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1. 发明公开

EP2003690A2 Metal screen and adhesive composite thermal interface 审中-公开
标题翻译： Metallschirm und thermische Verbundkleberzwischenschicht
公开(公告)号：EP2003690A2
公开(公告)日：2008-12-17
申请号：EP08156713.3
申请日：2008-05-22
申请人： Delphi Technologies, Inc.
发明人： Brandenburg, Scott D. , Taylor, Ralph S. , Sozansky, Wayne A.
IPC分类号： H01L23/373
CPC分类号： H01L23/3733 , H01L23/42 , H01L2224/29011 , H01L2224/29076 , H01L2224/291 , H01L2224/2919 , H01L2924/01019 , H01L2924/01079 , Y10T29/49002 , H01L2924/0665
摘要： An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding bonding properties superior to conventional thermal interface materials, while also exhibiting exceptional thermal conductivity.
摘要翻译：用于将热量从集成电路装置传导到散热器中的改进的热界面材料是复合材料，其包括限定开口的金属丝网和结合到金属丝网的开口中的硬化结构粘结剂。改进的复合热界面材料具有优于常规热界面材料的优异的粘合性能，同时还具有出色的导热性。

2. 发明公开

EP1781076A2 Electronic assembly having multiple side cooling and method 有权转让
标题翻译：与在多个页面上的冷却系统，以及方法的电子设备
公开(公告)号：EP1781076A2
公开(公告)日：2007-05-02
申请号：EP06076881.9
申请日：2006-10-13
申请人： Delphi Technologies, Inc.
发明人： Taylor, Ralph S. , Jeter, Michael A. , Gerbsch, Erich W. , Ronning, Jeffrey J.
IPC分类号： H05K7/20
CPC分类号： H05K7/20872 , H05K1/182 , H05K7/20927
摘要： An electronics assembly (10) is provided having a substrate (12) and at least one electronics package (20) supported on the substrate (12). The electronics package (20) also has electrical circuitry and first and second side surfaces. The assembly (10) further includes a first heat sink device (30) positioned in thermal communication with the first side surface of the electronics package (20), and a second heat sink device (40) positioned in thermal communication with the second side surface of the electronics package (20).
摘要翻译：电子组件（10）的基材，提供具有支撑在（12）一个基片（12）和至少一个电子器件封装（20）。电子封装件（20），因此具有电路和第一和第二侧表面。该组件（10）还包括在热连通并位于与电子器件封装（20）的第一侧面上的第一散热器装置（30），和在热连通并位于与所述第二侧表面的第二散热装置（40）的电子封装件（20）。

3. 发明公开

EP2273517A1 Shapeable short-resistant capacitor 有权转让
标题翻译： Formbarer Kondensator mit Kurzschlussfestigkeit
公开(公告)号：EP2273517A1
公开(公告)日：2011-01-12
申请号：EP10167297.0
申请日：2010-06-25
申请人： Delphi Technologies, Inc.
发明人： Taylor, Ralph S. , Myers, John D. , Baney, William J.
IPC分类号： H01G4/015 , H01G13/00
CPC分类号： H01G2/18 , H01G4/015 , H01G4/1218 , H01G4/308 , H01G13/00 , Y02T10/7022 , Y10T29/43 , Y10T29/435 , Y10T29/49124 , Y10T29/49155 , Y10T156/1168
摘要： A method that employs a novel combination of conventional fabrication techniques provides a ceramic short-resistant capacitor (30) that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The method allows thinner and more flexible ceramic capacitors to be made. The method includes forming a first thin metal layer (12) on a substrate (10); depositing a thin, ceramic dielectric layer (14) over the metal layer (12); depositing a second thin metal layer (18) over the dielectric layer to form a capacitor exhibiting a benign failure mode; and separating the capacitor (30) from the substrate (10).
摘要翻译：使用常规制造技术的新颖组合的方法提供了可弯曲和/或可成形的陶瓷短路电容器（30），以提供非常紧凑并且适合于所需几何形状的多层电容器。该方法可以制造更薄更柔性的陶瓷电容器。该方法包括在基底（10）上形成第一薄金属层（12）。在所述金属层（12）上沉积薄的陶瓷介电层（14）; 在所述电介质层上沉积第二薄金属层（18）以形成呈现良性失效模式的电容器; 以及将所述电容器（30）与所述基板（10）分离。

