专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2524763A4 SOLDER PASTE 有权转让
标题翻译：锡膏
公开(公告)号：EP2524763A4
公开(公告)日：2016-10-05
申请号：EP10835925
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

2. 发明公开

EP2511043A4 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 有权转让
标题翻译：助焊剂焊膏焊膏和
公开(公告)号：EP2511043A4
公开(公告)日：2016-06-29
申请号：EP10835926
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

3. 发明公开

EP2243592A4 SOLDER BONDING STRUCTURE AND SOLDERING FLUX 有权
标题翻译： LÖTBINDUNGSSTRUKTURUNDLÖTFLUSSMITTEL
公开(公告)号：EP2243592A4
公开(公告)日：2017-06-21
申请号：EP09712255
申请日：2009-02-19
申请人： HARIMA CHEMICALS INC
发明人： AIHARA MASAMI
IPC分类号： B23K35/363 , B23K1/00 , B23K3/00 , B23K35/02 , B23K35/36 , H05K3/34
CPC分类号： B23K1/0016 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , C21D2251/00 , H05K3/3442 , H05K3/3484 , H05K3/3489 , H05K2201/068 , Y02P10/212
摘要： Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than -40°C, or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10 -6 /K or less of linear thermal expansion coefficient within a temperature range from -40°C to the softening temperature of the flux residue.
摘要翻译：本发明公开了一种焊料结合结构，即使在温差非常大的恶劣环境下也能够保持足够的焊料结合强度并确保高结合可靠性。在焊料接合结构中，电子部件4安装在具有电极部2和绝缘膜3的基板的主表面1a上，并且电极部2和电子部件4通过焊料彼此电接合在电子部件4与绝缘膜3之间存在从焊料部5渗出的助焊剂残留物6.焊剂含有丙烯酸树脂，活化剂和具有羟基的触变剂。丙烯酸树脂的玻璃化转变点不高于-40℃或不低于助熔剂残余物的软化温度。在助焊剂残渣的-40℃至软化温度的温度范围内，助熔剂残留物具有300×10 -6 / K以下的线性热膨胀系数的最大值。

4. 发明公开

EP2223771A4 FLUX FOR SOLDERING AND SOLDERING PASTE COMPOSITION 审中-公开
标题翻译：助焊剂焊接和锡膏
公开(公告)号：EP2223771A4
公开(公告)日：2012-09-26
申请号：EP08855551
申请日：2008-11-25
申请人： HARIMA CHEMICALS INC
发明人： ISHIKAWA SHUNSUKE , SHINOZUKA AKIRA , AIHARA MASAMI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/362 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/0244 , B23K35/025 , B23K35/362 , B23K2201/36 , H05K3/3489

5. 发明公开

EP2221140A4 FLUX FOR SOLDERING, SOLDERING PASTE COMPOSITION, AND METHOD OF SOLDERING 有权
标题翻译：助焊剂焊接锡膏焊接和
公开(公告)号：EP2221140A4
公开(公告)日：2011-08-03
申请号：EP08854783
申请日：2008-11-25
申请人： HARIMA CHEMICALS INC
发明人： ISHIKAWA SHUNSUKE , SHINOZUKA AKIRA , AIHARA MASAMI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/36 , B23K35/362 , H05K3/34
CPC分类号： B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , H05K3/3489

6. 发明公开

EP0443030A4 SOLDERING FLUX 失效
标题翻译：焊接金属
公开(公告)号：EP0443030A4
公开(公告)日：1993-07-07
申请号：EP90912077
申请日：1990-08-08
申请人： NIPPONDENSO CO., LTD. , HARIMA CHEMICALS, INC.
发明人： TAKEMOTO MASANORI , ONISHI TATSUSHI , AIHARA MASAMI
IPC分类号： B23K35/363 , B23K35/36
CPC分类号： B23K35/3613

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式