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1. 发明公开

EP0993034A3 Method for bonding bumped electronic components to a substrate 审中-公开
标题翻译：一种用于在基板上以冲焊的电子部件的方法
公开(公告)号：EP0993034A3
公开(公告)日：2001-01-31
申请号：EP99307383.2
申请日：1999-09-17
申请人： Ford Motor Company
发明人： Nuno, Rose Lynda , Pham, Cuong Van , Todd, Michael George
IPC分类号： H01L21/60 , H01L21/603
CPC分类号： H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/81191 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H05K3/328 , H01L2924/00 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684
摘要： There is disclosed herein a method for bonding an electronic component 10 having bump terminations 14 on a surface thereof to a dielectric substrate 20 having a plurality of copper mounting pads 22, comprising the steps of: (a) providing the component 10 and the substrate 20; (b) depositing a layer of silver 30 atop each copper mounting pad 22, thereby forming a plurality of silvered pads 40; (c) positioning the component atop the substrate such that each bump termination 14 is registered atop a respective one of the silvered pads 40; and (d) bonding the bump terminations to their respective silvered pads by solid-to-solid diffusion bonding, such as by thermocompression bonding.

2. 发明公开

EP0930645A2 Solderless flip-chip assembly and method and material for same 审中-公开
标题翻译： LotlöserFlip-Chip-Zusammenbau und Verfahren und Materialdafür
公开(公告)号：EP0930645A2
公开(公告)日：1999-07-21
申请号：EP98309071.3
申请日：1998-11-05
申请人： Ford Motor Company
发明人： Belke, Robert Edward Jr. , Hayden, Brian John , Pham, Cuong Van , Nuno, Rosa Lynda , Todd, Michael George
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/1134 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.
摘要翻译：一种用于将半导体电子倒装芯片器件组装到电气互连衬底的无焊接方法，包括形成多个凸起的电触点和多个接触焊盘的步骤。焊盘的数量和物理位置与电触点对应。垫片和接触配合在一起时。在电气设备和基板之间插入一定数量的塑料材料。塑料材料被加热，使其软化和流动。电子装置和基板一起被推动。推动步骤使熔融的塑料材料从触点和焊盘之间移位。触点和焊盘直接接合而没有任何粘合剂，焊料或导电填料，以电连接电子器件和衬底。允许塑料材料冷却，由此使电子器件和衬底粘合在一起并电连接。

3. 发明公开

EP0680803A3 Bonding flip chips to a substrate 失效
标题翻译：连接与基板的半导体。
公开(公告)号：EP0680803A3
公开(公告)日：1997-01-15
申请号：EP95302724.0
申请日：1995-04-24
申请人： Ford Motor Company
发明人： Pham, Cuong Van , Hayden, Brian John , Walles, Bethany Joy
IPC分类号： B23K20/10
CPC分类号： H01L24/75 , B23K20/10 , B23K20/106 , H01L24/81 , H01L2224/13144 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/00
摘要： A process for bonding a flip chip (20) to a substrate (22) comprising positioning the flip chip (20) above the substrate (22). The flip chip (20) has an active face provided with conductive bumps so that its active face is oriented toward the substrate (22). The flip chip (20) is placed on the substrate (22) so that the bumps align with a bonding pattern on the substrate (22). An ultrasonic horn (30) is lowered having a flat surface onto a back side of the flip chip (20). Force is applied through the ultrasonic horn (30) to the back side of the flip chip (20), which is normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the force is applied so that the ultrasonic energy is isothermally transferred across the flip chip (20) to the substrate (22) and a diffusion bond is created therebetween.

4. 发明公开

EP0595652A1 Method and apparatus for detecting wire bond pull test failure modes 失效
标题翻译： Verfahren und Vorrichtung zur Erkennung der Fehlerart beiZugprüfungvon Drahtverbindungen。
公开(公告)号：EP0595652A1
公开(公告)日：1994-05-04
申请号：EP93308666.2
申请日：1993-10-29
申请人： FORD MOTOR COMPANY
发明人： Pham, Cuong Van , Hayden, Brian J.
IPC分类号： G01N3/00 , G01N19/04 , G01N27/20 , H01L21/66
CPC分类号： G01N19/04 , G01N3/00 , G01N2203/0296 , G01N2203/0617 , H01L22/12 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/48472 , H01L2224/78 , H01L2224/859 , H01L2924/00014 , H01L2924/14 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample (14) having first and second bond foots (16,18) affixed to respective first and second support pads (20,22). The method and apparatus monitors the voltage levels of first and second electrically conductive probes (28,34). The first probe (28) has a primary lead (24) in electrical contact with the first support pad (20) and a secondary lead (26) in electrical contact with the first bond foot (16). Similarly, the second electrically conductive probe (34) has a primary lead (30) in electrical contact with the second support pad (22) and a secondary lead (32) in electrical contact with the second bond foot (18). Voltage detection means is provided in electrical contact with the first and second probes (28,34) for detecting the voltage level at each of the respective (58,60,62,64) primary and secondary leads to generate the respective corresponding output signals. Comparator means is further provided in electrical contact with the voltage detection means for receiving and comparing each of the output signals to a selected reference value and generating a supplemental output signal indicating the location of bond failure or wire breakage.
摘要翻译：提供了一种用于电检测在具有固定到相应的第一和第二支撑垫（20）上的第一和第二接合脚（16,18）的线样品（14）的拉伸强度测试期间发生的接合失效和断线的位置的方法和装置，，22）。该方法和装置监测第一和第二导电探针（28,34）的电压电平。第一探针（28）具有与第一支撑垫（20）电接触的主导线（24）和与第一键脚（16）电接触的次导线（26）。类似地，第二导电探针（34）具有与第二支撑垫（22）电接触的主导线（30）和与第二接合脚（18）电接触的次级引线（32）。提供与第一和第二探针（28,34）电接触的电压检测装置，用于检测各个（58,60,62,64）主引线和次引线中的每一个上的电压电平，以产生相应的相应输出信号。进一步提供比较器装置与电压检测装置电接触，用于接收并将每个输出信号与所选择的参考值进行比较，并产生指示接合故障或断线位置的补充输出信号。