4. 发明公开

EP2254132A1 Contact for ceramic capacitor with self-clearing feature 有权转让
标题翻译： KontaktierungfürKeramikkondensatoren mitselbstlöschenderFunktion
公开(公告)号：EP2254132A1
公开(公告)日：2010-11-24
申请号：EP10161616.7
申请日：2010-04-30
申请人： Delphi Technologies, Inc.
发明人： Myers, John D. , Taylor, Ralph S.
IPC分类号： H01G4/015 , H01G4/12
CPC分类号： H01G4/015 , H01G4/1218
摘要： A capacitor (10) exhibiting a benign failure mode has a first electrode layer (12), a first ceramic dielectric layer (14) deposited on a surface of the first electrode (12), and a second electrode layer (16) disposed on the ceramic dielectric layer (14), wherein selected areas of the ceramic dielectric layer (14) have additional dielectric material (18) of sufficient thickness to exhibit a higher dielectric breakdown voltage than the remaining majority of the dielectric layer (14). The added thickness of the dielectric layer (14) in selected areas allows lead connections (22) to be made at the selected areas of greater dielectric thickness while substantially eliminating a risk of dielectric breakdown and failure at the lead connections (22), whereby the benign failure mode is preserved.
摘要翻译：表现出良性破坏模式的电容器（10）具有第一电极层（12），沉积在第一电极（12）的表面上的第一陶瓷电介质层（14）和设置在第一电极层陶瓷介电层（14），其中所述陶瓷介电层（14）的选定区域具有足够厚度的附加电介质材料（18），以显示比所述电介质层（14）的剩余大部分更高的介电击穿电压。在选择的区域中增加的介电层（14）的厚度允许在更大介电厚度的选定区域处制造引线连接（22），同时基本消除引线连接件（22）处的介电击穿和故障的风险，由此良性失败模式得以保留。

5. 发明授权

EP2254132B1 Contact for ceramic capacitor with self-clearing feature 有权转让
标题翻译：具有自清除功能的陶瓷电容器的触点
公开(公告)号：EP2254132B1
公开(公告)日：2018-03-28
申请号：EP10161616.7
申请日：2010-04-30
申请人： Delphi Technologies, Inc.
发明人： Myers, John D. , Taylor, Ralph S.
IPC分类号： H01G4/015 , H01G4/12
CPC分类号： H01G4/015 , H01G4/1218
摘要： A capacitor (10) exhibiting a benign failure mode has a first electrode layer (12), a first ceramic dielectric layer (14) deposited on a surface of the first electrode (12), and a second electrode layer (16) disposed on the ceramic dielectric layer (14), wherein selected areas of the ceramic dielectric layer (14) have additional dielectric material (18) of sufficient thickness to exhibit a higher dielectric breakdown voltage than the remaining majority of the dielectric layer (14). The added thickness of the dielectric layer (14) in selected areas allows lead connections (22) to be made at the selected areas of greater dielectric thickness while substantially eliminating a risk of dielectric breakdown and failure at the lead connections (22), whereby the benign failure mode is preserved.

6. 发明公开

EP2846338A1 Capacitor fabrication using nano materials 审中-公开
标题翻译： Herstellung eines Kondensators unter Verwendung von Nanomaterialien
公开(公告)号：EP2846338A1
公开(公告)日：2015-03-11
申请号：EP14181285.9
申请日：2014-08-18
申请人： Delphi Technologies, Inc.
发明人： Taylor, Ralph S.
IPC分类号： H01G4/30 , H01G4/232
CPC分类号： H01G4/30 , B82Y99/00 , H01G4/232 , H01G4/2325 , H01G4/32 , Y10S977/948 , Y10T29/435
摘要： A multi-layer capacitor (10) includes an anode (12), a cathode (16), a dielectric material (20), a first endcap (22A), and a second endcap (22B). The anode (12) and cathode (16) are formed of one or more layers (14A, 14B) of interlaced conductive material. The dielectric material (20) is interposed between each of the layers (14A, 14B) of the anode (12) and the cathode (16). The first and second endcaps configured to interconnect each of the layers (14A, 14B) of the anode (12) and cathode (16), respectively. The endcaps are formed of conductive nano material. A method of forming an endcap of a capacitor (10) configured to interconnect one or more layers (14A, 14B) of conductive material includes the step of applying conductive nano material (34) to exposed conductive surfaces of at least one of an anode (12) and a cathode (16) of the one or more layers (14A, 14B) of conductive material. The method also includes the step of exposing the nano material to a source of energy effective to initiate self-sintering of the nano material.
摘要翻译：多层电容器（10）包括阳极（12），阴极（16），电介质材料（20），第一端盖（22A）和第二端盖（22B）。阳极（12）和阴极（16）由交织导电材料的一个或多个层（14A，14B）形成。介电材料（20）插入在阳极（12）和阴极（16）的每个层（14A，14B）之间。第一和第二端盖被配置成分别互连阳极（12）和阴极（16）的每个层（14A，14B）。端盖由导电纳米材料形成。一种形成电容器（10）的端帽的方法，该电容器被构造成将导电材料的一个或多个层（14A，14B）互连，包括将导电纳米材料（34）施加到阳极（至少一个）的暴露的导电表面的步骤 12）和导电材料的一个或多个层（14A，14B）的阴极（16）。该方法还包括将纳米材料暴露于有效地引发纳米材料的自烧结的能量源的步骤。

