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    • 3. 发明公开
    • METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE PACKAGE
    • VERFAHREN ZUR HERSTELLUNG EINES LED-GEHÄUSES
    • EP3144984A1
    • 2017-03-22
    • EP15792812.8
    • 2015-03-25
    • Corning Precision Materials Co., Ltd.
    • OH, Yoon SeukLEE, Ki YeonMOON, Hyung SooKIM, Bo MiKIM, Jhee MannPARK, Cheol MinYANG, Choon Bong
    • H01L33/50
    • H01L33/507H01L33/50H01L33/501H01L33/62H01L2224/16225H01L2933/0041H01L2933/0066
    • The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package.
    • 本发明涉及一种用于制造发光二极管封装的方法,更具体地说涉及一种不需要另外的颜色转换玻璃料热处理工艺的发光二极管封装的制造方法和在 彩色转换玻璃料和发光二极管芯片。 为此,本发明提供了一种制造发光二极管封装的方法,其特征在于,本发明包括:一种颜色转换玻璃料形成步骤,用于形成其中在基板上包含磷光体的颜色转换玻璃料; 色转换玻璃料转印步骤,用于将形成在基板上的颜色转换玻璃从基板转印到转印膜; 以及将转印膜上转印的转色玻璃料接合到发光二极管封装上的变色玻璃料接合工序。