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1. 发明授权

EP3312212B1 CURABLE COMPOSITION 有权
公开(公告)号：EP3312212B1
公开(公告)日：2020-03-04
申请号：EP16811489.0
申请日：2016-06-07
申请人： Daicel Corporation
发明人： TSUJI, Naoko , TANAKA, Hiroki , YAMAKAWA, Akira , SHIBAMOTO, Akihiro , HARADA, Nobuhiko
IPC分类号： C09J183/06

2. 发明公开

EP3312211A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE 审中-公开
标题翻译：固化性组合物，粘合片，固化物，层合物，粘合片的制造方法及装置
公开(公告)号：EP3312211A1
公开(公告)日：2018-04-25
申请号：EP16811588.9
申请日：2016-06-13
申请人： Daicel Corporation
发明人： TANAKA, Hiroki , TSUJI, Naoko , YAMAKAWA, Akira
IPC分类号： C08G59/20 , B32B27/00 , C09J7/02 , C09J163/00 , C09J183/04
CPC分类号： C09J183/12 , B32B27/283 , C08G77/045 , C08K5/17 , C08K5/34 , C08L83/04 , C08L83/06 , C08L83/12 , C09J183/04 , C09J183/06 , C08K5/5435
摘要： Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows:

wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R 11 and R 12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R 13 and R 14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.0, includes a constitutional unit represented by Formula (1), has a ratio of a constitutional unit represented by Formula (I) to a constitutional unit represented by Formula (II) of 5 or more, and has a total proportion of the constitutional unit
摘要翻译：本发明提供一种固化性组合物，该固化性组合物在固化时可以形成对被粘物的粘接性和粘接性优异的固化物。所述固化性组合物含有聚有机倍半硅氧烷和（A）由式（X）表示的化合物中的一种; 和（B）聚合稳定剂，其中式（X）表示如下：其中r1表示4-20的整数; L表示含环氧基，氧杂环丁烷基或乙烯基醚基的基团; R11和R12各自表示任选取代的烃基; s1表示1至3的整数; t1表示从0到2的整数，其中s1加t1等于3; 并且R13和R14选自氢和任选取代的烃基。聚有机倍半硅氧烷的数均分子量为1000〜3000，分子量分散度为1.0〜3.0，含有式（1）所示的结构单元，式（I）所示的结构单元与由式（II）表示的结构单元为5以上，并且具有该结构单元的总比例

3. 发明公开

EP3624168A1 ADHESIVE AGENT LAYER FORMING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING LINE, AND LAMINATED BODY MANUFACTURING METHOD 审中-公开
公开(公告)号：EP3624168A1
公开(公告)日：2020-03-18
申请号：EP18797843.2
申请日：2018-04-18
申请人： Daicel Corporation
发明人： FUNAKI, Yoshinori , TSUJI, Naoko
IPC分类号： H01L21/02 , B05D3/12 , B32B37/00 , H01L21/683
摘要： Provide are: a method for producing a laminate having an adhesive layer on one surface of a semiconductor wafer, with the adhesive layer being less likely to foam during wafer bonding under reduced pressure, curing of an adhesive being less likely to occur, and also allowing a tact time to be shortened; and an adhesive layer forming device to be used in the method. The adhesive layer forming device for forming an adhesive layer by removing a solvent in a coating film coated and formed on one surface of a semiconductor wafer includes: a lower plate on which the semiconductor wafer is placed; an upper cover configured to form a closed space together with the lower plate, the closed space having a volume of 10 liters or less; and pressure reducing means for reducing pressure in the closed space.

4. 发明公开

EP3623404A1 COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE INCLUDING INSULATING FILM 审中-公开
公开(公告)号：EP3623404A1
公开(公告)日：2020-03-18
申请号：EP18798281.4
申请日：2018-04-26
申请人： Daicel Corporation
发明人： MIYAKE, Hiroto , TSUJI, Naoko , YAMAKAWA, Akira
IPC分类号： C08G59/20 , C08G77/14 , H01L23/29 , H01L23/31
摘要： The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R a SiO 3/2 ] (I) and constituent units represented by formula (II) [R a SiO 2/2 (OR b )] (II) is greater than or equal to 55 mol% of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

5. 发明公开

EP4201944A1 SILANE COUPLING AGENT 审中-实审
公开(公告)号：EP4201944A1
公开(公告)日：2023-06-28
申请号：EP21858190.8
申请日：2021-08-05
申请人： Daicel Corporation
发明人： TSUJI, Naoko , MAETANI, Shinji
IPC分类号： C07F7/18 , B32B7/12 , B32B27/00 , C09J11/06 , C09J201/00 , H01L21/02
摘要： Provided is a silane coupling agent with a low viscosity, excellent applicability, and excellent effect of improving adhesion between inorganic matter and organic matter. The silane coupling agent of the present disclosure contains a silicon compound below and water, having a concentration of the silicon compound of from 0.01 to 10 wt.%, the silicon compound: containing a compound (I) represented by Formula (1) and a polycondensate of the compound (I), wherein a ratio of contents of the compound (I) to a compound (II), [compound (I)/compound (II); weight ratio], the compound (II) being a polycondensate of the compound (I) and having a weight average molecular weight of from 200 to 10000 calibrated with a polystyrene standard, is from 1/99 to 95/5.

