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1. 发明公开

EP3185363A1 PROCESS FOR ELECTRICALLY CONTACTING A COATED LEAD WITH A LAYER 有权
标题翻译：将涂覆的铅与层电接触的方法
公开(公告)号：EP3185363A1
公开(公告)日：2017-06-28
申请号：EP15202412.1
申请日：2015-12-23
申请人： Heraeus Deutschland GmbH & Co. KG
发明人： Keitel, Oliver , Trötzschel, Jens , Schibli, Stefan
IPC分类号： H01R4/24 , H01R4/20 , H01R13/03 , H01R24/58
摘要： In general, the present invention relates generally to a process for electrically contacting a coated lead (100a). More specifically, the invention relates to a process, an electrically contacted lead and a medical device (50) comprising an electrically contacted lead (100d). The present invention relates to a process for electrically contacting a coated lead comprising the following steps:
a. Providing a coated lead (100a) comprising an electrically conductive core (102) and an electrically insulating coating (101);
b. Providing a via hole (103) in the electrically insulating coating (101) in order to expose a section of the electrically conductive core (102);
c. Applying a first electrically conductive material (104) to the coated lead (100b) such that it contacts at least a part of the exposed section of the electrically conductive core via the via hole;
d. Applying a further electrically conductive material (105) to the coated lead (100d) such that it contacts at least a part of the first conductive material (104).
摘要翻译：总的来说，本发明一般涉及用于电接触涂覆的引线（100a）的方法。更具体地说，本发明涉及一种方法，电接触引线和包括电接触引线（100d）的医疗装置（50）。本发明涉及一种用于电接触涂覆的铅的方法，包括以下步骤：a。提供包括导电芯（102）和电绝缘涂层（101）的涂覆引线（100a）; 湾在电绝缘涂层（101）中提供通孔（103）以露出导电芯（102）的一部分; C。将第一导电材料（104）施加到涂覆引线（100b），使得其经由通孔接触导电芯的暴露部分的至少一部分; d。向涂覆的引线（100d）施加另外的导电材料（105），使得其接触第一导电材料（104）的至少一部分。

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