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    • 6. 发明公开
    • Electronic System
    • Elektronisches系统
    • EP2056659A1
    • 2009-05-06
    • EP08157001.2
    • 2008-05-27
    • ABB Research LTD
    • Yesin, BerkAgostini, Bruno
    • H05K7/20
    • H05K7/20336
    • The invention relates to an electronic system including a plurality of electronic components (11, 12, 13). Each of the electronic components (11, 12, 13) generates an individual amount of heat. The heat is dissipated by means of a common airflow (10). At least one of the plurality of electronic components (12, 13) is in thermal contact with an evaporator section (16) of a two-phase cooling circuit (15). The two-phase cooling circuit (15) transfers the heat generated by this at least one electronic component (12, 13) being in thermal contact therewith to a location in the airflow (10) distant from the location where the heat is generated.
    • 本发明涉及一种包括多个电子部件(11,12,13)的电子系统。 每个电子部件(11,12,13)产生单独的热量。 热量通过共同的气流(10)消散。 所述多个电子部件(12,13)中的至少一个与两相冷却回路(15)的蒸发器部分(16)热接触。 两相冷却回路(15)将由该热源接触的至少一个电子部件(12,13)产生的热量传递到远离发生热量的位置的气流(10)中的位置。
    • 8. 发明公开
    • Cooling apparatus
    • Kühlvorrichtung
    • EP2811251A1
    • 2014-12-10
    • EP13170378.7
    • 2013-06-04
    • ABB Research Ltd.
    • Agostini, BrunoElomaa, HeikkiSundelin, JariLaurila, Risto
    • F28D15/02H05K7/20F28F9/02
    • F28D15/04F28D15/0233F28D15/0266F28D15/0275F28F9/02H05K7/2029
    • The invention relates to an apparatus comprising an evaporator with a base plate (2) having a first surface for receiving a heat load from one or more electric components, tubes (4) that partly penetrate into the base plate (2) via a second surface of the base plate (2) for providing evaporator channels (6) which are embedded into the base plate (2) and condenser channels (7) which are located outside of the base plate (2). In order to obtain a compact and efficient apparatus the connecting parts include hollow sections (8, 9) located within the tubes (4), each hollow section (8, 9) connecting the channels (6, 7) of a tube (4) to each other in the vicinity of an end of the tube (4) in order to allow fluid to flow between the channels (6, 7) of the tube via the hollow section (8, 9).
    • 本发明涉及一种包括具有基板(2)的蒸发器的设备,该基板具有用于从一个或多个电气部件接收热负荷的第一表面,经由第二表面部分地穿透到基板(2)的管(4) 的基板(2),用于提供嵌入基板(2)的蒸发器通道(6)和位于基板(2)外侧的冷凝器通道(7)。 为了获得紧凑有效的装置,连接部分包括位于管(4)内的中空部分(8,9),每个中空部分(8,9)连接管(4)的通道(6,7) 在管(4)的端部附近彼此相连,以便允许流体经由中空部分(8,9)在管的通道(6,7)之间流动。
    • 9. 发明公开
    • Cooling assembly
    • 冷却组件
    • EP2661165A1
    • 2013-11-06
    • EP12166363.7
    • 2012-05-02
    • ABB Research Ltd.
    • Koivuluoma, TimoAgostini, BrunoHabert, MathieuSiirilä, Jouko
    • H05K7/20
    • F28G1/166F28G1/16H05K7/20181H05K7/202
    • A cooling assembly comprising a device chamber (2), a cooling chamber (4), heat exchanger means, fan means and control means (6), the heat exchanger means comprising a first heat exchanger unit (31) and a second heat exchanger unit (32) located above the first heat exchanger unit (31), the fan means comprising a first fan (52) adapted to generate a first cooling air flow (521). The cooling assembly further comprises a first dust tray (72) located between the first heat exchanger unit (31) and the second heat exchanger unit (32), the first cooling air flow (521) being directed towards the first dust tray (72), the first dust tray (72) being adapted to receive and retain at least part of contaminant particles present in the first cooling air flow (521), the device chamber (2) being separated from the cooling chamber (4).
    • 一种冷却组件,包括装置室(2),冷却室(4),热交换器装置,风扇装置和控制装置(6),热交换器装置包括第一热交换器单元(31)和第二热交换器单元 (32),所述风扇装置包括适于产生第一冷却空气流(521)的第一风扇(52)。 冷却组件还包括位于第一热交换器单元(31)和第二热交换器单元(32)之间的第一灰尘盘(72),第一冷却空气流(521)指向第一灰尘盘(72) ,所述第一尘盘(72)适于接收并保持存在于所述第一冷却空气流(521)中的污染物颗粒的至少一部分,所述装置室(2)与所述冷却室(4)分离。
    • 10. 发明公开
    • Apparatus and method
    • 装置和方法
    • EP2568790A1
    • 2013-03-13
    • EP11180187.4
    • 2011-09-06
    • ABB Research Ltd.
    • Agostini, BrunoHabert, MathieuKauranen, MattiElo, Markku
    • H05K7/20
    • F28F9/00F28D15/0266F28D15/0275F28D20/02F28D2020/0013F28F27/00H05K7/20936H05K7/20945Y02E60/145
    • The invention relates to method for cooling and to an apparatus (1) comprising: a first heat transfer element (2) comprising a base plate (3), with a first surface (4) for receiving an electric component and channels (5) for transferring a heat load received via said first surface (4) into a fluid in said channels (5), at least some of the channels (5) protrude from a second surface (12) of the base plate (3), and a second heat transfer element for receiving fluid from the first heat transfer element and passing a heat load from said fluid to surroundings. In order to obtain an efficient cooling, a phase change material (11) is arranged at a second surface (12) of the base plate (3) between at least two of the channels (5), said phase change material (11) absorbing heat by changing phase at a phase change temperature during operation of said electric component.
    • 本发明涉及一种用于冷却的方法和一种设备(1),包括:第一传热元件(2),其包括基板(3),第一表面(4)用于接收电部件和通道(5),用于 将经由所述第一表面(4)接收的热负载传递到所述通道(5)中的流体中,至少一些通道(5)从基板(3)的第二表面(12)突出,并且第二 传热元件,用于接收来自第一传热元件的流体并将来自所述流体的热负荷传递至周围环境。 为了获得有效的冷却,在至少两个通道(5)之间的基板(3)的第二表面(12)处设置相变材料(11),所述相变材料(11)吸收 通过在所述电气部件的操作期间在相变温度下改变相位来进行加热。