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    • 4. 发明公开
    • METHOD FOR PROCESSING DATA IN THE ETHERNET, PHYSICAL LAYER CHIP AND ETHERNET DEVICE
    • 程序在以太网数据处理,芯片,带有物理层和以太网设备
    • EP2975858A1
    • 2016-01-20
    • EP13870025.7
    • 2013-01-04
    • Huawei Technologies Co., Ltd.
    • SU, WeiZENG, LiCUI, Kai
    • H04Q11/00
    • H04L1/0041G06F11/10H04L1/0045H04L1/0057H04L25/14H04L25/49
    • Embodiments of the present invention disclose an Ethernet data processing method, an Ethernet physical layer chip, and Ethernet equipment. Applicable to data processing at a transmit end, the method includes: performing line coding on data from a media access control layer, so as to obtain serial data code blocks; performing forward error correction FEC coding on the serial data code blocks, so as to obtain FEC frames, which specifically includes: inserting Y check bits every X consecutive data bits, where the Y check bits are generated when FEC coding is performed on the X consecutive data bits; and distributing, at a distribution granularity of a bits, the FEC frames successively to N virtual channels, where a and N are both positive integers, and a is less than a quantity of bits included in one FEC frame. The method, the Ethernet physical layer chip, and the Ethernet equipment provided by the embodiments of the present invention may provide different FEC coding gains according to different requirements, and latency introduced due to FEC processing is very small.
    • 本发明的实施例公开于以太网数据处理方法,以太网物理层芯片,和以太网设备。 适用于数据处理在发送端,该方法包括:对从媒体访问控制层数据进行线路编码,以便获得串行数据的码块; 上的串行数据的码块执行前向纠错FEC编码,以得到FEC帧,具体包括:将每一个X连续数据比特,其中产生在Y校验位当FEC编码在X个连续执行的ÿ校验位 数据位; 和分配,在比特分配粒度,所述FEC帧依次为N的虚拟信道,其中,N为正整数两者,并且a是小于比特的数量包括在一个FEC帧。 的方法,所述以太网物理层芯片,并且通过本发明的实施例提供可以不同的要求提供不同的FEC编码增益gemäß以太网设备,和等待时间引入由于FEC处理非常小。
    • 7. 发明公开
    • LASER MEASUREMENT MODULE AND LASER RADAR
    • EP3851878A1
    • 2021-07-21
    • EP19905208.5
    • 2019-12-28
    • HUAWEI TECHNOLOGIES CO., LTD.
    • SHI, GuangyuanZENG, LiXIAO, Xinhua
    • G01S17/08G01S7/481
    • Embodiments of this application disclose a laser measurement module and a laser radar, and the laser measurement module and the laser radar may be used in fields such as autonomous driving and intelligent driving. In the laser measurement module, N laser ranging components each are configured to emit an emergent light beam onto a reflector. The reflector is configured to perform optical path reflecting on the emergent light beam, and emit the reflected emergent light beam onto an MEMS micromirror. The MEMS micromirror is configured to change a direction of the emergent light beam to implement two-dimensional scanning; and further configured to change a direction of an echo light beam, and emit the echo light beam onto the reflector, where the echo light beam is a light beam reflected by the emergent light beam emitted onto a target object. The reflector is further configured to perform optical path reflecting on the echo light beam, and emit the reflected echo light beam onto each of the N laser ranging components. The N laser ranging components each are further configured to receive the echo light beam, and perform ranging based on a time difference between the emergent light beam and the echo light beam.
    • 8. 发明公开
    • OPTICAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREFOR
    • EP3617763A1
    • 2020-03-04
    • EP17910824.6
    • 2017-05-23
    • Huawei Technologies Co., Ltd.
    • DONG, ZhenLIU, JunZENG, LiZHAO, QingSONG, Xiaolu
    • G02B6/42
    • This application discloses a module structure and a fabrication method therefor. The optical module structure includes: a substrate; an optical chip and an electrical chip that are fixedly connected to the substrate; and an optical coupling structure fixedly connected to the optical chip. A side that is of the optical chip and that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane; and the optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark. A hybrid encapsulation manner is used for the optical module structure, so that encapsulation density of the optical module structure is increased, and channels of the optical module structure are increased when an area is the same, to support an optical interconnection for a large amount of data. In addition, a passive alignment manner that is convenient and quick is used for the optical module structure, so that an error caused by manual alignment is avoided, and alignment precision is relatively high.
    • 9. 发明公开
    • ELECTRO-OPTIC MODULATOR
    • EP3477362A1
    • 2019-05-01
    • EP16909229.3
    • 2016-07-21
    • Huawei Technologies Co., Ltd.
    • LI, YanboSONG, XiaoluDONG, ZhenJI, RuiqiangFU, ShengmengZENG, Li
    • G02F1/015
    • An electro-optic modulator includes an input waveguide (11), a beam splitter (12) connected to the input waveguide (11), a modulation arm that is disposed on each branch of the beam splitter (12) and that is configured to modulate a signal. Each modulation arm is correspondingly disposed with a double-layer electrode, a first layer electrode (21) of the double-layer electrode is a high-frequency traveling wave electrode that is configured to change carrier concentration in the modulation arm, a second layer electrode (26) is a direct current electrode having an inductor function, and an inductor formed in the second layer electrode (26) is connected to a high-frequency traveling wave electrode of the electro-optic modulator. The second layer electrode (26) uses a direct current electrode that can form an inductor. In this way, the electro-optic modulator has some functions of a bias tee, so that integration of the electro-optic modulator can be further improved without affecting performance of the electro-optic modulator, high-density packaging layout difficulty and cabling pressure can be effectively reduced, and cabling and packaging of a multi-channel high-speed signal on a base board can be implemented.