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1. 发明授权

EP2640868B1 METAL COATING OF OBJECTS USING A PLASMA POLYMERISATION PRETREATMENT 有权
公开(公告)号：EP2640868B1
公开(公告)日：2018-10-17
申请号：EP11787816.5
申请日：2011-11-16
申请人： Cuptronic Technology Ltd.
发明人： GÖTHE, Sven , ATTHOFF, Björn , LARSSON, Karl-Gunnar
IPC分类号： C23C18/16 , C23C18/18 , C23C18/20 , H05K3/38 , H01M4/88 , B05D1/00
CPC分类号： C23C16/0272 , B05D1/62 , C23C18/1601 , C23C18/165 , C23C18/1651 , C23C18/1803 , C23C18/1834 , C23C18/1851 , C23C18/2006 , C23C18/2013 , C23C18/2086 , H01L31/04 , H01M4/8825 , H01M4/886 , H01M8/02 , H05K1/02 , H05K3/387 , H05K2203/095 , H05K2203/1168 , Y10T428/12063 , Y10T428/12396 , Y10T428/12493
摘要： A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.

2. 发明公开

EP2847363A2 A PROCESS FOR APPLICATION OF METAL 有权
标题翻译：程序对金属的应用
公开(公告)号：EP2847363A2
公开(公告)日：2015-03-18
申请号：EP13723721.0
申请日：2013-05-07
申请人： Cuptronic Technology Ltd.
发明人： GÖTHE, Sven , ATTHOFF, Björn
IPC分类号： C23C18/16 , C23C18/20 , C23C18/30 , C23C18/18
CPC分类号： B05D7/548 , B05D3/06 , B05D5/00 , C08J7/045 , C08J2355/02 , C08J2369/00 , C08J2433/02 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1844 , C23C18/1868 , C23C18/1882 , C23C18/2006 , C23C18/204 , C23C18/2086 , C23C18/30 , Y10T428/24355
摘要： A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

3. 发明公开

EP3969637A1 METHOD FOR SURFACE TREATMENT PRIOR TO METALLIZATION 有权
公开(公告)号：EP3969637A1
公开(公告)日：2022-03-23
申请号：EP21758055.4
申请日：2021-07-23
申请人： Cuptronic Technology Ltd.
发明人： GÖTHE, Sven , ATTHOFF, Björn
IPC分类号： C23C18/20 , C08F4/04 , C08F2/46 , C08F4/34 , C08F220/06 , C08F220/20 , C08F283/04 , C08F285/00 , C09D151/04 , C09D151/08 , C08F271/00 , C23C18/16 , C23C18/28 , C23C18/30 , C23C18/38

4. 发明公开

EP3137649A2 METALIZATION OF SURFACES 有权
标题翻译：表面的金属化
公开(公告)号：EP3137649A2
公开(公告)日：2017-03-08
申请号：EP15722102.9
申请日：2015-04-28
申请人： Cuptronic Technology Ltd.
发明人： ATTHOFF, Björn , GÖTHE, Sven
IPC分类号： C23C18/16 , C23C18/20 , C23C18/30 , H05K3/18 , H05K3/38
CPC分类号： C23C18/1882 , B05D1/28 , B05D3/061 , C23C18/1608 , C23C18/1641 , C23C18/1862 , C23C18/2006 , C23C18/2033 , C23C18/204 , C23C18/2066 , C23C18/2086 , C23C18/30 , C23C18/40 , C25D3/38 , C25D5/10 , C25D5/54 , H05K3/1275 , H05K3/182 , H05K3/387
摘要： There is disclosed a method for application of a metal on a substrate, comprising the steps: a) contacting at least a part of the surface of the substrate with at least one selected from: i) at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, and ii) a polymer comprising at least one charged group. The contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate. Subsequently a metal layer is produced on the surface. Advantages include that the compactness of the applied metal layer increases compared to similar methods according to the prior art.
摘要翻译：公开了一种用于在基底上施加金属的方法，包括以下步骤：a）使基底的至少一部分表面与选自以下的至少一种接触：i）至少一种引发剂和可聚合单元，其中经历化学反应形成聚合物的能力，所述聚合物包含至少一个带电基团，和ii）包含至少一个带电荷基团的聚合物。通过使垫与包含至少一种物质的板接触并随后使垫与基底表面接触，由此将至少一种物质转移到基底表面来实现接触。随后在表面上产生金属层。优点包括与根据现有技术的类似方法相比，所施加的金属层的紧凑性增加。

