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1. 发明公开

EP3466925A1 SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND 审中-公开
公开(公告)号：EP3466925A1
公开(公告)日：2019-04-10
申请号：EP17806786.4
申请日：2017-06-01
申请人： DIC Corporation
发明人： YAMAGUCHI Junji , SHIMONO Tomohiro , ARITA Kazuo , OTSU Masato
IPC分类号： C07D207/452 , B32B15/08 , B32B27/34 , C08F22/40 , C08G59/40 , C08J5/24 , H01L23/29 , H01L23/31
摘要： Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

2. 发明公开

EP3388460A1 OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT 无效
公开(公告)号：EP3388460A1
公开(公告)日：2018-10-17
申请号：EP16872826.9
申请日：2016-11-24
申请人： DIC Corporation
发明人： SHIMONO Tomohiro , ARITA Kazuo , YAMAGUCHI Junji , OTSU Masato
IPC分类号： C08G14/073 , B32B15/08 , C08J5/24 , H01L23/29 , H01L23/31 , H05K1/03
CPC分类号： C07D265/16 , B32B15/08 , C08J5/24 , H01L23/29 , H01L23/295 , H01L23/31 , H05K1/03 , H05K1/0373 , H05K1/09
摘要： The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

3. 发明公开

EP2343327A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME 有权
标题翻译：固化树脂组合物及它们的固化物，用于生产印刷电路板和EPOXY AND PROCESS
公开(公告)号：EP2343327A1
公开(公告)日：2011-07-13
申请号：EP09821869.6
申请日：2009-08-07
申请人： DIC Corporation
发明人： SATOU Yutaka , ARITA Kazuo , OGURA Ichirou
IPC分类号： C08G59/20 , C08G59/06 , H05K1/03
CPC分类号： C08G59/08 , C08G59/3218 , H05K1/03 , H05K1/0326 , Y10T156/10 , Y10T428/249951
摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).
摘要翻译：本发明提供一种固化性树脂组合物并表现出良好的耐热性和低的热膨胀，并没有实现了溶剂中具有良好的溶解度，它们的固化产物，印刷布线板，其包括组合物，一种新型的环氧树脂没有赋予合成的特性，和用于处理生产相同。一种固化性树脂组合物含有作为必要成分的环氧树脂（A），其具有在其分子结构，缩水甘油基氧基，并且其中萘结构和环己二烯酮结构通过亚甲基（S）彼此结合的骨架的，; 和固化剂（B）。

4. 发明公开

EP3466993A1 SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND 审中-公开
公开(公告)号：EP3466993A1
公开(公告)日：2019-04-10
申请号：EP17806787.2
申请日：2017-06-01
申请人： DIC Corporation
发明人： YAMAGUCHI Junji , SHIMONO Tomohiro , ARITA Kazuo , OTSU Masato
IPC分类号： C08F22/40 , B32B5/28 , B32B15/088 , C07D207/452 , C08J5/24 , C08L35/00 , H01L23/14 , H01L23/29 , H01L23/31 , H05K1/03
摘要： The present invention provides a compound having a low melting point and having excellent heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubstituted allyl group and represented by the following Formula (2) (at this time, in Formula (2), Z represents a direct bond or a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent; and R 1 , R 2 , and R 3 each independently represent a hydrogen atom or a methyl group); MI represents a maleimide group represented by the following Formula (3) (at this time, in Formula (3), R 4 and R 5 each independently represent a hydrogen atom or a methyl group); and A represents a structure having two benzene rings and represented by the following Formula (4-1) or (4-2) (at this time, each benzene ring may have a substituent; and X represents a direct bond or a divalent linking group):

5. 发明公开

EP3388459A1 OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT 无效
公开(公告)号：EP3388459A1
公开(公告)日：2018-10-17
申请号：EP16872825.1
申请日：2016-11-24
申请人： DIC Corporation
发明人： SHIMONO Tomohiro , YAMAGUCHI Junji , OTSU Masato , ARITA Kazuo
IPC分类号： C08G14/073 , B32B15/08 , C08J5/24 , H01L23/29 , H01L23/31 , H05K1/03
CPC分类号： C07D265/16 , B32B5/02 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/42 , B32B2260/021 , B32B2260/046 , B32B2457/08 , C08G61/122 , C08G2261/12 , C08G2261/3245 , C08J5/24 , C08J2365/00 , C08K3/013 , H01L23/145 , H01L23/29 , H01L23/295 , H01L23/31 , H01L23/3737 , H05K1/0204 , H05K1/03 , H05K1/0373
摘要： The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

