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1. 发明公开

EP1118696A4 METHOD FOR PLATING SUBSTRATE AND APPARATUS 审中-公开
标题翻译：方法和装置涂层基布
公开(公告)号：EP1118696A4
公开(公告)日：2007-10-17
申请号：EP99940656
申请日：1999-09-03
申请人： EBARA CORP
发明人： NAGAI MIZUKI , HONGO AKIHISA , OHNO KANJI , ISHII KAZUO , KIMIZUKA RYOICHI , MARUYAMA MEGUMI
IPC分类号： C23C18/16 , C23C18/38 , C25D3/38 , C25D7/12 , H01L21/288 , H01L21/768
CPC分类号： C23C18/38 , C25D3/38 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76877
摘要： A method for plating a substrate for the copper damascene wiring which comprises plating with copper a surface of a substrate having fine slots and holes for wiring formed thereon, to thereby fill the slots and holes with a plated copper layer, wherein an electrolytic plating is carried out by using a plating liquid having concentrations of copper sulfate (CuSO4.5H2O), sulfuric acid (H2SO4) and chloride ion of 4 to 250 g/l, 10 to 200 g/l, 0 to 100 mg/l, respectively. Further, a copper plating bath being more preferable and more suitable to the copper damascene method is provided by adding a sulfur compound in a concentration selected according to the ratio of sulfuric acid / copper sulfate pentahydrate. This method can be used for plating with copper fine slots and holes formed on a substrate for copper damascene wiring with efficiency while preventing the generation of a foam, without the need for a specific machine or electrical facility.

2. 发明公开

EP1136595A4 METHOD FOR MEASURING LEVELER CONCENTRATION OF PLATING SOLUTION, AND METHOD AND APPARATUS FOR CONTROLLING PLATING SOLUTION 审中-公开
标题翻译：方法适用于测量涂料解决方案和方法和设备的目标浓度用于控制涂层解决方案
公开(公告)号：EP1136595A4
公开(公告)日：2006-07-19
申请号：EP00956786
申请日：2000-08-30
申请人： EBARA CORP
发明人： ISAYAMA YASUSHI , UEYAMA HIROYUKI , KANEKO HIROYUKI , YAMAKAWA JUNITSU , HONGO AKIHISA , KIMIZUKA RYOICHI , MARUYAMA MEGUMI
IPC分类号： C25D21/14 , C25D21/12 , G01N27/42
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： A method for measuring the concentration of a leveler in a plating solution for a plating apparatus being used for filling a metal such as copper into a groove or hole formed for wiring in the surface of, for example, a semiconductor substrate or the like, characterized in that the leveler concentration is determined based on the peak area (Ar value) in a peeling region of the plating solution as measured by the CV method or CVS method.

3. 发明公开

EP1048756A4 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译： VORRICHTUNG ZUR PLATTIERUNG VON SUBSTRATEN
公开(公告)号：EP1048756A4
公开(公告)日：2006-06-21
申请号：EP99970132
申请日：1999-10-04
申请人： EBARA CORP
发明人： KURIYAMA FUMIO , OGURE NAOAKI , HONGO AKIHISA
IPC分类号： C23C18/16 , C25D7/12 , C25D19/00 , H01L21/00 , C23C18/31 , C25D5/48
CPC分类号： H01L21/67161 , C23C18/1632 , C25D7/123 , C25D17/001 , H01L21/67173 , H01L21/6723
摘要： The present invention provides a substrate plating apparatus capable of forming a plating layer on the surface of a substrate and storing the substrate until the next process in a way that the substrate is not exposed to the atmosphere. Also, the present invention provides a substrate plating apparatus not only capable of performing a process to introduce semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, and also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers; reducing the number of processes; and reducing the installation area required for the apparatus. A substrate plating apparatus that includes a plating process section(20) for plating a substrate; a washing process section(10) for washing the substrate after the plating process; and a storage vessel(16) containing a storing solution in which the substrate is immersed after having been plated and washed. A substrate conveyor is provided in the substrate plating apparatus for loading substrates into the substrate plating apparatus and discharging substrates out of the substrate plating apparatus, or for performing at least one of the loading or discharging operations, such that the substrates are loaded into the substrate plating apparatus one at a time, plated in the plating process section, washed in the washing process section, and subsequently discharged one at a time from the substrate plating apparatus.
摘要翻译：本发明提供一种基板电镀装置，其能够在片材表面形成电镀层，并且在下一工序之前不暴露于大气而对基板进行保管。能够一个接一个地连续地引入用于处理未被容纳在盒中的半导体晶片到电镀装置中的衬底电镀装置可以使粒子污染和氧化物膜形成最小化并且可以通过减少工艺数量来减小安装面积。所述基板电镀装置包括用于电镀基板的电镀单元（20）和用于清洁所述电镀基板的清洁单元（10），所述装置进一步设置有用于将所述电镀液浸入存储液中的基板存储槽（16）清洁后的基材存放。设置在基板电镀装置中的基板输送机能够执行将基板装入电镀装置和从电镀装置输出基板中的至少一个，使得未电镀的基板能够一个接一个地装载到电镀装置中并且电镀并且清洗后的基板可以一个接一个地进行。

