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    • 3. 发明授权
    • LED road lamp holder structure
    • LED-Straßenlampenhalterungsstruktur
    • EP2228598B1
    • 2011-06-22
    • EP09003489.3
    • 2009-03-10
    • CPUMATE INC.Golden Sun News Techniques Co., Ltd.
    • Lin, Kuo-LenLin, Chen-HsiangWang, Hwai-MingHuang, Chiao-LiHsu, KenCheng, Chih-Hung
    • F21V29/00F21S8/08
    • F21V29/51F21V15/01F21V29/004F21V29/713F21V29/767F21V29/83F21W2131/103F21Y2105/10F21Y2115/10
    • A road lamp holder structure includes a lamp guard (1), an LED unit (2) installed at the bottom of the lamp guard (1), and a heat dissipating device (3) installed in lamp guard (1) and having a base (30), a vapor chamber (31) and two heat dissipating elements (32) attached to the LED unit (2). The vapor chamber (31) includes a heated section (310) attached onto the base (30), two heat transmitting sections (311) bent and extended upward from both sides of the heated section (310) respectively, a condensing section (312) bent and extended laterally from each of the two heat transmitting sections (311), two heat dissipating elements (32) having a heated base (320), and heat dissipating fins (321) disposed on the heated base (320). The two heated bases (320) are attached onto external sides of the two heat transmitting sections (311) of the vapor chamber (31) respectively, and the two condensing sections (312) of the vapor chamber (31) are attached to the internal periphery of the top of the lamp guard (1).
    • 路灯支架结构包括:灯罩(1),安装在灯罩(1)底部的LED单元(2);以及安装在灯罩(1)中的散热装置(3) (30),蒸气室(31)和两个附接到LED单元(2)的散热元件(32)。 蒸气室(31)包括附接到基座(30)上的加热部分(310),分别从加热部分(310)的两侧向上弯曲和延伸的两个热传递部分(311),冷凝部分(312) 从每个两个传热部分(311)侧向弯曲并延伸,具有加热基座(320)的两个散热元件(32)和设置在被加热的基座(320)上的散热翅片(321)。 两个加热基座(320)分别安装在蒸气室(31)的两个传热部分(311)的外侧上,并且蒸气室(31)的两个冷凝部分(312)附接到内部 灯罩(1)顶部的周边。
    • 5. 发明公开
    • LED lighting device capable of uniformly dissipating heat
    • 紫外线照明灯LED-Beleuchtungsvorrichtung
    • EP2244002A1
    • 2010-10-27
    • EP09005729.0
    • 2009-04-23
    • CPUMATE INC.Golden Sun News Techniques Co., Ltd.
    • Lin, Kuo-LenLin, Chen-HsiangHung, Mong-HuaHuang, Chiao-LiHsu, KenCheng, Chih-Hsung
    • F21S8/08F21V29/00F21Y101/02
    • F21V29/51F21S8/086F21V15/01F21V29/717F21V29/763F21V29/83F21W2131/103F21Y2115/10
    • An LED lighting device (1) with a heat dissipating structure is disclosed. The LED lighting device (1) includes a lamp base (20) coupled with a top cover (10) to form an accommodating space (100) for accommodating a first heat dissipating module (30) and a second heat dissipating module (40). The first heat dissipating module (30) includes a first heat-conducting plate (31), a first heat pipe (32a) and a first heat dissipater (33a). An LED lighting module (50) is connected with the first heat-conducting plate (31), in which an evaporator section (321 a) of the first heat pipe (32a) is disposed thereon. The first heat dissipater (33a) is arranged on a condenser section (322a) of the first heat pipe (32a), and the second heat dissipating module (40) includes a second heat-conducting plate (41) and a second heat pipe (42a). The second heat-conducting plate (41) paralleling to the first heat-conducting plate (31) is connected with the LED lighting module (50). An evaporator section (421a) of the second heat pipe (42a) is disposed on the second heat-conducting plate (41), and whose condenser section (422a) is connected with an inner surface (101) of the top cover (10). Whereby, the heat generated from the LED lighting module (50) can be dissipated uniformly and rapidly.
