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1. 发明公开

EP2741594A4 BACKPLANE, CABINET-GRADE COMMUNICATION DEVICE, AND BACKPLANE REPLACEMENT METHOD 审中-公开
标题翻译：背板，客舱通信设备和方法，用于改变后面板BOARD
公开(公告)号：EP2741594A4
公开(公告)日：2015-06-17
申请号：EP13770617
申请日：2013-04-07
申请人： HUAWEI TECH CO LTD
发明人： BAI LEI , AO FENG , LUO FEI
IPC分类号： H05K7/14
CPC分类号： H05K7/1451 , H05K7/1441 , H05K7/1445
摘要： Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, relate to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board. The backplane is fixed and arranged in a detachable manner on the rear board or the front board and can be plugged or unplugged along with the rear board that fixes the backplane or the front board that fixes the backplane. The rear board is connected to the front board in an orthogonal connection manner through the backplane.

2. 发明公开

EP2760262A4 COOLING SYSTEM 有权转让
公开(公告)号：EP2760262A4
公开(公告)日：2015-06-17
申请号：EP13795983
申请日：2013-04-27
申请人： HUAWEI TECH CO LTD
发明人： HAO MINGLIANG , DONG YUAN , BAI LEI
IPC分类号： H05K7/20
CPC分类号： H05K7/20572
摘要： The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture, thereby breaking through temperature concatenation between an upper component and a lower component, saving a heat conducting space, and improving a heat dissipation capability of the system.

3. 发明公开

EP2945470A4 ELECTRONIC DEVICE, ELECTRONIC SYSTEM AND CIRCUIT BOARD INTERCONNECTION ARCHITECTURE THEREOF 有权
标题翻译：电子器件，电子系统和电路板的连接架构THEREFOR
公开(公告)号：EP2945470A4
公开(公告)日：2016-05-04
申请号：EP13874793
申请日：2013-08-07
申请人： HUAWEI TECH CO LTD
发明人： BAI LEI , LIU XIONGBIAO , PENG LEXIONG
IPC分类号： H01R12/73 , H05K1/14 , H05K3/36
CPC分类号： H05K3/366 , H01R12/722 , H01R12/737 , H05K1/117 , H05K1/14 , H05K2201/044 , H05K2201/09063 , H05K2201/09163 , H05K2201/10189

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