5. 发明公开

EP0993034A2 Method for bonding bumped electronic components to a substrate 审中-公开
标题翻译：维尔法赫恩·邦登·冯·电
公开(公告)号：EP0993034A2
公开(公告)日：2000-04-12
申请号：EP99307383.2
申请日：1999-09-17
申请人： Ford Motor Company
发明人： Nuno, Rose Lynda , Pham, Cuong Van , Todd, Michael George
IPC分类号： H01L21/60 , H01L21/603
CPC分类号： H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13144 , H01L2224/81191 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H05K3/328 , H01L2924/00 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684
摘要： There is disclosed herein a method for bonding an electronic component 10 having bump terminations 14 on a surface thereof to a dielectric substrate 20 having a plurality of copper mounting pads 22, comprising the steps of: (a) providing the component 10 and the substrate 20; (b) depositing a layer of silver 30 atop each copper mounting pad 22, thereby forming a plurality of silvered pads 40; (c) positioning the component atop the substrate such that each bump termination 14 is registered atop a respective one of the silvered pads 40; and (d) bonding the bump terminations to their respective silvered pads by solid-to-solid diffusion bonding, such as by thermocompression bonding.
摘要翻译：这里公开了一种将具有凸起端子14的电子部件10在其表面上接合到具有多个铜安装焊盘22的电介质基板20的方法，包括以下步骤：（a）提供部件10和基板20 ; （b）在每个铜安装垫22的顶部沉积银层30，从而形成多个镀银垫40; （c）将所述部件放置在所述基板的顶部，使得每个凸块端接件14登记在相应的一个镀银焊盘40的上方; 和（d）通过固体 - 固体扩散接合（例如通过热压接）将凸块端接件结合到它们各自的镀银焊盘上。

6. 发明公开

EP0966038A2 Bonding of semiconductor power devices 审中-公开
标题翻译： Bonden von Leistungshalbleiteranordnungen
公开(公告)号：EP0966038A2
公开(公告)日：1999-12-22
申请号：EP99304256.3
申请日：1999-06-01
申请人： FORD MOTOR COMPANY
发明人： Baker, Jay DeAvis , Pham, Cuong Van , Hayden, Brian John
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/97 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/40225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/73253 , H01L2224/73255 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/13091 , H01L2924/15747 , H01L2924/00
摘要： There is disclosed herein a semiconductor power device assembly 80 which may be bonded to a circuit board without wirebonding. The device comprises: (a) a bare die semiconductor power device 10 having a top surface 12 and a bottom surface 14; (b) at least one metallic die bump 20 attached to the top surface 12 of the power device 10; (c) a metallic mounting tab 40 having a first portion 42 attached to the bottom surface of the power device; a second portion 44 oriented above, outward from, and generally parallel with the first portion and having a top surface 46 thereon; and a third portion 48 connecting the first portion 42 with the second portion 44; and (d) a metallic mounting tab bump 50 attached to the top surface 46 of the second portion 44. The top surface 46 of the second portion 44 is oriented generally coplanar with the top surface 12 of the power device 10.
摘要翻译：这里公开了半导体功率器件组件80，其可以结合到电路板而不引线接合。该装置包括：（a）具有顶表面12和底表面14的裸芯片半导体功率器件10; （b）至少一个附着在动力装置10的顶面12上的金属模具凸块20; （c）金属安装突片40，其具有附接到动力装置底面的第一部分42; 第二部分44，其位于从第一部分的上方，外侧并大致平行并且在其上具有顶部表面46; 以及将第一部分42与第二部分44连接的第三部分48; 和（d）附接到第二部分44的顶表面46的金属安装突起50.第二部分44的顶表面46大致与功率装置10的顶表面12共面。

