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1. 发明公开

EP2801802A1 Spectroscopy module 审中-公开
标题翻译： Spektroskopiemodul
公开(公告)号：EP2801802A1
公开(公告)日：2014-11-12
申请号：EP14173959.9
申请日：2008-06-10
申请人： Hamamatsu Photonics K.K.
发明人： Shibayama, Katsumi , Yokino, Takafumi , Suzuki, Tomofumi , Teichmann, Helmut , Hiller, Dietmar , Starker, Ulrich
IPC分类号： G01J3/02 , G01J3/18
CPC分类号： G01J3/18 , G01J3/02 , G01J3/0205 , G01J3/0208 , G01J3/0237 , G01J3/0259 , G01J3/0291
摘要： A spectroscopy module comprises a light transmitting portion for transmitting light made incident upon a plane of the light transmitting portion. The spectroscopy module further comprises a spectroscopic portion which is provided on a convex surface of the light transmitting portion, opposite the plane, to disperse light transmitted through the light transmitting portion and reflect said light towards the plane. The spectroscopy module further comprises a light detecting element which is provided on the plane to detect light dispersed and reflected by the spectroscopic portion. The spectroscopic portion comprises a diffracting layer formed along the convex surface of the light transmitting portion, a reflecting layer formed on a surface of the diffracting layer, and a peripheral edge portion formed on the convex surface of the light transmitting portion. The peripheral edge portion is formed integrally with the diffracting layer, and by using a same material as that of the diffracting layer, so as to enclose a periphery of the diffracting layer.
摘要翻译：光谱模块包括用于透射入射在光透射部分的平面上的光的光透射部分。光谱模块还包括分光部分，其设置在透光部分的与平面相对的凸表面上，以分散透过透光部分的光并将光反射到平面。光谱模块还包括光检测元件，其设置在平面上以检测由分光部分分散和反射的光。分光部包括沿着透光部的凸面形成的衍射层，形成在衍射层的表面上的反射层和形成在透光部的凸面上的周缘部。周边部分与衍射层一体形成，并且通过使用与衍射层相同的材料，以包围衍射层的周边。

2. 发明公开

EP4033222A1 SURFACE-ENHANCED RAMAN SCATTERING UNIT 无效
公开(公告)号：EP4033222A1
公开(公告)日：2022-07-27
申请号：EP22162962.9
申请日：2013-08-09
申请人： Hamamatsu Photonics K.K.
发明人： Ito, Masashi , Shibayama, Katsumi , Kawai, Toshimitsu , Ofuji, Kazuto , Oyama, Hiroki , Maruyama, Yoshihiro , Yokino, Takafumi , Hirose, Masaki , Yoshida, Anna
IPC分类号： G01N21/65 , B82Y15/00 , B82Y40/00 , G01N21/01
摘要： A SERS unit 1A comprises an integrally formed handling board 2 and a SERS element 3 secured within a container space S provided in the handling board 2 so as to open to one side in a thickness direction of the handling board 2. The SERS element 3 has a substrate 5 arranged on an inner surface S1 of the container space S and an optical function part 10 formed on the substrate 5, for generating surface-enhanced Raman scattering.

3. 发明公开

EP3964810A1 SPECTROSCOPE 审中-公开
公开(公告)号：EP3964810A1
公开(公告)日：2022-03-09
申请号：EP21203666.9
申请日：2015-02-03
申请人： Hamamatsu Photonics K.K.
发明人： Yokino, Takafumi , Shibayama, Katsumi , Kato, Katsuhiko
IPC分类号： G01J3/02 , G01J3/18
摘要： A spectrometer 1A includes a package 2 having a stem 4 and a cap 5, an optical unit 10A disposed on the stem 4, and a lead pin 3 for securing the optical unit 10A to the stem 4. The optical unit 10A includes a dispersive part 21 for dispersing and reflecting light entering from a light entrance part 6 of the cap 5, a light detection element 30 having a light detection part 31 for detecting the light dispersed and reflected by the dispersive part 21, a support 40 for supporting the light detection element 30 such that a space is formed between the dispersive part 21 and the light detection element 30, and a projection 11 protruding from the support 40, the lead pin 3 being secured to the projection 11. The optical unit 10A is movable with respect to the stem 4 in a contact part of the optical unit 10A and the stem 4.

