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1. 发明公开

EP2670598A1 FLUID EJECTION ASSEMBLY AND RELATED METHODS 有权转让
标题翻译：流体喷射设备及其相关方法
公开(公告)号：EP2670598A1
公开(公告)日：2013-12-11
申请号：EP11857598.4
申请日：2011-01-31
申请人： Hewlett-Packard Development Company, L.P.
发明人： BENGALI, Sadiq , COOK, Galen P. , CUMBIE, Michael W. , MESSENGER, Robert K.
IPC分类号： B41J2/175 , B41J2/045
CPC分类号： B41J2/05 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1628 , B41J2/1645 , B41J2002/14467
摘要： In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.

2. 发明授权

EP3160751B1 FLUID EJECTION STRUCTURE 有权转让
公开(公告)号：EP3160751B1
公开(公告)日：2020-02-12
申请号：EP14747179.1
申请日：2014-06-30
申请人： Hewlett-Packard Development Company, L.P.
发明人： CHUNG, Bradley D. , COOK, Galen P. , HAYES, Michael H. , GHOZEIL, Adam L. , DOMINGUE, Chantelle Elizabeth , MARTY, Valerie J. , FULLER, Anthony M. , CHAFFINS, Sterling
IPC分类号： B41J2/14 , B41J2/16

3. 发明公开

EP3059334A1 RESISTOR 有权转让
标题翻译： WIDERSTAND
公开(公告)号：EP3059334A1
公开(公告)日：2016-08-24
申请号：EP16164277.2
申请日：2011-10-14
申请人： Hewlett-Packard Development Company, L.P.
发明人： COOK, Galen P. , CHUNG, Bradley D.
IPC分类号： C23F1/02 , B41J2/14 , B41J2/145
CPC分类号： B41J2/1626 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2002/0055 , B41J2002/14387 , H05B3/00 , H05B2203/013 , H05B2203/017
摘要： The invention relates, inter alia, to an apparatus comprising:
an electrically conductive material layer (204) forming an electrically conductive trace (78, 80) terminating at an end (86) and continuously extending between a first edge (94) and a second edge (94) opposite the first edge (94);
an electrically resistive material layer (214) over and electrically connected to the electrically conductive material layer (204), the electrically resistive material layer (214) forming a resistor (54) having an array of spaced resistor heating elements (76) overlying the electrically resistive material layer (204) between the first edge (94) in the second edge (94), the spaced resistor heating elements (76) projecting beyond the end of the electrically conductive trace (78, 80) out of contact with the electrically conductive material layer (204).
摘要翻译：本发明尤其涉及一种装置，包括：导电材料层（204），其形成终止于端部（86）处并在第一边缘（94）和第二边缘（94）之间连续延伸的导电迹线（78,80）边缘（94）与第一边缘（94）相对; 电导材料层（214），其电连接到导电材料层（204）上，电阻材料层（214）形成电阻器（54），该电阻器具有覆盖在电学上的间隔开的电阻加热元件（76）在第二边缘（94）中的第一边缘（94）之间的电阻材料层（204），突出超过导电迹线（78,80）的端部的间隔开的电阻器加热元件（76）与导电材料层（204）。

4. 发明授权

EP2766509B1 RESISTOR 有权
公开(公告)号：EP2766509B1
公开(公告)日：2016-06-08
申请号：EP11874010.9
申请日：2011-10-14
申请人： Hewlett-Packard Development Company, L.P.
发明人： COOK, Galen P. , CHUNG, Bradley D.
IPC分类号： C23F1/02 , B41J2/14 , B41J2/145
CPC分类号： B41J2/1626 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2002/0055 , B41J2002/14387 , H05B3/00 , H05B2203/013 , H05B2203/017

5. 发明授权

EP2595812B1 THERMAL RESISTOR FLUID EJECTION ASSEMBLY 有权
标题翻译：液体喷射装置，用于热敏电阻
公开(公告)号：EP2595812B1
公开(公告)日：2015-09-23
申请号：EP10855113.6
申请日：2010-07-23
申请人： Hewlett-Packard Development Company, L.P.
发明人： CHUNG, Bradley D. , COOK, Galen P. , FRADL, Daniel
IPC分类号： B41J2/345 , B41J2/355 , B41J2/32
CPC分类号： B41J2/05 , B41J2/1412 , B41J2/14129 , B41J2/1606 , B41J2002/14177

6. 发明公开

EP2766509A1 RESISTOR 有权
标题翻译：阻力
公开(公告)号：EP2766509A1
公开(公告)日：2014-08-20
申请号：EP11874010.9
申请日：2011-10-14
申请人： Hewlett-Packard Development Company, L.P.
发明人： COOK, Galen P. , CHUNG, Bradley D.
IPC分类号： C23F1/02 , B41J2/14 , B41J2/145
CPC分类号： B41J2/1626 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2002/0055 , B41J2002/14387 , H05B3/00 , H05B2203/013 , H05B2203/017
摘要： A method and apparatus provide a resistor electrically connected to an electrically conductive trace.

7. 发明公开

EP2595812A1 THERMAL RESISTOR FLUID EJECTION ASSEMBLY 有权
标题翻译：热阻流体喷射组件
公开(公告)号：EP2595812A1
公开(公告)日：2013-05-29
申请号：EP10855113.6
申请日：2010-07-23
申请人： Hewlett-Packard Development Company, L.P.
发明人： CHUNG, Bradley D. , COOK, Galen P. , FRADL, Daniel
IPC分类号： B41J2/345 , B41J2/355 , B41J2/32
CPC分类号： B41J2/05 , B41J2/1412 , B41J2/14129 , B41J2/1606 , B41J2002/14177
摘要： A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.
摘要翻译：一种热阻流体喷射组件，包括绝缘基底以及形成在基底上的第一和第二电极。具有不同宽度的多个单独的电阻器元件平行地布置在衬底上并且在第一端处电连接到第一电极并且在第二端处电连接到第二电极。

8. 发明公开

EP3710228A1 ADDITIVE MANUFACTURING WITH NOZZLES AT DIFFERENT DIE WIDTHS 审中-公开
公开(公告)号：EP3710228A1
公开(公告)日：2020-09-23
申请号：EP18909607.6
申请日：2018-03-12
申请人： Hewlett-Packard Development Company, L.P.
发明人： PRZYBYLA, James R. , HOWER, Jason , MONROE, Michael G. , COOK, Galen P.
IPC分类号： B29C64/209 , B29C64/30 , B33Y30/00

9. 发明授权

EP3059334B1 RESISTOR 有权转让
公开(公告)号：EP3059334B1
公开(公告)日：2019-07-03
申请号：EP16164277.2
申请日：2011-10-14
申请人： Hewlett-Packard Development Company, L.P.
发明人： COOK, Galen P. , CHUNG, Bradley D.
IPC分类号： C23F1/02 , B41J2/14 , B41J2/145

10. 发明授权

EP2670598B1 FLUID EJECTION ASSEMBLY AND RELATED METHODS 有权转让
公开(公告)号：EP2670598B1
公开(公告)日：2019-07-03
申请号：EP11857598.4
申请日：2011-01-31
申请人： Hewlett-Packard Development Company, L.P.
发明人： BENGALI, Sadiq , COOK, Galen P. , CUMBIE, Michael W. , MESSENGER, Robert K.
IPC分类号： B41J2/175 , B41J2/045

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