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1. 发明公开

EP4174963A1 LIGHT EMITTING DIODE SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS 审中-实审
公开(公告)号：EP4174963A1
公开(公告)日：2023-05-03
申请号：EP20959255.9
申请日：2020-10-30
申请人： BOE Technology Group Co., Ltd.
发明人： LI, Haixu , ZHANG, Xiao , WANG, Fei , WANG, Mingxing , LI, Shulei , DONG, Xue , YUAN, Guangcai , CAO, Zhanfeng , GU, Xin , WANG, Ke , QU, Feng , LIANG, Xuan , YAN, Junwei
IPC分类号： H01L33/00 , H01L27/15
摘要： A light emitting diode substrate and a manufacturing method therefor, and a display apparatus. The manufacturing method for the light emitting diode substrate comprises: forming epitaxial layer groups of M light emitting diode chips on substrates; transferring, onto an intermediate carrier substrate, N epitaxial layer groups on N substrates, wherein the N epitaxial layer groups on the N substrates are densely arranged on the intermediate carrier substrate; and transferring, onto a driving substrate, at least some of N ∗ M light emitting diode chips corresponding to the N epitaxial layer groups on the intermediate carrier substrate, wherein the area of the intermediate carrier substrate is greater than or equal to the sum of the area of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2. Therefore, the manufacturing method for the light emitting diode substrate can greatly improve the taking and using efficiency, and the transferring efficiency.

2. 发明公开

EP4006890A1 DRIVING SUBSTRATE, FABRICATION METHOD THEREFOR AND DISPLAY APPARATUS 审中-实审
公开(公告)号：EP4006890A1
公开(公告)日：2022-06-01
申请号：EP20894918.0
申请日：2020-05-13
申请人： BOE Technology Group Co., Ltd.
发明人： CAO, Zhanfeng , LIU, Yingwei , WANG, Ke , LIU, Dongni , XUAN, Minghua , YUAN, Guangcai , CHEN, Lei , DONG, Xue
IPC分类号： G09G3/32
摘要： The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device, and belongs to the technical field of display. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each of the plurality of first pads being connected to a first electrode of the corresponding driving thin film transistor and each of the plurality of second pads being connected to a common electrode line in the plurality of signal wirings. Using the technical solution of the present disclosure, the number of patterning processes for preparing the driving substrate can be reduced.

3. 发明公开

EP3916785A1 DISPLAY SUBSTRATE, TILED SCREEN AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：EP3916785A1
公开(公告)日：2021-12-01
申请号：EP19911581.7
申请日：2019-10-08
申请人： BOE Technology Group Co., Ltd.
发明人： LIU, Yingwei , LIANG, Shuang , LIANG, Zhiwei , DI, Muxin , WANG, Ke , CAO, Zhanfeng
IPC分类号： H01L27/12 , H01L27/15 , H01L21/77
摘要： A display substrate, a tiled screen and a manufacturing method therefor, relating to the technical field of display devices. The display substrate comprises a flexible base (1); a plurality of signal lines, wherein the plurality of signal lines are located on one side of the flexible base (1); a plurality of electroplated electrodes (2), wherein the electroplated electrodes (2) are located on the faces of the signal lines facing the flexible base (1), and are electrically connected to the signal lines on a one-to-one basis; a plurality of first through holes, wherein the first through holes correspond to the electroplated electrodes (2) on a one-to-one basis, the first through holes run through the flexible base (1) and expose the electroplated electrodes (2), and the first through holes are filled with a conductive material (4); and a plurality of bound electrodes (5), wherein the bound electrodes (5) are located on the face of the flexible base (1) facing away from the signal lines, and correspond to the first through holes on a one-to-one basis, and each of the bound electrodes (5) is electrically connected to the corresponding electroplated electrode (2) via the conductive material (4) in the corresponding first through hole.

4. 发明公开

EP4199094A1 DISPLAY BACKPLANE AND PRODUCTION METHOD THEREFOR, AND DISPLAY DEVICE 审中-实审
公开(公告)号：EP4199094A1
公开(公告)日：2023-06-21
申请号：EP21868370.4
申请日：2021-08-16
申请人： BOE Technology Group Co., Ltd.
发明人： CHEN, Liang , WANG, Ke , ZHENG, Haoliang , XUAN, Minghua , LIU, Dongni , CHEN, Hao , QI, Qi
IPC分类号： H01L27/15
摘要： A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.