4. 发明公开

EP1158573A4 METHOD AND APPARATUS FOR FORMING INTERCONNECTION 审中-公开
标题翻译：方法和装置于连接舍宾
公开(公告)号：EP1158573A4
公开(公告)日：2008-09-24
申请号：EP00966463
申请日：2000-10-13
申请人： EBARA CORP
发明人： FUKUNAGA AKIRA , HORIE KUNIAKI , OGURE NAOAKI , KATO TAKAO , HONGO AKIHISA , NAGASAWA HIROSHI
IPC分类号： B05C11/08 , C23C18/00 , C23C18/02 , C23C18/08 , C23C20/04 , H01L21/00 , H01L21/288 , H01L21/768 , H01L23/532 , H05K1/03 , H05K3/04 , H05K3/10 , H05K3/40 , B05C3/02 , B05D1/40 , H01L21/3205 , H05K3/22
CPC分类号： H05K3/4061 , B05C11/08 , C23C18/02 , C23C18/08 , H01L21/288 , H01L21/6715 , H01L21/76877 , H01L23/53238 , H01L2924/0002 , H05K1/0306 , H05K3/045 , H05K3/102 , H05K2201/0257 , H01L2924/00
摘要： A method and apparatus for forming fine interconnection in a large-scale integrated circuit fabricated on a semiconductor substrate comprising a step of preparing a substrate having a surface in which fine recesses are formed, a step of preparing an ultrafine particle dispersion liquid by dispersing ultrafine particles at least part of which comprise a metal in a specified solvent, a step of supplying the ultrafine particle dispersion liquid into the fine recesses, a step of heat-treating the substrate to melt and bond the metal, and a step of removing extra metal from the surface of the substrate by chemical mechanical polishing. A high-quality metallization can be deposited stably using inexpensive materials.

5. 发明公开

EP1029954A4 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译： SUBSTRATBESCHICHTUNGSVORRICHTUNG
公开(公告)号：EP1029954A4
公开(公告)日：2006-07-12
申请号：EP99943206
申请日：1999-09-08
申请人： EBARA CORP
发明人： HONGO AKIHISA , OGURE NAOAKI , UEYAMA HIROYUKI , YAMAKAWA JUNITSU , NAGAI MIZUKI , SUZUKI KENICHI , CHONO ATSUSHI , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D7/12 , C25D17/00 , C25D21/14
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02
摘要： A substrate plating device capable of using an insoluble anode and replenishing metal ions automatically; a substrate plating device capable of making uniform a primary current distribution between a cathode and an anode and downsizing the device itself; and a plating device with which black film turned into a particle form does not contaminate a substrate to be plated even when a soluble anode is used. A substrate plating device, wherein a substrate to be metal-plated and an insoluble anode are disposed opposite to each other in a plating tank containing a plating solution, wherein soluble anode and cathode are disposed opposite to each other in a circulation tank or a dummy tank provided separately from the plating tank and an anion exchange membrane or a cation selective exchange membrane are disposed between the anode and the cathode. Current is allowed to run between the separately disposed anode and cathode to thereby generate metal ions continuously for replenishing into the plating tank. In addition, an ion exchange membrane or a porous neutral barrier membrane is disposed between a substrate to be plated and an anode to provide a substrate-to-be-plated side area and an anode side area separated from each other.
摘要翻译：本发明的目的是提供一种使用不溶性阳极的基板电镀装置，特别是能够容易且自动地供给金属离子的基板电镀装置。本发明的另一个目的是提供一种能够在阴极和阳极之间提供均匀的初级电流分布并且有助于减小电镀装置的尺寸的基板电镀装置。本发明的另一个目的是提供一种能够防止基板被黑色膜产生的颗粒污染的电镀装置，即使使用可溶性阳极也是如此。本发明涉及一种用于在含有电镀液的电镀液中电镀基板的基板电镀装置，在与基板相对的电镀槽中设置不溶性阳极，所述基板电镀装置包括：循环容器或虚拟容器，与电镀浴，可溶性阳极和阴极设置在循环容器或虚拟容器中，阴离子交换膜或选择性阳离子交换膜设置在阳极和阴极之间并将其隔离; 其中通过在可溶性阳极和阴极之间流动电流而在循环容器或虚拟容器中产生金属离子，并将所产生的金属离子供应到镀浴。基板电镀装置包括在电镀槽中设置在基板和阳极之间的离子交换膜或中性多孔隔膜; 其中所述离子交换膜或中性多孔隔膜将所述镀浴分为衬底区域和阳极区域。

