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1. 发明公开

EP2291286A1 BAUTEIL MIT DECKSCHICHT AUS EINER PA613-FORMMASSE 审中-公开
标题翻译：与表面组件从PA613-FORM测
公开(公告)号：EP2291286A1
公开(公告)日：2011-03-09
申请号：EP09769217.2
申请日：2009-06-23
申请人： Evonik Degussa GmbH
发明人： WURSCHE, Roland , BOLLMANN, Sonja , BAUMANN, Franz-Erich , KÜTING, Beatrice , LÜTZELER, Kirsten , PAWLIK, Andreas , WIELPÜTZ, Martin
IPC分类号： B32B27/34 , C08L77/06
CPC分类号： B32B27/34 , B32B7/12 , B32B25/042 , B32B25/08 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/286 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/365 , B32B27/38 , B32B27/40 , B32B2307/3065 , B32B2307/402 , B32B2307/4026 , B32B2307/412 , B32B2307/558 , B32B2307/584 , B32B2307/714 , B32B2451/00 , B32B2457/20 , B32B2605/00 , C08L77/06 , G02B1/04 , Y10T428/31507 , Y10T428/31511 , Y10T428/31533 , Y10T428/31562 , Y10T428/31721 , Y10T428/31725 , Y10T428/31728 , Y10T428/31736 , Y10T428/3175 , C08L77/00
摘要： A component which comprises the following components: I. a top layer of a moulding compound which contains at least 50% by weight of PA613 and II. a substrate of a thermoplastic moulding compound has a surface with high scratch resistance and high chemical resistance.

2. 发明授权

EP2556115B1 POLYMERPULVER AUF DER BASIS VON POLYAMIDEN, VERWENDUNG IN EINEM FORMGEBENDEN VERFAHREN UND FORMKÖRPER, HERGESTELLT AUS DIESEM POLYMERPULVER 有权
标题翻译： POLYMERPULVER AUF DER BASIS VON POLYAMIDIDEN，VERWENDUNG in EINEM FORMGEBENDEN VERFAHREN UNDFORMKÖRPER，HERGESTELLT AUS DIESEM POLYMERPULVER
公开(公告)号：EP2556115B1
公开(公告)日：2013-12-04
申请号：EP11714254.7
申请日：2011-04-06
申请人： Evonik Degussa GmbH
发明人： BAUMANN, Franz-Erich , DIEKMANN, Wolfgang , KÜTING, Beatrice , STEMMER, Heike , GREBE, Maik , WARNKE, Kristiane , MONSHEIMER, Sylvia , HÄGER, Harald
IPC分类号： C08L77/02 , C08L77/06 , B29C67/00
CPC分类号： B29C64/106 , B29C64/153 , B33Y70/00 , C08L77/02 , C08L77/06 , C08L2205/02 , C09D5/03 , Y10T428/2982
摘要： The invention relates to a polymer powder for use in a layer-by-layer method in which areas of each powder layer are selectively fused by introducing electromagnetic energy. Said polymer powder contains: at least one AB-type polyamide produced by polymerizing lactams comprising 10 to 12 carbon atoms in the monomer unit or polycondensing the corresponding ω-amino carboxylic acids comprising 10 to 12 carbon atoms in the monomer unit and at least one AABB-type polyamide produced by polycondensing diamines and dicarboxylic acids, each of which comprises 10 to 14 carbon atoms in the monomer units, the AB-type polyamide containing up to 20 mole % of the AABB comonomer units and the AABB-type polyamide containing up to 20 mole % of the AB monomer units. The invention also relates to a method for producing such a powder, a layer-by-layer method for producing a molded article from such a powder in which areas of each layer are selectively fused by introducing electromagnetic energy, the selectivity being obtained using masks or by applying inhibitors, absorbers or susceptors or focusing the applied energy, and molded articles produced in said manner.
摘要翻译：本发明涉及一种逐层法使用的聚合物粉末，其中通过引入电磁能将每个粉末层的区域选择性地熔合。所述聚合物粉末包含：至少一种AB型聚酰胺，其通过在单体单元中聚合包含10至12个碳原子的内酰胺或者在单体单元中缩聚包含10至12个碳原子的相应的ω-氨基羧酸和至少一种 AABB型聚酰胺，其通过缩聚二胺和二羧酸而制备，每种单体在单体单元中包含10至14个碳原子，AB型聚酰胺含有至多20摩尔％的AABB共聚单体单元和AABB型聚酰胺，至20摩尔％的AB单体单元。本发明还涉及生产这种粉末的方法，用这种粉末生产模塑制品的逐层方法，其中通过引入电磁能量选择性地熔化每层的区域，使用掩模或通过施加抑制剂，吸收剂或感受器或聚焦所施加的能量，以及以所述方式生产的模制品。

3. 发明公开

EP3230347A1 POLYMERZUSAMMENSETZUNG FÜR SELEKTIVE SINTERVERFAHREN 审中-实审转让
标题翻译： POLYMERZUSAMMENSETZUNGFÜRSELEKTIVE SINTERVERFAHREN
公开(公告)号：EP3230347A1
公开(公告)日：2017-10-18
申请号：EP16820206.7
申请日：2016-12-14
申请人： Evonik Degussa GmbH
发明人： DIEKMANN, Wolfgang , GREBE, Maik , BAUMANN, Franz-Erich , CHRISTOPH, Wolfgang , MONSHEIMER, Sylvia , KÜTING, Beatrice
IPC分类号： C08J3/09 , C08J3/14 , C08J9/28
CPC分类号： C08J3/14 , B29C64/153 , B33Y70/00 , C08J2201/0502 , C08J2201/0522 , C08J2377/00 , C08J2377/02 , C08J2377/06
摘要： The invention relates to a polymer composition for Selective Absorbing Sintering (SAS) or Selective Inhibition Sintering (SIS). The polymer has open mesopores and the cumulative pore volume distribution of mesopores is at least 0.01 cm
3 /g, measured in accordance with DIN 66134.
摘要翻译：本发明涉及用于选择性吸收烧结（SAS）或选择性抑制烧结（SIS）的聚合物组合物。该聚合物具有开放的中孔，且根据DIN 66134测量，中孔的累积孔体积分布为至少0.01cm 3 / g。