6. 发明公开

EP3626796A1 ADHESIVE COMPOSITION, CURED PRODUCT, LAMINATE, AND DEVICE 审中-公开
公开(公告)号：EP3626796A1
公开(公告)日：2020-03-25
申请号：EP18801781.8
申请日：2018-05-16
申请人： Daicel Corporation
发明人： SHIBAMOTO, Akihiro , MAETANI, Shinji , NISHIDA, Kazuhiro , USA, Daisuke , YAMAKAWA, Akira , TSUJI, Naoko
IPC分类号： C09J183/07 , B32B27/00 , C08G77/20 , C09J5/06 , C09J11/06
摘要： Provided is an adhesive composition that can be cured at low temperatures and can form a cured product having excellent insulating property, heat resistance, and adhesiveness. The adhesive composition according to the present invention includes polyorganosilsesquioxane (A) including a constituent unit represented by Formula (1) below, R 1 SiO 3/2 (1), in Formula (1), R 1 represents a group containing a radically polymerizable group. In the polyorganosilsesquioxane (A), a proportion of the constituent unit represented by Formula (1) and a constituent unit represented by the following Formula (2), relative to a total amount (100 mol%) of siloxane constituent units, is from 55 to 100 mol%, R 1 SiO 2/2 (OR 2 ) (2), in Formula (2), R 1 is as defined above, and R 2 is a hydrogen atom or an alkyl group having from 1 to 4 carbons. The polyorganosilsesquioxane (A) has a number average molecular weight from 1500 to 50000 and a molecular weight dispersity (weight average molecular weight/number average molecular weight) from 1.0 to 4.0.

7. 发明公开

EP3626795A1 CURABLE COMPOSITION FOR ADHESIVE AGENT, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND APPARATUS 审中-公开
公开(公告)号：EP3626795A1
公开(公告)日：2020-03-25
申请号：EP18801411.2
申请日：2018-05-16
申请人： Daicel Corporation
发明人： YAMAKAWA, Akira , TSUJI, Naoko
IPC分类号： C09J183/04 , B32B27/00 , C08G59/32 , C08G77/14 , C09J7/20 , C09J11/06 , C09J163/00
摘要： The present invention is to provide a curable composition for adhesive agents that cures at a low temperature and that can form a cured article having excellent heat resistance, crack resistance, and adhesive properties and tight bonding properties for adherends. The present invention provides a curable composition for adhesive agents containing a polyorganosilsesquioxane (A) having a constituent unit represented by Formula (1) below; a mole ratio of a constituent unit represented by Formula (I) below to a constituent unit represented by Formula (II) below (constituent unit represented by Formula (I)/constituent unit represented by Formula (II)) being from 20 to 500; a proportion of the constituent unit represented by Formula (1) below and a constituent unit represented by Formula (4) below being from 55 to 100 mol% relative to a total amount (100 mol%) of siloxane constituent units; a number average molecular weight being from 2500 to 50000; and a molecular weight dispersity (weight average molecular weight/number average molecular weight) being from 1.0 to 4.0.

8. 发明公开

EP3312212A1 CURABLE COMPOSITION 有权
标题翻译：可固化组合物
公开(公告)号：EP3312212A1
公开(公告)日：2018-04-25
申请号：EP16811489.0
申请日：2016-06-07
申请人： Daicel Corporation
发明人： TSUJI, Naoko , TANAKA, Hiroki , YAMAKAWA, Akira , SHIBAMOTO, Akihiro , HARADA, Nobuhiko
IPC分类号： C08G59/32 , B32B27/00 , B32B27/38 , C08L83/06 , C09J7/02 , C09J11/06 , C09J183/06
CPC分类号： C08L83/06 , B32B7/12 , B32B27/283 , B32B37/142 , B32B2037/1253 , B32B2250/03 , B32B2305/72 , B32B2383/00 , C08G59/32 , C08G77/045 , C08G77/14 , C08L2205/025 , C09J7/20 , C09J7/35 , C09J11/04 , C09J11/06 , C09J183/06 , C08L83/00
摘要： Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
摘要翻译：本发明提供具有优异的成膜性并且可以在低温下固化以形成具有耐热性，抗裂性，粘合性和与被粘物的粘合性优异的固化物的固化性组合物。根据本发明的可固化组合物是含有聚有机倍半硅氧烷（A）的组合物。作为聚有机倍半硅氧烷类（A），可以举出（a-1）重均分子量为3000以上的含环氧基的聚有机倍半硅氧烷和（a-2）重均分子量为2500以下的含环氧基的聚有机倍半硅氧烷。聚有机倍半硅氧烷（A）含有总量为聚有机硅倍半氧烷（A）总量的50重量％或更多的组分（a-1）和（a-2）。聚有机倍半硅氧烷（A）的（a-1）与（a-2）的含量比（重量比）为10:90〜70:30。

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