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1. 发明公开

EP3159369A1 SILICONE EXHIBITING HOT-MELT PROPERTIES, AND CURABLE HOT-MELT COMPOSITION 审中-实审转让
标题翻译：有机硅展示热熔性，以及可固化的热熔体组合物
公开(公告)号：EP3159369A1
公开(公告)日：2017-04-26
申请号：EP15809360.9
申请日：2015-06-16
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Haruna , YOSHITAKE, Makoto , YAMAZAKI, Ryosuke
IPC分类号： C08G77/50 , C08G77/44 , C08L83/05 , C08L83/14 , C09J11/00 , C09J183/05 , C09J183/07
CPC分类号： C09J183/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/5419 , C08K5/56 , C08L83/00 , C08L83/04 , C09D183/04 , C09J11/00
摘要： A hot melt silicone that is non-flowable at 25°C and that has a melt viscosity at 100°C of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol% or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass% or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25°C, has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
摘要翻译：一种在25℃下不流动并且在100℃下的熔体粘度为5,000Pa·s或更低的热熔硅树脂，所述热硅树脂是通过将（A）含烯基的有机基聚硅氧烷（其中（C）氢化硅烷化反应的存在下，（B）分子内具有至少两个与硅原子键合的氢原子的氢化硅烷化反应的有机聚硅氧烷（B）：所有与硅原子键合的有机基团中的10摩尔％以上为苯基; 反应催化剂; 和可固化热熔组合物，其包含：（I）热熔硅树脂; （II）在分子中具有至少两个与硅原子键合的氢原子并且其中硅原子键合的氢原子的量为0.5质量％或更大的有机聚硅氧烷; 和（III）氢化硅烷化反应催化剂。热熔硅胶在25°C时不可流动，具有低表面粘性，并且易于通过加热熔化。此外，该可固化热熔组合物具有热熔性和可固化性。

2. 发明公开

EP2809727A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化硅酮组合物，其固化产物及光学半导体装置
公开(公告)号：EP2809727A1
公开(公告)日：2014-12-10
申请号：EP13706078.6
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： YOSHITAKE, Makoto , YAMAZAKI, Ryosuke
IPC分类号： C08L83/04 , H01L33/56 , C08G77/04
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole% of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole%; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包含：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机基聚硅氧烷，其中全部与硅原子键合的有机基团中的30至60摩尔％为具有2至6个碳的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子内具有至少2个与硅原子键合的氢原子的有机聚硅氧烷，其中该组分中所有与硅原子键合的有机基团中的苯基含量为20至70摩尔％; （E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）白色颜料以外的无机填充剂具有优异的成型性，用于形成变色少，热和光的机械强度降低，光反射率高，尺寸稳定性优异，且良好通过用于光学半导体器件的密封剂进行附着。

3. 发明公开

EP3498780A1 CURABLE PARTICULATE SILICONE COMPOSITION, SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION, AND MOLDING METHOD FOR SEMICONDUCTOR MEMBER COMPRISING CURABLE PARTICULATE SILICONE COMPOSITION 有权转让
公开(公告)号：EP3498780A1
公开(公告)日：2019-06-19
申请号：EP17839359.1
申请日：2017-08-04
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke
IPC分类号： C08L83/04 , C08J5/00 , C08K3/00 , H01L21/56 , H01L23/29 , H01L23/31 , H01L25/07 , H01L25/18
摘要： [Problem] Provided are a curable particulate silicone composition having hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 250°C., and a pellet or the like formed by molding the curable particulate silicone composition, and use thereof.
[Resolution Means] A curable particulate silicone composition includes: (A) 100 parts by mass of hot-melt silicone fine particles having a softening point of 30°C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) 100 to 4000 parts by mass of an inorganic filler; and (C) a curing agent, wherein when cured, the curable particulate silicone composition provides a cured product that has an average linear expansion coefficient at a temperature range of 25°C. to 200°C. of 30 ppm/°C. or less and the ratio of the value of the storage modulus at -50°C. (G' -50 ) to the value of the storage modulus at 250°C. (G' 250 ): (G' -50 /G' 250 ) is in the range of 1/1 to 1/50, and use thereof.