6. 发明授权

EP2532710B1 PHENOL RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCTS THEREOF, AND PRINTED CIRCUIT BOARD 有权
公开(公告)号：EP2532710B1
公开(公告)日：2018-08-22
申请号：EP11739622.6
申请日：2011-01-19
申请人： DIC Corporation
发明人： SATOU Yutaka , ARITA Kazuo , OGURA Ichirou
IPC分类号： C08L61/10 , C08G8/10 , C08J5/24 , H05K1/03 , C08G8/08 , C08G8/12 , C08K5/13
CPC分类号： H05K1/0326 , C08G8/08 , C08G8/12 , C08K5/13 , H05K2201/012 , Y10T428/31515 , C08L61/06
摘要： The present invention provides a curable resin composition exhibiting excellent performance as a cured product, such as excellent heat resistance and flame retardancy, and further exhibiting excellent interlayer adhesive strength when applied to a printed circuit board. A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n = 1 and n = 2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

7. 发明公开

EP2589625A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM 有权
标题翻译：热固性树脂组合物，其固化物，活性酯树脂，半导体密封材料，预浸料坯组装的PCB，建筑和电影
公开(公告)号：EP2589625A1
公开(公告)日：2013-05-08
申请号：EP11800587.5
申请日：2011-06-08
申请人： DIC Corporation
发明人： ARITA Kazuo , SUZUKI Etsuko
IPC分类号： C08L63/00 , C08G59/62 , C08J5/24 , H01B3/40 , H05K1/03
CPC分类号： C08G65/48 , C08G59/08 , C08G59/42 , C08G59/4223 , C08G59/4276 , C08J5/24 , C08J2363/00 , C08J2371/08 , C08L63/00 , C08L67/03 , C08L71/08 , C09D171/08 , H01B3/40 , H01B3/421 , H05K1/0326 , H05K3/323 , H05K3/4676 , H05K2201/012 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).
摘要翻译：本发明提供一种热固性树脂组合物表现出优异的耐热性和阻燃性，同时保持低介电常数和低介电损耗角正切在形成的固化产物，其固化物，以活性酯树脂，其开发出合成的特性，以及半导体封装材料，预浸料坯，电路板，并且其使用的组合物生产的积聚的电影。的热固性树脂组合物含有的活性酯树脂（A）和环氧树脂（B）为具有树脂结构，其包括一个polyaryleneoxy结构（I）必要成分，该活性酯树脂（A）和在一个其中芳族羧酸原子所述polyaryleneoxy结构（I）的多个被通过由结构式1（表示的结构部位（II）连接的worin氩darstellt亚苯基，亚苯基核取代被1至3的烷基基团各自具有1至4个碳原子，亚萘基，或亚萘基的核取代被1至3的烷基基团各自具有1至4个碳原子）。

8. 发明公开

EP3392281A1 OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT 无效
公开(公告)号：EP3392281A1
公开(公告)日：2018-10-24
申请号：EP16875280.6
申请日：2016-11-08
申请人： DIC Corporation
发明人： OTSU Masato , SHIMONO Tomohiro , ARITA Kazuo , YAMAGUCHI Junji
IPC分类号： C08G14/073 , C07D265/14 , C08L61/34 , H01L23/29 , H01L23/31 , H05K1/03
CPC分类号： C07D265/16 , B32B15/092 , B32B15/20 , B32B2457/08 , C07D265/14 , C08F236/20 , C08L61/34 , H01L23/29 , H01L23/293 , H01L23/31 , H05K1/03 , H05K1/0326 , H05K1/0346
摘要： The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.

