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    • 2. 发明公开
    • Protected article having a layered protective structure overlying a substrate
    • Gesicherter Artikel mit einergeschütztenSchichtstruktur
    • EP1627937A3
    • 2006-06-14
    • EP05254897.1
    • 2005-08-05
    • General Electronic Company
    • Gorman, Mark DanielDarolia, Ramgopal
    • C23C28/00C23C4/08C23C4/10
    • A protected article has a substrate (30) and a protective structure (33) overlying a surface (32) of the substrate (30). The protective structure (33) includes a protective layer (34) overlying the surface (32) of the substrate (30) and having an aluminum content greater than that of the substrate (30), and a bond-coat layer (40) of a bond-coat-layer metal. The bond-coat-layer metal has a bond-coat initial composition having at least about 60 percent by weight platinum, rhodium, palladium, or combinations thereof. There may be a diffusion-barrier layer between the surface (32) of the substrate (30) and the protective layer (34), and there may be a ceramic thermal barrier coating overlying the bond-coat layer (40).
    • 受保护制品具有覆盖在衬底(30)的表面(32)上的衬底(30)和保护结构(33)。 保护结构(33)包括覆盖在基板(30)的表面(32)上并具有大于基板(30)的铝含量的铝含量的保护层(34),以及粘合涂层 粘结层层金属。 键合层层金属具有至少约60重量%的铂,铑,钯或其组合的键层初始组成。 在基板(30)的表面(32)和保护层(34)之间可能存在扩散阻挡层,并且可以存在覆盖在粘合涂层(40)上的陶瓷热障涂层。
    • 3. 发明公开
    • Protected article having a layered protective structure overlying a substrate
    • 被保护物品具有覆盖在基底上的分层保护结构
    • EP1627937A2
    • 2006-02-22
    • EP05254897.1
    • 2005-08-05
    • General Electronic Company
    • Gorman, Mark DanielDarolia, Ramgopal
    • C23C28/00C23C4/08C23C4/10
    • A protected article has a substrate (30) and a protective structure (33) overlying a surface (32) of the substrate (30). The protective structure (33) includes a protective layer (34) overlying the surface (32) of the substrate (30) and having an aluminum content greater than that of the substrate (30), and a bond-coat layer (40) of a bond-coat-layer metal. The bond-coat-layer metal has a bond-coat initial composition having at least about 60 percent by weight platinum, rhodium, palladium, or combinations thereof. There may be a diffusion-barrier layer between the surface (32) of the substrate (30) and the protective layer (34), and there may be a ceramic thermal barrier coating overlying the bond-coat layer (40).
    • 受保护物品具有衬底(30)和覆盖衬底(30)的表面(32)的保护结构(33)。 所述保护结构(33)包括覆盖所述基板(30)的所述表面(32)且铝含量大于所述基板(30)的表面的保护层(34),以及 粘合涂层金属。 该粘合层金属具有粘合层初始组合物,其具有至少约60重量%的铂,铑,钯或其组合。 在基底(30)的表面(32)和保护层(34)之间可以存在扩散阻挡层,并且可以存在覆盖粘合层(40)的陶瓷热障涂层。