    • 公开了一种具有散热结构的LED照明装置(1)。 LED照明装置(1)包括与顶盖(10)联接以形成用于容纳第一散热模块(30)和第二散热模块(40)的容纳空间(100)的灯座(20)。 第一散热模块(30)包括第一导热板(31),第一热管(32a)和第一散热器(33a)。 LED照明模块(50)与设置有第一热管(32a)的蒸发器部(321a)的第一导热板(31)连接。 第一散热器(33a)设置在第一热管(32a)的冷凝器部(322a)上,第二散热模块(40)包括第二导热板(41)和第二热管 42A)。 与第一导热板(31)并联的第二导热板(41)与LED照明模块(50)连接。 第二热管(42a)的蒸发器部分(421a)设置在第二导热板(41)上,其冷凝器部分(422a)与顶盖(10)的内表面(101)连接, 。 由此,可以均匀且快速地散发从LED照明模块(50)产生的热量。
    • 7. 发明公开
    • Heat-Dissipating Device for Supplying Cold Airflow
    • 用于提供冷气流的散热装置
    • EP2363881A1
    • 2011-09-07
    • EP10155050.7
    • 2010-03-01
    • CPUMATE INC.Golden Sun News Techniques Co., Ltd.
    • Lin, Kuo-LenLin, Chen-HsiangHsu, KenCheng, Chih-Hung
    • H01L23/367H01L23/38H01L23/427H01L23/467F28D15/02F28F1/12G06F1/20H05K7/20
    • H01L23/427F28D15/00F28D15/0275F28F2013/001G06F1/20H01L23/3675H01L23/38H01L23/467H01L2924/0002H01L2924/00
    • The present invention relates to a heat-dissipating device (1) including a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
    • 本发明涉及包括壳体(10)和设置在壳体(10)内的绝热板(20)的散热装置(1)。 隔热板20将壳体10的内部分隔成第一容纳空间101和第二容纳空间102。 壳体10的热空气出口121和第一进气口122与第一容置空间101连通。 壳体(10)的冷气出口(110)和第二进气口(123)与第二容置空间(102)连通。 热电冷却片(30)设置在绝热板(20)的通孔(200)中,并具有面向第一容纳空间(101)的热端表面(31)和冷端表面( 面向第二容纳空间(102)。 散热模块40收容于第一容置空间101内。 冷气流供应模块(50)容纳在第二容纳空间(102)中。 由热端面(31)产生的热量通过散热模块(40)的热传导而散发至热空气出口(121)。 由冷端表面(32)产生的冷气由冷气流供应模块(50)均匀地传导并分配到冷气出口(110)。
    • 9. 发明公开
    • Cooler with ground heated plane and grinding method and apparatus thereof
    • LÄPPVORRICHTUNG
    • EP2260977A1
    • 2010-12-15
    • EP09007778.5
    • 2009-06-12
    • CPUMATE INC.Golden Sun News Techniques Co., Ltd.
    • Lin, Kuo-LenLin, Chen-HsiangLiu, Jui-HoHsu, KenCheng, Chih-Hung
    • B24B37/04H05K7/20
    • B24B37/042B24B37/30
    • The invention is to provide a method for making heated plane (34, 34', 42) of cooler (30, 30', 40) obtain better flatness and roughness. First, grinder (10) and fixture (20), with grinding plate (11), are provided. Then, the cooler (30, 30', 40) is arranged onto the fixture (20). Next, abrasive (132) is injected into the gap between the grinding plate (11) and the heated plane (34, 34', 42), making the fixture (20) press and clamp the cooler (30, 30', 40) in a way, such that the heated plane (34, 34', 42) of the cooler (30, 30', 40) contacts the abrasive (132) closely. Finally, the grinding plate (11) is rotated to make at least one grinding process to the heated plane (34, 34', 42), making the heated plane (34, 34', 42) obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane (34, 34', 42) and a heating element, and therefore promoting the thermally conductive efficiency between the cooler (30, 30', 40) and the heating element.
    • 本发明提供一种使冷却器(30,30',40)的加热平面(34,34',42)获得更好的平整度和粗糙度的方法。 首先,提供具有研磨板(11)的研磨机(10)和夹具(20)。 然后,将冷却器(30,30',40)设置在固定装置(20)上。 接下来,研磨剂(132)被注入到研磨板(11)和加热平面(34,34',42)之间的间隙中,使夹具(20)压紧和夹紧冷却器(30,30',40) 以这样的方式,使得冷却器(30,30',40)的加热平面(34,34',42)紧密接触磨料(132)。 最后,研磨板(11)旋转以对加热平面(34,34',42)进行至少一次研磨处理,使得加热平面(34,34',42)获得具有更好的粗糙度和平坦度的表面 进一步提高加热面(34,34',42)与加热元件之间的接触紧密度,从而提高冷却器(30,30',40)与加热元件之间的导热效率。