9. 发明公开

EP2617747A1 ACTIVE ESTER RESIN, METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM 有权
标题翻译：活性酯树脂，用于生产，热固性树脂组合物硬化产品THEREOF，半导体密封材料，预浸料，PCB，建筑和电影
公开(公告)号：EP2617747A1
公开(公告)日：2013-07-24
申请号：EP12793961.9
申请日：2012-05-25
申请人： DIC Corporation
发明人： TAKEUCHI Kan , SUZUKI Etsuko , MORINAGA Kunihiro , ARITA Kazuo
IPC分类号： C08G8/32 , C08G59/42 , C08J5/24 , H01L23/29 , H01L23/31 , H05K1/03
CPC分类号： H05K3/00 , C08G8/32 , C08G59/4223 , C08G63/133 , C08G63/605 , C08J5/24 , C09D161/14 , C09D167/00 , H01L23/29 , H01L2924/0002 , H05K1/0353 , Y10T428/2915 , Y10T428/31529 , Y10T442/2475 , C08L63/00 , H01L2924/00
摘要： A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3) in such a manner that the amount of the component (a2) is 0.4 to 0.95 moles and the amount of the component (a3) is 0.3 to 0.025 moles per mole of phenolic hydroxyl groups of the component (a1) is used as a curing agent for epoxy resin. The polyfunctional phenolic compound (a1) is represented by structural formula (1) below:

(where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
摘要翻译：低介电常数，低介电损耗角正切和耐热性得以实现。的活性酯树脂确实具有通过使与单官能芳族羧酸或其酰氯（a2）中的多官能酚化合物（a1）产生的树脂结构和芳族二羧酸或其酰氯（A3）的寻求的方式没有的量组分（A2）为0.4〜0.95摩尔，成分（A3）是每组分（a1）的酚羟基的摩尔为0.3〜0025摩尔被用作固化剂的环氧树脂的量。的多官能酚化合物（a1）是由结构式（1）所示：（其中Ar darstellt苯环，萘环，苯环通过在具有1至4个碳原子，或一个萘环烷基核取代核substituiertem通过在具有1至4个碳原子的烷基，X darstellt亚甲基，二价的环状脂肪族烃基，亚苯基二亚甲基，或亚联苯基二亚甲基氧基，n darstellt重复单元和所述平均的数量其是在至10的范围内的0.5）。

10. 发明公开

EP2532710A1 PHENOL RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED PRODUCTS TEHREOF, AND PRINTED WIRING BOARD 有权
标题翻译：酚醛组合物，用于生产，固化树脂组合物，固化后THEREOF产品和填充印刷电路板
公开(公告)号：EP2532710A1
公开(公告)日：2012-12-12
申请号：EP11739622.6
申请日：2011-01-19
申请人： DIC Corporation
发明人： SATOU Yutaka , ARITA Kazuo , OGURA Ichirou
IPC分类号： C08L61/10 , C08G8/10 , C08J5/24 , H05K1/03
CPC分类号： H05K1/0326 , C08G8/08 , C08G8/12 , C08K5/13 , H05K2201/012 , Y10T428/31515 , C08L61/06
摘要： The present invention provides a curable resin composition exhibiting excellent performance as a cured product, such as excellent heat resistance and flame retardancy, and further exhibiting excellent interlayer adhesive strength when applied to a printed circuit board. A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n = 1 and n = 2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
摘要翻译：本发明提供的可固化树脂组合物表现出优异的性能的固化物，颜色：例如优异的耐热性和阻燃性，并且还表现出优异的层间粘合强度当施加到印刷电路板。用作固化剂（在环氧树脂的酚醛树脂组合物包含萘酚酚醛清漆树脂（a1）由通式（1）表示，其中R 1和R 2各自独立地表示氢原子，烷基上的基团，或在烷氧基，n是重复单元和上的1个或多个）的整数，和由通式表示的化合物（a2）（2）（其中，R 1和R 2各自独立地表示氢原子，烷基上的基团，或在烷氧基基），worin其中n的化合物= 1 2的通式中的总比率，且n =（1）存在于该组合物是在10％至35％的范围内，n的通式中的平均（1）是在3.0至7.0的范围内，和在组合物中的化合物（a2）的含量为1〜6％。

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