5. 发明公开

EP3137650A1 METALIZATION OF SURFACES 有权
标题翻译： METALLISIERUNG VONOBERFLÄCHEN
公开(公告)号：EP3137650A1
公开(公告)日：2017-03-08
申请号：EP15718500.0
申请日：2015-04-28
申请人： Cuptronic Technology Ltd.
发明人： ATTHOFF, Björn , GÖTHE, Sven
IPC分类号： C23C18/20 , C23C18/16 , C23C18/30
CPC分类号： C23C18/1612 , C23C18/1607 , C23C18/1639 , C23C18/1641 , C23C18/165 , C23C18/2033 , C23C18/204 , C23C18/208 , C23C18/2086 , C23C18/30
摘要： A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
摘要翻译：一种在表面上具有可抽取氢原子和/或不饱和度的基底金属化基底的方法，包括以下步骤：a）使基底与可聚合单元接触，至少一种引发剂可以通过热和光化辐射二者被激活，一种溶剂，b）引发聚合反应c）在已经施加的第一金属上沉积第二种金属以获得金属涂层。在该过程中，作为离子和/或小金属颗粒添加第一金属。离子被还原成第一金属。优点包括改善粘合性，缩短处理时间，避免金属涂层中的水泡，金属涂层以下的聚合物层变得不容易膨胀，例如与水接触。

6. 发明授权

EP2847363B1 A PROCESS FOR APPLICATION OF METAL 有权
标题翻译：程序对金属的应用
公开(公告)号：EP2847363B1
公开(公告)日：2016-09-07
申请号：EP13723721.0
申请日：2013-05-07
申请人： Cuptronic Technology Ltd.
发明人： GÖTHE, Sven , ATTHOFF, Björn
IPC分类号： C23C18/16 , C23C18/20 , C23C18/30 , C23C18/18 , B05D3/06 , B05D5/00 , B05D7/00 , C08J7/04
CPC分类号： B05D7/548 , B05D3/06 , B05D5/00 , C08J7/045 , C08J2355/02 , C08J2369/00 , C08J2433/02 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1844 , C23C18/1868 , C23C18/1882 , C23C18/2006 , C23C18/204 , C23C18/2086 , C23C18/30 , Y10T428/24355
摘要： A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

7. 发明公开

EP2640868A2 METAL COATING OF OBJECTS USING A PLASMA POLYMERISATION PRETREATMENT 有权
标题翻译：用等离子体聚合预处理对象的金属涂层
公开(公告)号：EP2640868A2
公开(公告)日：2013-09-25
申请号：EP11787816.5
申请日：2011-11-16
申请人： Cuptronic Technology Ltd.
发明人： GÖTHE, Sven , ATTHOFF, Björn , LARSSON, Karl-Gunnar
IPC分类号： C23C18/16 , C23C18/18 , C23C18/20 , H05K3/18
CPC分类号： C23C16/0272 , B05D1/62 , C23C18/1601 , C23C18/165 , C23C18/1651 , C23C18/1803 , C23C18/1834 , C23C18/1851 , C23C18/2006 , C23C18/2013 , C23C18/2086 , H01L31/04 , H01M4/8825 , H01M4/886 , H01M8/02 , H05K1/02 , H05K3/387 , H05K2203/095 , H05K2203/1168 , Y10T428/12063 , Y10T428/12396 , Y10T428/12493
摘要： A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.
摘要翻译：一种在基底上施加金属的方法包括：a）通过在包含选自最多10个碳原子的烷烃的化合物和不饱和单体的等离子体中通过处理施加涂层，和b1）在所述基底的表面上产生聚合物，所述聚合物包含羧基和第二金属的吸附离子，将所述离子还原成第二金属，或者可选地，b2）在表面上生成聚合物，使所述基材的表面与胶体金属颗粒的分散体接触，所述胶体金属颗粒的分散体至少一种第二金属，以及c）在所述第二金属上沉积所述第一金属。优点包括可以涂覆对例如低pH或溶剂敏感的材料。包括玻璃，非常少量不可提取的氢原子的SiO 2以及含有卤素原子的聚合物材料的基材可以被涂覆以具有良好的粘合性。

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