4. 发明公开

EP2556115A1 POLYMERPULVER AUF DER BASIS VON POLYAMIDEN, VERWENDUNG IN EINEM FORMGEBENDEN VERFAHREN UND FORMKÖRPER, HERGESTELLT AUS DIESEM POLYMERPULVER 有权
标题翻译：基于聚合物粉末，在窗体成像和模塑获得由该聚合物粉末
公开(公告)号：EP2556115A1
公开(公告)日：2013-02-13
申请号：EP11714254.7
申请日：2011-04-06
申请人： Evonik Degussa GmbH
发明人： BAUMANN, Franz-Erich , DIEKMANN, Wolfgang , KÜTING, Beatrice , STEMMER, Heike , GREBE, Maik , WARNKE, Kristiane , MONSHEIMER, Sylvia , HÄGER, Harald
IPC分类号： C08L77/02 , C08L77/06 , B29C67/00
CPC分类号： B29C64/106 , B29C64/153 , B33Y70/00 , C08L77/02 , C08L77/06 , C08L2205/02 , C09D5/03 , Y10T428/2982
摘要： The invention relates to a polymer powder for use in a layer-by-layer method in which areas of each powder layer are selectively fused by introducing electromagnetic energy. Said polymer powder contains: at least one AB-type polyamide produced by polymerizing lactams comprising 10 to 12 carbon atoms in the monomer unit or polycondensing the corresponding ω-amino carboxylic acids comprising 10 to 12 carbon atoms in the monomer unit and at least one AABB-type polyamide produced by polycondensing diamines and dicarboxylic acids, each of which comprises 10 to 14 carbon atoms in the monomer units, the AB-type polyamide containing up to 20 mole % of the AABB comonomer units and the AABB-type polyamide containing up to 20 mole % of the AB monomer units. The invention also relates to a method for producing such a powder, a layer-by-layer method for producing a molded article from such a powder in which areas of each layer are selectively fused by introducing electromagnetic energy, the selectivity being obtained using masks or by applying inhibitors, absorbers or susceptors or focusing the applied energy, and molded articles produced in said manner.
摘要翻译：本发明涉及一种用于在层 - 层方法中使用的聚合物粉末，其中每种粉末层的区域通过引入电磁能选择性地稠合。所述聚合物粉末含有：通过聚合内酰胺的单体单元，其包括10至12个碳原子或缩聚相应ω氨基羧酸中的单体单元，其包括10至12个碳原子和至少一个AABB产生的至少一种AB型聚酰胺由缩聚二胺和二羧酸，其中的每一个中的单体单元包含10至14个碳原子产生的型聚酰胺，AB型聚酰胺含有至多AABB共聚单体单元的20摩尔％，并且AABB型聚酰胺含有最多的AB单体单元的20摩尔％。所以，本发明涉及一种用于制造寻求粉末，层 - 层用于从寻求在每一层的哪个区域的粉末的模塑制品的方法通过引入电磁能选择性地稠合的，使用掩膜而获得的选择性或通过施加抑制剂，吸收剂或感受器或聚焦所施加的能量，并成型以所述方式制备的制品。

5. 发明公开

EP2102004A1 TRANSPARENTES BAUTEIL 审中-公开
标题翻译：透明组件
公开(公告)号：EP2102004A1
公开(公告)日：2009-09-23
申请号：EP07847765.0
申请日：2007-12-04
申请人： Evonik Degussa GmbH
发明人： WURSCHE, Roland , KUHMANN, Karl , KÜTING, Beatrice , KREIDLER, Patrick , LÜTZELER, Kirsten , HÜLSMANN, Klaus
IPC分类号： B32B27/34
CPC分类号： C09D177/00 , B32B27/34 , C08G69/26 , C08G69/265 , C08L77/00 , C08L77/06 , C08L2205/02 , C09D177/06 , Y10T428/31721 , Y10T428/31725 , Y10T428/31736 , Y10T428/31757 , C08L2666/20
摘要： A transparent part which comprises the following components: I. A covering layer of a polyamide polymer melt which comprises the following constituent parts: a) from 50 to 100 parts by weight of polyamide which can be produced from the following monomers: α) from 70 to 100 mol% of diamine, selected from the group containing m-xylylenediamine, p-xylylenediamine and mixtures thereof, β) from 0 to 30 mol% of other diamines having from 6 to 14 C atoms, wherein the mol% amounts relate here to the sum of diamine, and γ) from 70 to 100 mol% of aliphatic dicarboxylic acids having from 10 to 18 C atoms, and δ) from 0 to 30 mol% of other dicarboxylic acids having from 6 to 9 C atoms, wherein the mol% amounts relate here to the sum of dicarboxylic acid; b) from 0 to 50 parts by weight of another polyamide, wherein the parts by weight of a) and b) add up to 100, II. a substrate of a polymer melt on the basis of a largely amorphous polymer, wherein a) the covering layer, a possibly present adhesive promoter layer and possibly present further layers do not comprise any particle-shaped additives which reduce the transparency discernibly and b) with a layer thickness of 1 mm, the substrate has a maximum of at least 30% in the transmission curve within the visible spectrum from 380 to 800 nm, is scratch-resistant, chemical-resistant and suitable for optical applications.

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