4. 发明公开

EP3275955A1 PRIMER COMPOSITION, BONDING METHOD, AND ELECTRIC/ELECTRONIC COMPONENT 有权转让
标题翻译：底漆组合物，粘合方法和电/电子组分
公开(公告)号：EP3275955A1
公开(公告)日：2018-01-31
申请号：EP16754994.8
申请日：2016-02-23
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , YOSHIDA, Hiroaki , YOSHIDA, Shin
IPC分类号： C09D183/10 , C09D5/00 , C09D7/12
摘要： The primer composition of the present invention comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R 1 2 SiO 2/2 ) a (R 2 SiO 3/2 ) b , wherein each R 1 and R 2 is independently an alkyl group having a carbon number of 1 to 12, an aryl group having a carbon number of 6 to 20, or an aralkyl group having a carbon number of 7 to 20, "a" is a number in the range of 0.40 to 0.90, "b" is a number in the range of 0.10 to 0.60, and "a + b" = 1.00, and having 0.5 to 35.0 mol% of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition of the present invention improves the adhesion of silicone cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking of said silicone cured products caused by heat cycles.
摘要翻译：本发明的底漆组合物包含：（A）由平均单元式：（R12SiO2 / 2）a（R2SiO3 / 2）b表示的有机硅氧烷嵌段共聚物，其中每个R1和R2独立地为具有碳数的烷基 1至12的芳基，碳数为6至20的芳基或碳数为7至20的芳烷基，“a”为0.40至0.90的数，“b”为数在0.10〜0.60的范围内，a + b = 1.00，并且硅原子键合的羟基或硅原子键合的烷氧基的含量为0.5〜35.0mol％，其中树脂状硅氧烷嵌段通过直链硅氧烷嵌段 ; （B）固化催化剂; 和（C）有机溶剂。本发明的底漆组合物提高了有机硅固化产物对光学半导体元件，封装材料，基板等基材的粘附性，并且可以抑制由热循环引起的所述有机硅固化产物的剥离或开裂。

5. 发明公开

EP3263648A1 CURABLE GRANULAR SILICONE COMPOSITION AND METHOD FOR PREPARING SAME 审中-实审转让
标题翻译：可固化的粒状有机硅组合物及其制备方法
公开(公告)号：EP3263648A1
公开(公告)日：2018-01-03
申请号：EP16754993.0
申请日：2016-02-23
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , IMAIZUMI, Toru , OZAKI, Kouichi
IPC分类号： C08L83/07 , C08K3/00 , C08L83/05 , H01L23/29 , H01L23/31
CPC分类号： C08L83/06 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/80 , C08J3/12 , C08J3/203 , C08K3/011 , C08K3/013 , C08K3/36 , C08L83/04 , C09D183/04 , H01L23/29 , H01L23/31 , C08K5/56 , C08L83/00 , C08K3/22
摘要： The curable granular silicone composition of the present invention comprises: (A) hot meltable silicone fine particles having a hydrosilylation reactive group and/or radical reactive group, with a softening point of 30°C or higher; (B) a filler that does not have a softening point or does not soften below the softening point of the aforementioned component (A); and (C) a curing agent, and is preferably in a pellet form. The curable granular silicone composition of the present invention has hot melt properties, and has excellent handling workability and curability.
摘要翻译：本发明的可固化的粒状硅氧烷组合物包含：（A）具有氢化硅烷化反应性基团和/或自由基反应性基团的软化点为30℃以上的热熔性硅氧烷微粒; （B）在上述成分（A）的软化点以下不具有软化点或软化的填料; 和（C）固化剂，并且优选为颗粒形式。本发明的可固化的粒状有机硅组合物具有热熔性，并且具有优异的操作性和固化性。

6. 发明公开

EP2867302A1 REACTIVE SILICONE COMPOSITION, REACTIVE THERMOPLASTIC ARTICLE, CURED PRODUCT, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：反应的硅组合物具有反应热塑性塑料制品的硬化产品及光学半导体部件
公开(公告)号：EP2867302A1
公开(公告)日：2015-05-06
申请号：EP13734860.3
申请日：2013-06-18
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , YAMAZAKI, Haruna , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , C08K3/22 , C08K3/36 , H01L33/56
CPC分类号： C08K7/18 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K3/36 , C08K7/14 , C08K2003/2241 , C08L83/04 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product. The cured product exhibits little reduction in mechanical strength or discoloration caused by heat or light and has high light reflectance. And the optical semiconductor device exhibits high luminous efficiency and causes little thermal degradation or photodegradation of a light reflection material.

7. 发明公开

EP3648149A1 CURABLE SILICONE COMPOSITION FOR DIE BONDING USE 审中-实审转让
公开(公告)号：EP3648149A1
公开(公告)日：2020-05-06
申请号：EP18823467.8
申请日：2018-06-19
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , YAMAMOTO, Shinichi
IPC分类号： H01L21/52 , C08K3/36 , C08K5/05 , C08L83/05 , C08L83/07
摘要： A curable silicone composition for die bonding use according to the present invention contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

8. 发明公开

EP3587498A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE 有权转让
公开(公告)号：EP3587498A1
公开(公告)日：2020-01-01
申请号：EP18758425.5
申请日：2018-02-02
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , NISHIJIMA, Kazuhiro , IIMURA, Tomohiro , SUTOH, Manabu
IPC分类号： C08L83/07 , C08K3/36 , C08K5/54 , C08L83/05 , C09J183/04 , C09J183/05 , C09J183/07 , H01L21/52 , H01L33/48
摘要： The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (in the formula, R 1 's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R 1 's per molecule represent hydrogen atoms, R 2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0

9. 发明公开

EP2809726A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化硅组合，固化物体和光学半导体部件
公开(公告)号：EP2809726A1
公开(公告)日：2014-12-10
申请号：EP13706077.8
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： YAMAZAKI, Ryosuke , YOSHITAKE, Makoto
IPC分类号： C08L83/04
CPC分类号： H01L33/60 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/549 , C08K5/56 , C08K2003/2237 , C08L83/00 , C08L83/04 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is at least 20 mole %; (E) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is less than 20 mole %; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.

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