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1. 发明公开

EP3330223A4 METHOD FOR PRODUCING SILICA SOL 审中-公开
公开(公告)号：EP3330223A4
公开(公告)日：2018-08-01
申请号：EP16832831
申请日：2016-07-25
申请人： FUJIMI INC
发明人： ASHITAKA KEIJI , ITO MASAAKI , SHINODA JUN
IPC分类号： C01B33/145
CPC分类号： C01B33/145
摘要： [Problem] Provided is a method for producing a silica sol capable of providing consistent production of the silica sol having a uniform particle size of silica particles in any particle size of the silica particles. [Solution] A method for producing a silica sol is a method including a step of mixing liquid (A) containing an alkaline catalyst, water, and a first organic solvent with liquid (B) containing an alkoxysilane or its condensate and a second organic solvent, and liquid (C1) having a pH of 5.0 or higher and lower than 8.0 and containing water or liquid (C2) containing water and being free of an alkaline catalyst to make a reaction liquid.

2. 发明公开

EP2628567A4 POLISHING COMPOSITION 有权
标题翻译： POLIERZUSAMMENSETZUNG
公开(公告)号：EP2628567A4
公开(公告)日：2017-05-24
申请号：EP11832479
申请日：2011-10-06
申请人： FUJIMI INC
发明人： ASHITAKA KEIJI , MORINAGA HITOSHI , YASUI AKIHITO
IPC分类号： B24B37/00 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/3105
CPC分类号： C09K3/1409 , C09G1/02 , C09K3/1463 , H01L21/31053
摘要： A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.
摘要翻译：抛光组合物包含在其表面上具有突起的胶体二氧化硅颗粒。将属于胶体二氧化硅粒子的粒径大于胶体二氧化硅粒子的体积平均粒径的部分的粒子表面的突起的高度除以基体的宽度而得到的值的平均值相同突起的部分不小于0.245。优选地，具有比胶态二氧化硅颗粒的体积平均粒径更大的粒径的胶态二氧化硅颗粒的部分具有不小于1.15的平均长宽比。优选地，属于胶体二氧化硅颗粒的粒径大于胶体二氧化硅颗粒的体积平均粒径的部分的颗粒表面上的突起的平均高度不小于3.5nm。

3. 发明公开

EP2613344A4 POLISHING COMPOSITION 审中-公开
标题翻译： POLIERZUSAMMENSETZUNG
公开(公告)号：EP2613344A4
公开(公告)日：2014-01-22
申请号：EP11821644
申请日：2011-08-25
申请人： FUJIMI INC
发明人： ASHITAKA KEIJI , MORINAGA HITOSHI , TAHARA MUNEAKI
IPC分类号： H01L21/304 , B24B37/00 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/3105
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/02024 , H01L21/31053

4. 发明公开

EP3248941A4 MODIFIED COLLOIDAL SILICA, METHOD OF PRODUCING SAME, AND POLISHING AGENT USING SAME 有权
公开(公告)号：EP3248941A4
公开(公告)日：2018-01-17
申请号：EP16740167
申请日：2016-01-19
申请人： FUJIMI INC
发明人： ASHITAKA KEIJI , TSUBOTA SHOGO
IPC分类号： C01B33/146 , B24B37/00 , C09K3/14 , H01L21/304
CPC分类号： C09G1/02 , B24B37/00 , B24B37/044 , C01B33/146 , C01B33/148 , C01B33/149 , C01P2004/03 , C01P2004/51 , C01P2004/61 , C07F7/025 , C09K3/14 , C09K3/1436 , H01L21/304 , H01L21/31053 , H01L21/76819
摘要： To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica. Modified colloidal silica, being obtained by modifying raw colloidal silica, wherein the raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.

5. 发明公开

EP3127984A4 POLISHING COMPOSITION FOR HARD MATERIALS 审中-公开
标题翻译： POLIERZUSAMMENSETZUNGFÜRHARTE MATERIALIEN
公开(公告)号：EP3127984A4
公开(公告)日：2017-10-04
申请号：EP15774104
申请日：2015-04-02
申请人： FUJIMI INC
发明人： ASHITAKA KEIJI , TOUJINBARA KAZUMA , MIWA NAOYA
IPC分类号： C09K3/14 , B24B37/00 , B24B37/04 , C09G1/02 , C23F3/06 , H01L21/304
CPC分类号： C09G1/02 , B24B37/044 , C09K3/1409 , C09K3/1463 , C23F3/06
摘要： This invention provides a polishing composition with which high-rate polishing is possible in an application where an object formed of a hard material is polished and also a method for producing a hard material, using the polishing composition. The polishing composition provided by this invention is characterized by that an abrasive formed of titanium diboride is dispersed in a dispersing medium. The hard material production method provided by this invention comprises a step of polishing a hard material surface with the polishing composition.
摘要翻译：本发明提供一种研磨用组合物，该研磨用组合物在对硬质材料形成的被研磨物进行研磨的用途中能够进行高速研磨，还提供使用该研磨用组合物制造硬质材料的方法。本发明提供的抛光组合物的特征在于由二硼化钛形成的研磨剂分散在分散介质中。本发明提供的硬质材料制造方法包括用抛光组合物抛光硬质材料表面的步骤。

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