4. 发明公开

EP3875930A1 SPECTROSCOPE AND METHOD FOR PRODUCING SPECTROSCOPE 审中-公开
公开(公告)号：EP3875930A1
公开(公告)日：2021-09-08
申请号：EP21169336.1
申请日：2015-02-03
申请人： Hamamatsu Photonics K.K.
发明人： Yokino, Takafumi , Shibayama, Katsumi
IPC分类号： G01J3/02 , G01J3/18 , G01J3/28 , G01J3/36
摘要： A spectrometer 1A includes a light detection element 20 having a substrate 24 made of a semiconductor material, a light passing part 21 provided in the substrate 24, and a light detection part 22 put in the substrate 24, a support 30 having a base wall part 31 opposing the light detection element 20, and side wall parts 32 and 33 integrally formed with the base wall part 31, the light detection element 20 being fixed to the side wall parts 32 and 33, the support being provided with a wiring 13 electrically connected to the light detection part 22, and a dispersive part 40 provided on a surface 31a of the base wall part 31 on a side of a space S. An end part 13a of the wiring 13 is connected to a terminal 25 of the light detection element 20. An end part 13b of the wiring 13 is positioned on a surface 31b in the base wall part 31 on an opposite side from the side of the space S.

5. 发明公开

EP3351912A1 SPECTROMETER, AND SPECTROMETER PRODUCTION METHOD 有权
公开(公告)号：EP3351912A1
公开(公告)日：2018-07-25
申请号：EP18159898.8
申请日：2015-02-03
申请人： Hamamatsu Photonics K.K.
发明人： Yokino, Takafumi , Shibayama, Katsumi
IPC分类号： G01J3/02 , G01J3/18 , G01J3/36 , G01J3/04
CPC分类号： G01J3/0256 , G01J3/021 , G01J3/0286 , G01J3/0289 , G01J3/0291 , G01J3/04 , G01J3/18 , G01J3/36
摘要： A spectrometer comprises a light detection element provided with a light passing part (21) and a light detection part (22); a support (30) fixed to the light detection element such that a space (S) is formed between the light passing part and the support; a first reflection part (11) provided in the support and configured to reflect light passing through the light passing part in the space; a dispersive part (42) provided in the light detection element and configured to disperse and reflect the light reflected by the first reflection part in the space; and a second reflection part (41) provided in the support and configured to reflect the light dispersed and reflected by the dispersive part to the light detection part in the space.

6. 发明公开

EP1930757A1 Optical waveguide chip and method of manufacturing the same 审中-公开
标题翻译： Optischer Wellenleiterchip und Herstellungsverfahrendafür
公开(公告)号：EP1930757A1
公开(公告)日：2008-06-11
申请号：EP08003128.9
申请日：2005-04-21
申请人： Hamamatsu Photonics K.K.
发明人： Yokino, Takafumi , Shibayama, Katsumi
IPC分类号： G02B6/13 , G02B6/122
CPC分类号： G02B6/30 , G02B6/13 , G02B2006/12147 , Y10T83/04
摘要： The present invention relates to an optical waveguide chip, etc., having a structure for effectively avoiding or suppressing peeling of an optical waveguide layer in a process of cutting a wafer. The optical waveguide chip comprises a substrate having a main surface, and an optical waveguide layer formed on the main surface of the substrate. The optical waveguide layer comprises a cladding portion and a core portion that is disposed inside the cladding portion and that has a higher refractive index than the cladding portion, and at least one of side surfaces of the optical waveguide layer is positioned at a predetermined distance toward a center of the main surface from an edge of the main surface. This arrangement includes an arrangement having a thin film portion at a peripheral region that includes the edge of the main surface. In the case that the optical waveguide layer has the thin film portion at its periphery, the optical waveguide layer has a side surface that coincide with the side surface of the substrate including the edge of the main surface and a side surface that is separated by a predetermined distance from edge of the main surface. By this arrangement, when cutting a wafer into chip units, even if chipping occurs at an edge of the main surface of the substrate to be cut, peeling of the optical waveguide layer, formed on the substrate, is suppressed effectively.
摘要翻译：本发明涉及一种具有在切割晶片的过程中有效地避免或抑制光波导层的剥离的结构的光波导芯片等。光波导芯片包括具有主表面的基板和形成在基板的主表面上的光波导层。光波导层包括包层部分和芯部分，该芯部分设置在包层部分内部并且具有比包层部分更高的折射率，并且光波导层的至少一个侧表面位于预定距离处主表面的中心从主表面的边缘。这种布置包括在包括主表面的边缘的周边区域具有薄膜部分的布置。在光波导层的周边具有薄膜部的情况下，光波导层具有与包含主面的边缘的基板的侧面重合的侧面和由从主表面的边缘预定的距离。通过这样的结构，即使在切割晶片成为芯片单元时，即使在要切割的基板的主表面的边缘处发生切屑，也有效地抑制了形成在基板上的光波导层的剥离。

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