7. 发明授权

EP1781076B1 Electronic assembly having multiple side cooling and method 有权转让
标题翻译：与在多个页面上的冷却系统，以及方法的电子设备
公开(公告)号：EP1781076B1
公开(公告)日：2011-06-29
申请号：EP06076881.9
申请日：2006-10-13
申请人： Delphi Technologies, Inc.
发明人： Taylor, Ralph S. , Jeter, Michael A. , Gerbsch, Erich W. , Ronning, Jeffrey J.
IPC分类号： H05K1/02 , H05K7/20 , H05K5/00
CPC分类号： H05K7/20872 , H05K1/182 , H05K7/20927

8. 发明授权

EP2273517B1 Shapeable short-resistant capacitor 有权转让
标题翻译：可延展的电容器短路电阻
公开(公告)号：EP2273517B1
公开(公告)日：2016-10-19
申请号：EP10167297.0
申请日：2010-06-25
申请人： Delphi Technologies, Inc.
发明人： Taylor, Ralph S. , Myers, John D. , Baney, William J.
IPC分类号： H01G4/015 , H01G13/00
CPC分类号： H01G2/18 , H01G4/015 , H01G4/1218 , H01G4/308 , H01G13/00 , Y02T10/7022 , Y10T29/43 , Y10T29/435 , Y10T29/49124 , Y10T29/49155 , Y10T156/1168

9. 发明公开

EP2869321A3 Lead Lanthanum Zirconium Titanate (PLZT) capacitor on inorganic flexible glass substrate 审中-公开
标题翻译：柔性无机玻璃基板上铅镧锆钛（PLZT）电容器
公开(公告)号：EP2869321A3
公开(公告)日：2015-08-19
申请号：EP14187617.7
申请日：2014-10-03
申请人： Delphi Technologies, Inc. , Argonne National Laboratory
发明人： Fairchild, Manuel Ray , Taylor, Ralph S. , Berlin, Carl, W. , Wong, Celine WK , Ma, Beihai , Balachandran, Uthamalingam
IPC分类号： H01G4/33 , H01G4/38 , H01G4/008 , H01G4/12 , H01L49/02 , H01G4/30
CPC分类号： H01G4/1245 , H01G4/008 , H01G4/012 , H01G4/30 , H01G4/306 , H01G4/33 , H01G4/38 , H01L28/55 , Y10T29/417
摘要： A lead-lanthanum-zirconium-titanate (PLZT) capacitor (10) on a substrate (12) formed of an inorganic film glass. The first metallization layer (14) is deposited on a top side of the substrate (12) to form a first electrode (18). The dielectric layer (20) of PLZT is deposited over the first metallization layer (14). The second metallization layer (22) deposited over the dielectric layer (20) to form a second electrode (24). The glass substrate (12) is advantageous as glass is compatible with an annealing process at 650°C used to form the capacitor (10). Further, the inorganic glass film capacitor (10) can be roll to form a wound capacitor with increased electrical properties.

10. 发明公开

EP2869321A2 Lead Lanthanum Zirconium Titanate (PLZT) capacitor on inorganic flexible glass substrate 审中-公开
标题翻译： Blei Lanthan Zirkonium Titan（PLZT）Kondensator auf einem anorganische Flexibleglassubstrat
公开(公告)号：EP2869321A2
公开(公告)日：2015-05-06
申请号：EP14187617.7
申请日：2014-10-03
申请人： Delphi Technologies, Inc. , Argonne National Laboratory
发明人： Fairchild, Manuel Ray , Taylor, Ralph S. , Berlin, Carl, W. , Wong, Celine WK , Ma, Beihai , Balachandran, Uthamalingam
IPC分类号： H01G4/33 , H01G4/38 , H01G4/008 , H01G4/12 , H01L49/02
CPC分类号： H01G4/1245 , H01G4/008 , H01G4/012 , H01G4/30 , H01G4/306 , H01G4/33 , H01G4/38 , H01L28/55 , Y10T29/417
摘要： A lead-lanthanum-zirconium-titanate (PLZT) capacitor (10) on a substrate (12) formed of an inorganic film glass. The first metallization layer (14) is deposited on a top side of the substrate (12) to form a first electrode (18). The dielectric layer (20) of PLZT is deposited over the first metallization layer (14). The second metallization layer (22) deposited over the dielectric layer (20) to form a second electrode (24). The glass substrate (12) is advantageous as glass is compatible with an annealing process at 650°C used to form the capacitor (10). Further, the inorganic glass film capacitor (10) can be roll to form a wound capacitor with increased electrical properties.
摘要翻译：在由无机膜玻璃形成的基板（12）上的铅 - 镧 - 锆酸锆（PLZT）电容器（10）。第一金属化层（14）沉积在衬底（12）的顶侧上以形成第一电极（18）。 PLZT的电介质层（20）沉积在第一金属化层（14）上。第二金属化层（22）沉积在电介质层（20）上以形成第二电极（24）。玻璃基板（12）是有利的，因为玻璃与用于形成电容器（10）的650℃的退火工艺相容。此外，无机玻璃膜电容器（10）可以滚动以形成具有增加的电性能的卷绕电容器。

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