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    • 2. 发明公开
    • HALTERING ZUM HALTEN VON HALBLEITERWAFERN IN EINER CHEMISCH-MECHANISCHEN POLIERVORRICHTUNG
    • 在EINER CHEMISCH-MECHANISCHEN POLIERVORTHHTUNG举行的HALTERING ZUM HALTEN VON HALBLEITERWAFERN
    • EP1545836A1
    • 2005-06-29
    • EP03757898.6
    • 2003-10-01
    • Ensinger Kunststofftechnologie GbR
    • ENSINGER, Wilfried
    • B24B37/04
    • B24B37/32
    • The aim of the invention is to provide a retaining ring (10) for holding semiconductor wafers in a chemical-mechanical polishing device, which is more economically produced and is especially more economically provided with a new plastic element than retaining rings according to prior art. To this end, in order to be mounted in a chemical-mechanical polishing device for semiconductor wafers, said retaining ring (10) comprises: a carrier ring (12) consisting of a first material and comprising assembly elements for mounting the carrier ring (12) on the polishing device; and a supporting ring which consists of a plastic material and is concentrically arranged on the carrier ring, said supporting ring being positioned, on a first front side thereof, on a polishing surface of the polishing device, and being held on the carrier ring (12), on the side thereof axially opposing the first front side, in an adhesive-free, detachable, rotationally fixed, positively locking and/or force locking manner. The first material has a higher rigidity than the plastic material of the supporting ring.
    • 本发明的目的是提供一种用于在化学机械抛光装置中保持半导体晶片的保持环(10),该保持环与根据现有技术的保持环相比更经济地制造并且尤其更经济地设置有新的塑料元件。 为此,为了安装在用于半导体晶片的化学机械抛光装置中,所述保持环(10)包括:由第一材料构成的载体环(12),该载体环包括用于安装载体环(12 )放在抛光装置上; 以及由塑料材料构成并且同心地布置在所述承载环上的支撑环,所述支撑环在其第一前侧上定位在所述抛光装置的抛光表面上并且被保持在所述承载环(12 )在其与第一前侧轴向相对的侧上以无粘合,可拆卸,旋转固定,主动锁定和/或力锁合的方式。 第一种材料具有比支撑环的塑料材料更高的刚性。