5. 发明公开

EP4002467A1 DISPLAY SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE 审中-公开
公开(公告)号：EP4002467A1
公开(公告)日：2022-05-25
申请号：EP19944648.5
申请日：2019-10-12
申请人： BOE Technology Group Co., Ltd.
发明人： DI, Muxin , WANG, Ke , WANG, Guoqiang , LIANG, Zhiwei , GU, Renquan , LIU, Yingwei , YAO, Qi , CAO, Zhanfeng
IPC分类号： H01L27/12 , H01L21/77
摘要： The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

6. 发明公开

EP3985744A1 MASS TRANSFER METHOD AND SYSTEM FOR MICRO LIGHT-EMITTING DIODE 审中-实审
公开(公告)号：EP3985744A1
公开(公告)日：2022-04-20
申请号：EP19931500.3
申请日：2019-06-13
申请人： BOE Technology Group Co., Ltd.
发明人： DONG, Xue , YUAN, Guangcai , LV, Zhijun , LI, Haixu , LIANG, Zhiwei , WANG, Huijuan , WANG, Ke , CAO, Zhanfeng , MAI, Hsuanwei
IPC分类号： H01L33/00 , H01L27/15
摘要： The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

7. 发明公开

EP3516453A1 THIN FILM TRANSISTOR, DISPLAY SUBSTRATE AND DISPLAY PANEL HAVING THE SAME, AND FABRICATING METHOD THEREOF 无效
公开(公告)号：EP3516453A1
公开(公告)日：2019-07-31
申请号：EP16894805.7
申请日：2016-09-21
申请人： BOE Technology Group Co., Ltd.
发明人： WANG, Ke , NING, Ce
IPC分类号： G02F1/1343 , G02F1/13363 , H01L21/77

8. 发明公开

EP4089733A1 DISPLAY PANEL AND DISPLAY DEVICE 审中-实审
公开(公告)号：EP4089733A1
公开(公告)日：2022-11-16
申请号：EP20866952.3
申请日：2020-01-10
申请人： BOE Technology Group Co., Ltd.
发明人： CHEN, Liang , XUAN, Minghua , LIU, Dongni , ZHENG, Haoliang , XIAO, Li , ZHANG, Zhenyu , CHEN, Hao , WANG, Ke
IPC分类号： H01L27/12 , H01L21/77 , H01L27/32 , G02F1/133
摘要： The present disclosure discloses a display panel and a display device. The display panel includes: a base substrate, including a plurality of substrate via holes located in a display area of the display panel; and a plurality of driving signal lines and a plurality of bonding terminals, respectively located on different sides of the base substrate. At least one of the plurality of driving signal lines is electrically connected to at least one of the plurality of bonding terminals through the substrate via hole(s).

9. 发明公开

EP4016630A1 DISPLAY BACKPLANE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE 审中-公开
公开(公告)号：EP4016630A1
公开(公告)日：2022-06-22
申请号：EP19932246.2
申请日：2019-08-16
申请人： BOE Technology Group Co., Ltd.
发明人： LIANG, Zhiwei , LIU, Yingwei , YUE, Han , XUAN, Minghua , MAI, Hsuanwei , CAO, Zhanfeng , WANG, Ke , WANG, Huijuan , YUAN, Guangcai , LV, Zhijun , LU, Xinhong
IPC分类号： H01L27/15 , H01L33/38
摘要： A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

10. 发明公开

EP3910679A1 FLEXIBLE SUBSTRATE AND METHOD FOR PREPARING SAME, AND DISPLAY DEVICE 有权
公开(公告)号：EP3910679A1
公开(公告)日：2021-11-17
申请号：EP19908939.2
申请日：2019-12-13
申请人： BOE Technology Group Co., Ltd.
发明人： BAN, Shengguang , CAO, Zhanfeng , WANG, Ke
IPC分类号： H01L27/32
摘要： Disclosed are a flexible substrate and a method for preparing same, and a display device, wherein same are used for improving the packaging effect and the product yield. The flexible substrate comprises a base substrate (1), wherein the base substrate (1) has a plurality of sub-pixel regions (2) arranged in an array, and a connecting region (3) located between the sub-pixel regions (2) and used for connecting adjacent sub-pixel regions (2), and the base substrate (1) between the sub-pixel regions (2), apart from the connecting region (3), is a hollowed-out region (4). A pixel circuit (5), an isolation structure (6) surrounding the pixel circuit (5), and a light-emitting function layer (7) covering the pixel circuit (5) and the isolation structure (6) are provided in each of the sub-pixel regions (2), wherein the isolation structure (6) has a hollowed-out pattern (29) close to an interface between the sub-pixel region (2) and the connecting region (3). A signal line (31) is provided in the connecting region (3), wherein the signal line (31) is electrically connected to the pixel circuit (5) by means of the hollowed-out pattern (29). The isolation structure (6) has a recess (8) for the disconnection of the light-emitting function layer (7).

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