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    • 10. 发明公开
    • VERFAHREN ZUR ERZEUGUNG EINER MIKROSTRUKTUR AUF EINEM TRÄGER
    • VERFAHREN ZUR ERZEUGUNG EINER MIKROSTRUKTUR AUF EINEMTRÄGER
    • EP2566703A1
    • 2013-03-13
    • EP11719473.8
    • 2011-05-05
    • Giesecke & Devrient GmbH
    • HOFFMÜLLER, WinfriedBURCHARD, TheodorRAHM, MichaelSCHINABECK, JosefHEIM, ManfredRAUCH, AndreasFUHSE, Christian
    • B42D15/00B42D15/10
    • B32B38/10B42D25/21B42D25/29B42D25/324B42D25/328B42D25/342B42D25/425B42D25/47B42D2035/44B44C1/1737
    • The present invention relates to a method for producing a microstructure (40, 41) on a carrier (45, 46), comprising the following steps: (a) producing a donor film (20) by forming an embossing structure having elevations and depressions in a first film material (21) and applying a transfer layer (30, 31, 32) to the embossing structure, (b) producing an acceptor film (50) by applying an adhesive layer (53, 54, 55) to a second film material (51), (c) laminating the donor film (20) and the acceptor film (50) by means of the adhesive layer (53, 54, 55), wherein the transfer layer adhesively bonds on the elevations of the embossing structure by means of the adhesive layer (53, 54, 55) and (d) transferring the adhesively bonded regions of the transfer layer (30, 31, 32) onto the acceptor film (50) by separating the donor film (20) and the acceptor film (50) from one another, as a result of which, in the acceptor film (50), a first microstructure (40) is formed from the transferred regions of the transfer layer, and/or a second microstructure (41) complementary to the first microstructure (40) is formed in the donor film (20). The invention additionally relates to the use of the microstructure carriers obtainable according to the method as part of a security element (5), and also to security elements (5) comprising a microstructure carrier obtainable according to the method according to the invention, and products (1) protected by the security element (5).
    • 一种用于在载体上制造微结构的方法,其特征在于:(a)通过在第一箔材料中形成具有凸起和凹陷的压花结构并在压花结构上施加转印层来制造供体箔,(b)通过 将粘合剂层施加到第二箔材料上,(c)通过粘合剂层层叠施主箔和受主箔,将压印结构的高度上的转印层粘合到粘合剂层上,以及(d) 通过将供体箔和受主箔彼此分离,从而在转移膜上形成来自转移层的转移区域的第一微结构和/或在供体箔a中形成的转移层的接合区 第二微结构与第一微结构互补。