专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0412891A2 Metal-powder filled epoxy resin mold and method of producing the same 失效
标题翻译：形成ausmetallpulvergefülltemEpoxyharz und Verfahren zu deren Herstellung。
公开(公告)号：EP0412891A2
公开(公告)日：1991-02-13
申请号：EP90402242.3
申请日：1990-08-03
申请人： NISSAN MOTOR CO., LTD. , ASAHI KASEI KOGYO KABUSHIKI KAISHA
发明人： Nomura, Hideo , Yamaguchi, Nobuyuki , Ishimura, Hidekazu , Takagi, Isao
IPC分类号： B29C33/38 , B29C33/40 , B29C70/02
CPC分类号： B29C33/3807 , B29C33/3842 , B29C70/58 , B29C70/64 , B29K2105/16 , B29K2705/00 , B29K2863/00 , C08K3/08 , C08L63/00
摘要： In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member (106) of metal. In this case, the bonding between the mold and the back-up member (106) is much assured when metal balls (50) are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a condutive plastic paint before being subjected to the electric metal plating in an electrolytic solution.
摘要翻译：为了提高热固性树脂的模具的性能，金属粉末分散在具有致密且无空隙结构的树脂模具中。模具可以安装在金属的支撑构件（106）上。在这种情况下，当金属球（50）被包含在支撑构件附近的模具中时，模具和支撑构件（106）之间的结合是非常有保证的。此外，模具可以是电镀金属的。在这种情况下，在电解液中进行电镀金属电镀之前，模具涂覆有塑料涂料。

2. 发明授权

EP0425677B1 CONDUCTIVE PASTE COMPOSITION AND CURING THEREOF 失效
标题翻译：导电浆料组合物及其网络。
公开(公告)号：EP0425677B1
公开(公告)日：1995-07-12
申请号：EP90902390.5
申请日：1990-01-29
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Otsuka, Masahiko , Ishimura, Hidekazu , Masui, Yuji
IPC分类号： C09D5/00
CPC分类号： B05D3/02 , B05D3/068 , C09D5/24 , H05K1/095
摘要： This invention discloses a method for curing a coating formed of a conductive paste composition comprising a fine conductive powder and a resin which is curable by irradiating with electron beams or by heating, and a conductive paste composition usable in this methods.

3. 发明公开

EP0055477A3 Aqueous dispersion compositions 有权
标题翻译：水分散体组成
公开(公告)号：EP0055477A3
公开(公告)日：1982-09-08
申请号：EP81110753
申请日：1981-12-23
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Kakutani, Yoshimi , Aoyagi, Naohisa
IPC分类号： C08G59/16 , C08F283/10 , C08L63/10 , C09D03/00 , C09D03/58 , C09J03/00 , C09J03/16
CPC分类号： C09D4/00 , C08F299/026 , C08L63/10 , C09J4/00 , C08L2666/02 , C08F220/00 , C08F220/26
摘要： An aqueous dispersion composition is described, which is prepared by uniformly mixing (A) a mixture of aromatic compounds having an average of at least 0.5 epoxy groups and from 0.1 to 1.5 acryloyl or methacryloyl groups in the molecule, and (B) at least one ethylenic monomer, and then polymerizing the mixture. In other embodiments, the composition can contain a polyamine-based hardener, and additionally, a resin, e.g. a phenol resin and a terpene resin. This composition has excellent storage stability and can provide a coating film having excellent water resistance, heat resistance, and adhesiveness.

4. 发明公开

EP0055477A2 Aqueous dispersion compositions 有权
标题翻译：水性分散体的组合物。
公开(公告)号：EP0055477A2
公开(公告)日：1982-07-07
申请号：EP81110753.1
申请日：1981-12-23
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Kakutani, Yoshimi , Aoyagi, Naohisa
IPC分类号： C08G59/16 , C08F283/10 , C08L63/10 , C09D3/00 , C09D3/58 , C09J3/00 , C09J3/16
CPC分类号： C09D4/00 , C08F299/026 , C08L63/10 , C09J4/00 , C08L2666/02 , C08F220/00 , C08F220/26
摘要： An aqueous dispersion composition is described, which is prepared by uniformly mixing (A) a mixture of aromatic compounds having an average of at least 0.5 epoxy groups and from 0.1 to 1.5 acryloyl or methacryloyl groups in the molecule, and (B) at least one ethylenic monomer, and then polymerizing the mixture. In other embodiments, the composition can contain a polyamine-based hardener, and additionally, a resin, e.g. a phenol resin and a terpene resin. This composition has excellent storage stability and can provide a coating film having excellent water resistance, heat resistance, and adhesiveness.