7. 发明公开

EP0966038A3 Bonding of semiconductor power devices 审中-公开
标题翻译：结合功率半导体装置
公开(公告)号：EP0966038A3
公开(公告)日：2001-02-28
申请号：EP99304256.3
申请日：1999-06-01
申请人： FORD MOTOR COMPANY
发明人： Baker, Jay DeAvis , Pham, Cuong Van , Hayden, Brian John
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/97 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/40225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/73253 , H01L2224/73255 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/13091 , H01L2924/15747 , H01L2924/00
摘要： There is disclosed herein a semiconductor power device assembly 80 which may be bonded to a circuit board without wirebonding. The device comprises: (a) a bare die semiconductor power device 10 having a top surface 12 and a bottom surface 14; (b) at least one metallic die bump 20 attached to the top surface 12 of the power device 10; (c) a metallic mounting tab 40 having a first portion 42 attached to the bottom surface of the power device; a second portion 44 oriented above, outward from, and generally parallel with the first portion and having a top surface 46 thereon; and a third portion 48 connecting the first portion 42 with the second portion 44; and (d) a metallic mounting tab bump 50 attached to the top surface 46 of the second portion 44. The top surface 46 of the second portion 44 is oriented generally coplanar with the top surface 12 of the power device 10.

8. 发明公开

EP1011132A2 Ultrasonic bumping of electronic components 审中-公开
标题翻译：维尔法赫恩·安布林根·冯·金斯勒
公开(公告)号：EP1011132A2
公开(公告)日：2000-06-21
申请号：EP99307379.0
申请日：1999-09-17
申请人： Ford Motor Company
发明人： Pham, Cuong Van , Nuno, Rose Lynda
IPC分类号： H01L21/48 , B23K20/00
CPC分类号： H01L24/11 , B23K3/0623 , B23K20/10 , B23K2201/40 , H01L24/75 , H01L2224/05001 , H01L2224/05026 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/1133 , H01L2224/13099 , H01L2224/45144 , H01L2224/742 , H01L2224/75 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2224/05624 , H01L2924/00014 , H01L2224/05124
摘要： An apparatus for ultrasonically bumping a metallic bonding site 12 on a workpiece 10, comprising:

(a) a workpiece holder 20 for releasably attaching the workpiece 10 thereto;
(b) a bumping tool 30 having a bumping tip 32 with a bump cavity 34 formed therein;
(c) an ultrasonic transducer 40 coupled with the bumping tool for ultrasonically vibrating the bumping tip;
(d) means 60 for positioning a metal foil 50 atop the bonding site on the workpiece; and
(e) means 70 for moving the bumping tool between

(i) a reset position, wherein the bumping tip 32 is disposed away from the bonding site 12 on the workpiece, and
(ii) a bonding position, wherein the bumping tip 32 presses the metal foil 50 against the bonding site 12 on the workpiece.
摘要翻译：一种用于在工件10上超声冲击金属接合位置12的装置，包括：（a）用于将工件10可释放地附接到其上的工件保持器20; （b）具有形成在其中的凸起腔34的凸起尖端32的凸起工具30; （c）超声波换能器40，其与所述凸块工具联接，用于超声振动所述凸起尖端; （d）用于将金属箔50定位在工件上的焊接部位上方的装置60; 和（e）用于在（i）复位位置之间移动凸起工具的装置70，其中凸起尖端32远离工件上的结合部位12设置，以及（ii）接合位置，其中，金属箔50抵靠工件上的结合部位12。

9. 发明公开

EP0930645A3 Solderless flip-chip assembly and method and material for same 审中-公开
标题翻译： Lotlöser倒装芯片组件和方法和材料
公开(公告)号：EP0930645A3
公开(公告)日：2000-04-19
申请号：EP98309071.3
申请日：1998-11-05
申请人： Ford Motor Company
发明人： Belke, Robert Edward Jr. , Hayden, Brian John , Pham, Cuong Van , Nuno, Rosa Lynda , Todd, Michael George
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/1134 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A solderless method for assembling a semiconductor electronic flip-chip device (12) to an electrical interconnecting substrate (18) including the steps of forming a plurality of raised electrical contacts (16) and plurality of contact pads (20). The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material (24) is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

10. 发明授权

EP0680803B1 Bonding flip chips to a substrate 失效
标题翻译：连接具有衬底的半导体
公开(公告)号：EP0680803B1
公开(公告)日：1999-08-25
申请号：EP95302724.0
申请日：1995-04-24
申请人： Ford Motor Company
发明人： Pham, Cuong Van , Hayden, Brian John , Walles, Bethany Joy
IPC分类号： B23K20/10 , H01L21/00 , H01L21/60 , H01L21/607
CPC分类号： H01L24/75 , B23K20/10 , B23K20/106 , H01L24/81 , H01L2224/13144 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/00

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