂清漆，预浸料和使用其的金属包层压板。

7. 发明公开

EP0873047A3 Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效
标题翻译：使用相同的制备与绝缘清漆和多层印刷电路板
公开(公告)号：EP0873047A3
公开(公告)日：1999-11-24
申请号：EP98106742.4
申请日：1998-04-14
申请人： HITACHI CHEMICAL CO., LTD.
发明人： Kobayashi, Kazuhito , Kumashiro, Yasushi , Takahashi, Atsushi , Morita, Koji , Tanabe, Takahiro , Yamamoto, Kazunori , Nakaso, Akishi , Arike, Shigeharu , Otsuka, Kazuhisa , Urasaki, Naoyuki , Fujimoto, Daisuke , Takano, Nozomu
IPC分类号： H05K3/46
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

8. 发明公开

EP0873047A2 Production of insulating varnishes and multilayer printed circuit boards using these varnishes 失效
标题翻译：绝缘清漆和这些使用的多层印刷电路板的生产
公开(公告)号：EP0873047A2
公开(公告)日：1998-10-21
申请号：EP98106742.4
申请日：1998-04-14
申请人： HITACHI CHEMICAL CO., LTD.
发明人： Kobayashi, Kazuhito , Kumashiro, Yasushi , Takahashi, Atsushi , Morita, Koji , Tanabe, Takahiro , Yamamoto, Kazunori , Nakaso, Akishi , Arike, Shigeharu , Otsuka, Kazuhisa , Urasaki, Naoyuki , Fujimoto, Daisuke , Takano, Nozomu
IPC分类号： H05K3/46
CPC分类号： H05K3/4655 , C09D5/00 , H05K1/0373 , H05K3/4652 , H05K2201/0209 , H05K2201/0239 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , Y10T428/24994 , Y10T428/249944 , Y10T428/249946 , Y10T428/249952
摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
摘要翻译：绝缘漆包含树脂组分，电绝缘须晶，和如果需要，一种或多种添加剂：如在离子吸附剂，和/或用于通过将所述添加剂加入树脂成分和所述晶须由铜防止损伤，产生的有机试剂或过滤晶须，或通过使用珠磨机或三辊磨，或类似的研磨，是优良的用于生产具有高布线密度，高可靠性和其它电性能优良的多层印刷电路板。

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