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    • 1. 发明公开
    • Cleaning composition, method for producing semiconductor device, and cleaning method
    • 清洁组合物,制造半导体器件和清洁方法的方法
    • EP2386623A1
    • 2011-11-16
    • EP11166033.8
    • 2011-05-13
    • Fujifilm Corporation
    • Inaba, TadashiTakahashi, KazutakaTakahashi, TomonoriMizutani, Atsushi
    • C11D11/00C11D7/26C11D7/32C11D7/50
    • C11D11/0047C11D7/265C11D7/3209C11D7/3218C11D7/5004
    • Provided are a cleaning composition which is capable of inhibiting the metal of a semiconductor substrate from corrosion, and has an excellent removability of plasma etching residues and/or ashing residues on the semiconductor substrate, a method for producing a semiconductor device, and a cleaning method using the cleaning composition. The cleaning composition for removing plasma etching residues and/or ashing residues formed on a semiconductor substrate, and a preparation method and a cleaning method for a semiconductor device, using the cleaning composition, wherein the cleaning composition includes (Component a) water; (Component b) an amine compound; (Component c) hydroxylamine and/or a salt thereof; (Component d) a quaternary ammonium compound; (Component e) an organic acid; and (Component f) a water-soluble organic solvent; and has a pH of 6 to 9.
    • 本发明提供一种清洗组合物,所有这些都能够抑制从腐蚀的半导体基片的金属,并具有等离子蚀刻残渣及/或灰化残留物在半导体基板的优异的可除去性,用于制造半导体器件的方法,以及清洁方法 使用清洁组合物。 使用所述清洗组合物用于除去等离子蚀刻残渣及/或灰化形成在半导体衬底残余物的清洗组合物,及其制备方法和用于半导体器件的清洗方法,所述清洗组合物包括worin(成分a)水; (成分b)的胺化合物; (C成分)羟胺和/或其盐; (D成分)的季铵化合物; 有机酸(E成分); 和(F成分)的水溶性有机溶剂; 并具有pH为6至9日