6. 发明公开

EP1048755A4 PLATING DEVICE AND METHOD OF CONFIRMING CURRENT FEED 审中-公开
标题翻译：电镀和勾引确认所有电源
公开(公告)号：EP1048755A4
公开(公告)日：2006-05-31
申请号：EP98961353
申请日：1998-12-16
申请人： EBARA CORP
发明人： YOSHIOKA JUNICHIRO , SENDAI SATOSHI , CHONO ATSUSHI , TADA MITSUO , HONGO AKIHISA , MUKAIYAMA YOSHITAKA , TOMIOKA KENYA , OGATA AKIRA , SUZUKI KENICHI , OZAWA NAOMITSU
IPC分类号： C25D21/12 , G01R31/02 , C25D17/08 , C25D5/08 , G01R27/02
CPC分类号： G01R31/026 , C25D21/12
摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts. In the plating apparatus, an anode 13 is disposed in a plating bath; a substrate 12 is mounted in a jig and disposed in the plating bath opposite the anode 13; and a plurality of feeder contacts 15 is contacting the conductive region formed on the surface of the substrate 12. A predetermined voltage is applied between the anode 13 and feeder contacts 15 to supply a plating current through the feeder contacts 15 for plating the substrate 12. The plating apparatus also includes a conductivity sensor 22 for detecting the state of conductivity between each of the feeder contacts 15 and the conductive region on the substrate 12.

7. 发明公开

EP1204139A4 ROTATION HOLDING DEVICE AND SEMICONDUCTOR SUBSTRATE PROCESSING DEVICE 审中-公开
标题翻译：旋转固定件及系统进行处理的半导体衬底
公开(公告)号：EP1204139A4
公开(公告)日：2010-04-28
申请号：EP01925957
申请日：2001-04-26
申请人： EBARA CORP
发明人： HONGO AKIHISA , KATAKABE ICHIRO , MORISAWA SHINYA
IPC分类号： B24B37/34 , H01L21/00 , H01L21/687 , H01L21/68 , B05C11/08 , H01L21/304 , H01L21/306
CPC分类号： H01L21/68728 , B24B37/345 , C25D7/123 , C25D17/001 , C25D17/004 , C25D17/06 , H01L21/67046 , H01L21/67051 , H01L21/6715 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/6719 , H01L21/67201 , H01L21/67253 , H01L21/67742 , H01L21/67748 , H01L21/67766 , H01L21/68707

8. 发明公开

EP1719161A4 POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：抛光装置及基板处理装置
公开(公告)号：EP1719161A4
公开(公告)日：2007-08-15
申请号：EP05719731
申请日：2005-02-23
申请人： EBARA CORP
发明人： HONGO AKIHISA , ITO KENYA , YAMAGUCHI KENJI , NAKANISHI MASAYUKI
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B21/00 , B24B37/04
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and taking up the polishing tape (5) which has been supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).

9. 发明公开

EP1018568A4 PLATING DEVICE 审中-公开
标题翻译： DEVICE电镀
公开(公告)号：EP1018568A4
公开(公告)日：2006-05-31
申请号：EP99929778
申请日：1999-07-09
申请人： EBARA CORP
发明人： HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D21/12 , G01R31/02
CPC分类号： C25D21/12 , G01R31/026
摘要： The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with the conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel (10), in which an electrode (13) is disposed opposite to a substrate (12) which is affixed to a plating jig (11) electrically through a plurality of feeding contacts (15) for applying a specific voltage between the electrode (13) and conductive layers provided on a plating surface of the substrate (12). Plating current flows from the plating jig (11) through the feeding contacts (15) to the substrate (12). A conduction detection device (22) is provided to detect electrical conductive states between the plurality of feeding contacts (15) and the conductive layer on the substrate (12).

10. 发明公开

EP1061157A4 SUBSTRATE PLATING DEVICE 审中-公开
标题翻译： SUBSTRATBESCHICHTUNGSVORRICHTUNG
公开(公告)号：EP1061157A4
公开(公告)日：2009-05-06
申请号：EP99905338
申请日：1999-03-02
申请人： EBARA CORP
发明人： HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI
IPC分类号： C25D7/12 , H01L21/00 , H01L21/288 , H01L21/768 , C23C18/31 , C25D17/00 , C25D21/00
CPC分类号： H01L21/6723 , C25D17/001 , H01L21/2885 , H01L21/67051 , H01L21/76807 , H01L21/76877
摘要： A substrate plating device permitting a continuous series of plating and post-plating processing in the same facility which is provided therein with a contaminated zone and a clean zone divided by a partition and each capable of independent air supply/exhaust, the contaminated zone handling plating and the clean zone handling post-plating processing. Specifically, a substrate plating device, wherein a substrate to be plated is placed in an enclosed plating bath into which a plating solution is introduced for plating the substrate and a flow passage is formed to allow the plating solution to flow in parallel with the surface of the substrate. The substrate plating device permits a continuous plating of a substrate in the same facility, prevents a post-processed substrate from being contaminated by chemicals used in plating, can form a plating film of a uniform thickness, and ensures easy escaping of bubbles from pores in the plating surface and the difficult depositing of particles on the plating surface.

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