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    • 1. 发明公开
    • Reduced tolerance interconnect system
    • Zwischenverbindungssystem mit verminderter Toleranz。
    • EP0596638A1
    • 1994-05-11
    • EP93308507.8
    • 1993-10-26
    • DIGITAL EQUIPMENT CORPORATION
    • Lewis, Mark S.Martinez, RuebenTresender, Lori AnnTusler, Ralph Michael
    • H05K7/14
    • H05K7/1425
    • A simple, low cost, reduced tolerance interconnect enclosure 10 in which a blind mate interconnect between modules and the backplane 14 may be guaranteed without the need for assembly fixtures or floating connectors, and a method of manufacturing the enclosure. The enclosure includes two matching enclosure sections 16,18 for holding a backplane. The backplane has spaced apart recesses 15 on opposing edges. Each enclosure section includes alignment protrusions 23 spaced apart to engage the backplane recesses. These protrusions have curved apex regions and a height greater than the depth of the backplane recesses. Means 24,25 for latching the enclosure sections together are provided, and the enclosure sections are dimensioned such that when the enclosure sections are closed around the backplane, the protrusions from the enclosure sections are urged against the recesses on the backplane. The resulting multi-point-of-contact interference fit between the backplane recesses and alignment protrusions automatically centers the backplane in the shelf. The process for manufacturing the enclosure includes the steps of drilling holes in a panel and routing the backplanes from the panel such that the routing path crosses the drilled holes, creating recesses on the backplane edges. The enclosure sections are manufactured according to a unitary injection molded plastic process.
    • 一种简单,低成本,简易的容差互连机箱10,其中可以保证模块与背板14之间的盲配线互连,而不需要组装夹具或浮动连接器,以及制造外壳的方法。 外壳包括用于保持背板的两个匹配的外壳部分16,18。 背板在相对的边缘上具有间隔开的凹部15。 每个外壳部分包括间隔开以接合背板凹槽的对准突起23。 这些突起具有弯曲的顶点区域和高于背板凹槽的深度的高度。 提供用于将外壳部分锁定在一起的装置24,25,并且外壳部分的尺寸使得当外壳部分围绕背板被封闭时,来自外壳部分的突起被推靠在背板上的凹部上。 所产生的背板凹槽和对准突起之间的多点接触干涉配合自动将背板中心在搁板中。 用于制造外壳的方法包括以下步骤:在面板中钻孔并从面板路由底板,使得路线路径穿过钻孔,在背板边缘上产生凹陷。 外壳部分根据单一注塑成型工艺制造。
    • 4. 发明公开
    • Reduced static raid enclosure
    • RAID-Disk-Umhüllungmit ESD-Festigkeit
    • EP0738102A2
    • 1996-10-16
    • EP96302085.4
    • 1996-03-26
    • DIGITAL EQUIPMENT CORPORATION
    • Tusler, Ralph MichaelMartinez, ReubenLewis, Mark S.
    • H05K7/14H05K9/00G11B33/02G11B33/12
    • G11B33/126G11B33/128G11B33/1493H05K7/1418H05K7/1425H05K9/0067
    • A low static enclosure has an interior for holding an electronic device therein. The electronic device has opposing walls each having a guide rail thereon. The enclosure has a bottom, a top, and a backplane between the bottom and top at their respective back edges. The backplane has an electric connector on its interior surface.
      The bottom and top each have a flat continuous interior facing surface with a groove extending from the front edge to the back edge. The grooves on the bottom and top are for cooperation with the guide rails on the opposing walls of the electronic device to slide the electronic device along the bottom and top respectively so that an electric connector on the electronic device mates with the electric connector on the interior surface of the backplane. The flat continuous interior facing surfaces of the bottom and top discourage ESD between the surfaces and the electronic device.
    • 低静态外壳具有用于将电子设备保持在其中的内部。 电子设备具有各自在其上具有导轨的相对壁。 外壳在其各自的后边缘处具有底部,顶部和底板之间的底部和顶部。 背板在其内表面上有一个电连接器。 底部和顶部各自具有平坦的连续内表面,其具有从前边缘延伸到后边缘的凹槽。 底部和顶部上的凹槽用于与电子设备的相对壁上的导轨配合,以分别沿着底部和顶部滑动电子设备,使得电子设备上的电连接器与内部的电连接器配合 背板表面。 底部和顶部的平坦的连续内表面阻止表面和电子设备之间的ESD。