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1. 发明授权

EP0785296B1 Electroplating of nickel on nickel ferrite devices 失效
标题翻译：上镍铁氧体器件电镀镍
公开(公告)号：EP0785296B1
公开(公告)日：2000-03-15
申请号：EP96309396.8
申请日：1996-12-23
申请人： AT&T Corp.
发明人： Law, Henry Hon , Wu, Te-Sung , Schneemeyer, Lynn Frances
IPC分类号： C25D3/12
CPC分类号： C25D3/12

2. 发明公开

EP0698590A3 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590A3
公开(公告)日：1997-04-16
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45
摘要： The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate (20) and depositing a layer of reducible material (30) on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions (40) having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region (42) is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.

3. 发明公开

EP0690461A1 Method for making devices using metallized magnetic substrates 失效
标题翻译： HerstellungsverfahrenfürVorrichtungen mit metallisierten magnetischen Substraten
公开(公告)号：EP0690461A1
公开(公告)日：1996-01-03
申请号：EP95304325.4
申请日：1995-06-21
申请人： AT&T Corp.
发明人： Fleming, Debra Anne , Johnson Jr.,David Wilfred , Lambrecht Jr.,Vincent George , Law, Henry Hon , Liptack, David Joseph , Roy, Apurba , Thomson Jr.,John
IPC分类号： H01F17/00 , H01F41/04
CPC分类号： H01F17/0033 , H01F41/046 , H01F2017/004 , H01L21/486 , H05K1/0306 , H05K1/092 , H05K1/115 , H05K3/005 , H05K3/245 , H05K3/403 , H05K3/4061 , H05K2201/09645 , H05K2201/09854 , H05K2203/1476 , Y10T29/4902 , Y10T29/49076 , Y10T29/49165
摘要： The present invention provides novel devices including magnetic components and novel methods for making them. In a first aspect, the invention provides a device comprising a metallized magnetic substrate (e.g., 5) having an aperture (e.g., 50). At least one metallized path (e.g., 20) passes through the aperture and around a portion of the substrate to define a magnetic component which has a flux path in the plane of the substrate and substantially confined within the substrate. The winding can pass around a substrate edge or through a second aperture. Advantageously, other circuit elements such as metallized interconnects (e.g., 55) and electronic components (e.g., 401) are disposed on the substrate to form a device.
In a further aspect, the invention provides methods for metallizing magnetic substrate to form devices including magnetic components. In one embodiment, a green ceramic body (e.g., 5) comprising at least one ceramic layer is provided in an unfired state. At least one aperture (e.g., 50) having at least one conductively coated side wall pathway (e.g., 56) is formed within each ceramic layer. Top and bottom surface portions of the ceramic body are metallized such that the metallized surface portions (e.g., 20) form a continuous conductive region with the side wall conductive pathway to create a conductive winding about the ceramic body. The ceramic body with the conductive winding formed thereon is fired to yield a substrate including a magnetic component. Preferably after sintering, additional metal is plated on the conductive regions to enhance current-carrying capacity.
摘要翻译：本发明提供了包括磁性元件的新型装置及其制造方法。在第一方面，本发明提供一种包括具有孔径（例如50）的金属化磁性基底（例如5）的装置。至少一个金属化路径（例如，20）穿过孔径并围绕衬底的一部分，以限定磁性部件，该磁性部件在衬底的平面中具有通量路径并且基本上限制在衬底内。绕组可以绕过基板边缘或通过第二孔。有利地，诸如金属化互连（例如55）和电子部件（例如，401）的其它电路元件设置在衬底上以形成器件。在另一方面，本发明提供了用于金属化磁性基板以形成包括磁性部件的装置的方法。在一个实施例中，包括至少一个陶瓷层的生坯陶瓷体（例如5）以未燃状态提供。在每个陶瓷层内形成至少一个具有至少一个导电涂覆的侧壁通道（例如56）的孔（例如50）。陶瓷体的顶表面部分和底表面部分被金属化，使得金属化的表面部分（例如20）与侧壁导电通路形成连续的导电区域，以在陶瓷体周围形成导电绕组。在其上形成有导电绕组的陶瓷体被烧制以产生包括磁性部件的基板。优选在烧结之后，在导电区域上镀上附加的金属以增强载流能力。

4. 发明公开

EP0708581A2 A process for the electroless deposition of metal on a substrate 失效
标题翻译：一种用于在基板上无电金属沉积方法
公开(公告)号：EP0708581A2
公开(公告)日：1996-04-24
申请号：EP95307184.2
申请日：1995-10-11
申请人： AT&T Corp.
发明人： Evans, Michael D. , Law, Henry Hon , Kim, Tae Yong , Wu, Te-Sung
IPC分类号： H05K3/18 , C23C18/16 , C23C18/18
CPC分类号： C23C18/1851 , C23C18/1608 , C23C18/1651 , C23C18/1692 , C23C18/1865 , C23C18/1889 , C23C18/32 , C23C18/38 , C23C18/50 , H05K1/0306 , H05K1/16 , H05K1/167 , H05K3/184 , H05K3/24 , H05K3/38 , H05K3/381 , H05K2201/0347 , H05K2203/0565 , H05K2203/1105
摘要： A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface. The substrate surface is then exposed to an electroless plating bath to form nickel onto those portions of the substrate surface that were treated with the sensitizing and activating solutions. The substrate is then heated to at least 180°C. Additional layers of metal are formed on the substrate. After the additional layers are so formed, the substrate is again heated to a temperature of at least about 180°C after each layer is so formed.