5. 发明授权

EP0412891B1 Metal-powder filled epoxy resin mold and method of producing the same 失效
标题翻译：环氧树脂的Metallpulvergefülltem形式，和它们的制备方法
公开(公告)号：EP0412891B1
公开(公告)日：1996-07-17
申请号：EP90402242.3
申请日：1990-08-03
申请人： NISSAN MOTOR CO., LTD. , ASAHI KASEI KOGYO KABUSHIKI KAISHA
发明人： Nomura, Hideo , Yamaguchi, Nobuyuki , Ishimura, Hidekazu , Takagi, Isao
IPC分类号： B29C33/38 , B29C33/40 , B29C70/02
CPC分类号： B29C33/3807 , B29C33/3842 , B29C70/58 , B29C70/64 , B29K2105/16 , B29K2705/00 , B29K2863/00 , C08K3/08 , C08L63/00

6. 发明公开

EP0241133A2 Polymaleimide compound and a composition containing the same 失效
标题翻译：聚合物聚合物聚合物
公开(公告)号：EP0241133A2
公开(公告)日：1987-10-14
申请号：EP87301901.2
申请日：1987-03-05
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Otsuka, Masahiko Asahi Kasei Otaka Apartment 1-204 , Ishimura, Hidekazu
IPC分类号： C08G73/12 , C08G65/00 , C08G73/10 , C08L61/02 , C08L63/00 , C08L79/08 , C08L79/04
CPC分类号： C07D207/448 , C08G8/28 , C08G59/4042 , C08G59/56 , C08G73/124 , H05K1/0346
摘要： A novel polymaleimide compound is represented by the formula (a)
wherein X is a group containing aromatic rings and ether linkages.
The polymaleimide compound has a curability comparable to that of an epoxy resin. In addition, a cured product prepared from the polymaleimide compound is excellent in heat resistance and adhesion property and has a low linear expansion coefficient than an epoxy resin. The above-mentioned excellent characteristics of the present polymaleimide compound are never observed with respect to conventional maleimide resins. There is also provided specific compositions containing the polymaleimide compound and compounds containing active hydrogen atoms, optionally mixed with epoxy resins.
摘要翻译：一种新的聚马来酰亚胺化合物由式（a）表示：其中X是含有芳环和醚键的基团。聚马来酰亚胺化合物具有与环氧树脂相当的固化性。此外，由聚马来酰亚胺化合物制备的固化产物的耐热性和粘合性优异，并且具有比环氧树脂低的线性膨胀系数。相对于常规的马来酰亚胺树脂，从未观察到本发明的聚马来酰亚胺化合物的上述优异特性。还提供了含有聚马来酰亚胺化合物和含有活性氢原子的化合物的特定组合物，任选与环氧树脂混合。

7. 发明公开

EP0193068A1 One liquid type epoxy resin composition 失效
标题翻译： FlüssigeEpoxydharzzusammensetzung eines Typs。
公开(公告)号：EP0193068A1
公开(公告)日：1986-09-03
申请号：EP86101998.2
申请日：1986-02-17
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Ohtsuka, Masahiko , Yamamura, Hideo
IPC分类号： C08G59/18 , C08G59/50 , C08G59/56 , C08J5/24
CPC分类号： C08G59/18 , C08G59/50 , C08G59/56
摘要： @ The present invention provides a one-liquid type epoxy resin composition which is useful especially as a coating material and adhesive for a wide range of applications. The resin composition comprises

(1) an epoxy resin (A) containing at least an average of two epoxy groups per molecular unit; and
(2) a curing agent (B) consisting essentially of a powdery amine compound (C) having a softening point of 50 to 150°C, the particles of said powdery amine compound being coated with at least one of the following layers:

(i) a layer formed by adhesion to the surface of said particles of at least one compound selected from the group consisting of an isocyanate (D), a carboxylic acid (E), a carboxylic acid anhydride (F), an acid halogenated compound (G) and an epoxy compound (H); and
(ii) a layer formed by covalent bonding of the powdery amine compound (C) with at least one compound selected from the group consisting of an isocyanate (D), a carboxylic acid (E), a carboxylic acid anhydride (F), an acid halogenated compound (G) and an epoxy compound (H);

the softening temperature of said curing agent (B) being 5 to 50°C higher than the softening temperature of said powdery amine compound (C).
摘要翻译：本发明提供一种单液型环氧树脂组合物，其特别用作涂料和用于广泛应用的粘合剂。树脂组合物包含（1）每分子单元至少含有两个环氧基的环氧树脂（A）; 和（2）基本上由软化点为50-150℃的粉末状胺化合物（C）组成的固化剂（B），所述粉末状氨基化合物的颗粒被涂覆有以下至少一层：（ i）通过粘附至所述颗粒表面的至少一种选自异氰酸酯（D），羧酸（E），羧酸酐（F），酸卤化化合物（D） G）和环氧化合物（H）; 和（ii）通过粉末状胺化合物（C）与至少一种选自异氰酸酯（D），羧酸（E），羧酸酐（F），酸卤化化合物（G）和环氧化合物（H）; 所述固化剂（B）的软化温度比所述粉末状氨基化合物（C）的软化温度高5〜50℃。

8. 发明授权

EP0304503B1 Hardener for curable one-package epoxy resin system 有权
标题翻译：可固化单组分环氧树脂体系的固化剂
公开(公告)号：EP0304503B1
公开(公告)日：1994-06-29
申请号：EP87112414.5
申请日：1987-08-26
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Otsuka, Masahiko , Takahashi, Yasushi , Ishikawa, Tadayoshi
IPC分类号： C08G59/18 , C08J3/24
CPC分类号： C08J3/226 , C08G59/18 , C08G59/184 , C08J2363/00 , C08J2463/00 , Y10S525/936

9. 发明公开

EP0304503A1 Hardener for curable one-package epoxy resin system 有权
标题翻译：可固化单组分环氧树脂体系的固化剂
公开(公告)号：EP0304503A1
公开(公告)日：1989-03-01
申请号：EP87112414.5
申请日：1987-08-26
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Otsuka, Masahiko , Takahashi, Yasushi , Ishikawa, Tadayoshi
IPC分类号： C08G59/18 , C08J3/24
CPC分类号： C08J3/226 , C08G59/18 , C08G59/184 , C08J2363/00 , C08J2463/00 , Y10S525/936
摘要： A master batch of hardener for curable one-package epoxy resin system which comprises (I) a hardener consisting of

(I) a hardener consisting of

(i) a powder of an amine compound (A) as a core having at least one tertiary amino group in the molecule while having no primary and secondary amino groups, the powder having both a group (X) capable of absorbing infrared rays of 1630 to 1680 cm⁻¹ in wave length and a group (Y) capable of absorbing infrared rays of 1680 to 1725 cm⁻¹ in wave length at least on the surface of the powder, and
(ii) a reaction product of the amine compound (A) and an epoxy resin as a shell; and

(II) an epoxy resin (B) in a ratio of 10 to 50,000 parts by weight to 100 parts by weight of the hardener (I).
A hardener containing the master batch is also disclosed.
摘要翻译：一种用于可固化单包装环氧树脂体系的硬化剂母料，其包含（I）由（I）硬化剂组成的硬化剂，所述硬化剂由（i）作为核心的胺化合物（A）的粉末具有至少一个叔氨基基团，同时不具有伯和仲氨基，粉末具有能够吸收波长为1630至1680cm -1的红外线的基团（X）和能够吸收1680的红外线的基团（Y）（ii）胺化合物（A）和作为壳的环氧树脂的反应产物;和（ii）胺化合物（A）和作为壳的环氧树脂的反应产物。和（II）相对于100重量份硬化剂（I）为10至50,000重量份的环氧树脂（B）。还公开了包含母料的硬化剂。

10. 发明授权

EP0055477B1 Aqueous dispersion compositions 有权
标题翻译：水分散体组成
公开(公告)号：EP0055477B1
公开(公告)日：1987-12-16
申请号：EP81110753.1
申请日：1981-12-23
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Ishimura, Hidekazu , Kakutani, Yoshimi , Aoyagi, Naohisa
IPC分类号： C08G59/16 , C08F283/10 , C08L63/10 , C09D3/00 , C09D3/58 , C09J3/00 , C09J3/16
CPC分类号： C09D4/00 , C08F299/026 , C08L63/10 , C09J4/00 , C08L2666/02 , C08F220/00 , C08F220/26

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式