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    • 4. 发明公开
    • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    • REINIGUNGSFORMULIERUNG ZUR ENTFERNUNG VONRÜCKSTÄNDENAUFOBERFLÄCHEN
    • EP3104398A1
    • 2016-12-14
    • EP16178830.2
    • 2014-12-03
    • Fujifilm Electronic Materials USA, Inc.
    • TAKAHASHI, TomonoriDU, BingWOJTCZAK, William A.DORY, ThomasKNEER, Emil A.
    • H01L21/311
    • This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one second chelating agent different from the first chelating agent, the second chelating agent containing at least two nitrogen-containing groups; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 5) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 6) water; and 7) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    • 本公开涉及一种清洁组合物,其包含1)至少一种氧化还原剂; 2)至少一种第一螯合剂,所述第一螯合剂是聚氨基多羧酸; 3)与第一螯合剂不同的至少一种第二螯合剂,所述第二螯合剂含有至少两个含氮基团; 4)至少一种金属腐蚀抑制剂,金属缓蚀剂为取代或未取代的苯并三唑; 5)至少一种选自水溶性醇,水溶性酮,水溶性酯和水溶性醚的有机溶剂; 6)水; 和7)任选的至少一种pH调节剂,所述pH调节剂是不含金属离子的碱。 本公开还涉及使用上述组合物来清洁半导体衬底的方法。
    • 5. 发明公开
    • CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    • 清洁剂清除表面残留物
    • EP3077129A1
    • 2016-10-12
    • EP14867771.9
    • 2014-12-03
    • FujiFilm Electronic Materials USA, Inc.
    • TAKAHASHI, TomonoriDU, BingWOJTCZAK, William A.DORY, ThomasKNEER, Emil A.
    • B08B3/04C11D7/60
    • This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one second chelating agent different from the first chelating agent, the second chelating agent containing at least two nitrogen-containing groups; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 5) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 6) water; and 7) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    • 本公开涉及一种清洁组合物,其包含1)至少一种氧化还原剂; 2)至少一种第一螯合剂,第一螯合剂是聚氨基多羧酸; 3)至少一种不同于第一螯合剂的第二螯合剂,第二螯合剂含有至少两个含氮基团; 4)至少一种金属腐蚀抑制剂,所述金属腐蚀抑制剂为取代或未取代的苯并三唑; 5)至少一种选自水溶性醇,水溶性酮,水溶性酯和水溶性醚的有机溶剂; 6)水; 和7)任选地,至少一种pH调节剂,该pH调节剂是不含金属离子的碱。 本公开还涉及使用上述组合物来清洁半导体衬底的方法。