5. 发明授权

EP0698590B1 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590B1
公开(公告)日：2003-10-22
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45

6. 发明授权

EP0690035B1 Metallization of ferrites comprising surface reduction 失效
标题翻译：通过表面还原的金属化装置的铁氧体
公开(公告)号：EP0690035B1
公开(公告)日：1999-12-29
申请号：EP95304341.1
申请日：1995-06-21
申请人： AT&T Corp.
发明人： Jin, Sungho , Tiefel, Thomas Henry , Law, Henry Hon , Wu, Te-Sung
IPC分类号： C04B41/51 , C04B41/45
CPC分类号： C04B41/009 , C04B41/4556 , C04B41/4594 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00405 , C04B2111/00844 , H05K1/0306 , H05K3/045 , H05K3/105 , Y10T428/12493 , Y10T428/24917 , Y10T428/31678 , C04B41/4572 , C04B41/53 , C04B41/0072 , C04B41/4519 , C04B41/4517 , C04B41/4558 , C04B35/26 , C04B35/2608

7. 发明公开

EP0700239A1 Articles including solderable zinc surfaces 失效
标题翻译： LötbareZinkoberflächenenthaltende Artikel
公开(公告)号：EP0700239A1
公开(公告)日：1996-03-06
申请号：EP95305910.2
申请日：1995-08-23
申请人： AT&T Corp.
发明人： Degani, Yinon , Law, Henry Hon , Jin, Sungho , McCormack, Mark Thomas
IPC分类号： H05K3/34 , H05K1/09 , H01L23/495 , B23K35/00 , B23K35/26
CPC分类号： H05K3/244 , B23K35/001 , B23K35/262 , H01L2924/0002 , H05K3/3463 , H05K2203/0723 , H01L2924/00
摘要： The present invention relates to solderable surfaces and surface finishes which comprise zinc. An electrical article is provided comprising a non-conductive substrate for supporting electric device elements. At least one electrical device element is disposed on the non-conductive substrate. At least one metallized region is formed on the non-conductive substrate, the metallized region electrically communicating with the electrical device element. The metallized region comprises a layer which includes zinc. Typically, the zinc is provided in the form of a zinc-containing alloy. In a further embodiment, the present invention provides electrical components having an electrical connection element which includes a zinc-containing surface.
摘要翻译：本发明涉及包含锌的可焊接表面和表面光洁度。提供一种电气制品，其包括用于支撑电气装置元件的非导电基底。至少一个电气元件元件设置在非导电基底上。在非导电衬底上形成至少一个金属化区域，金属化区域与电气元件元件电连通。金属化区域包括包含锌的层。通常，锌以含锌合金的形式提供。在另一实施例中，本发明提供了具有包括含锌表面的电连接元件的电气部件。

8. 发明公开

EP0698590A2 Metallization of ceramics through application of an adherent reducible layer 失效
标题翻译：通过将粘合剂层施加还原陶瓷材料的金属化
公开(公告)号：EP0698590A2
公开(公告)日：1996-02-28
申请号：EP95305684.3
申请日：1995-08-15
申请人： AT&T Corp.
发明人： Jin, Sungho , Law, Henry Hon , Johnson, David Wilfred, Jr. , Thomson, John, Jr. , Tiefel, Thomas Henry
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/4558 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00844 , H01L39/2474 , H01L41/29 , H05K1/0306 , H05K3/105 , Y10S428/901 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , C04B41/4572 , C04B41/5027 , C04B41/4519 , C04B41/4578 , C04B41/5025 , C04B41/5194 , C04B2103/0096 , C04B41/4541 , C04B35/10 , C04B35/00 , C04B35/26 , C04B35/45
摘要： The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate (20) and depositing a layer of reducible material (30) on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions (40) having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region (42) is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.
摘要翻译：本发明提供了一种金属化陶瓷基片的改进的技术。该方法包括提供一个陶瓷基板（20）和沉积在陶瓷基板还原材料（30）的层。可还原的材料的层包括一种可还原的陶瓷颜色：如氧化铜。具有材料设置在其上可还原的层中的陶瓷基片被加热和可还原的物质与还原剂接触以产生导电区域。所述导电区是要么通过还原形成的金属化的区域中，或者它是一个导电性陶瓷表面通过还原形成的。本发明还提供一种金属化的陶瓷基片。该金属化层包括具有共同的至少一种成分与所述陶瓷基板的陶瓷区域（40）。陶瓷基板和金属化层的陶瓷区域被烧结以海誓山盟检查做了金属化区域（42）的烧结的陶瓷区域之间散布。以这种方式，所述金属牢固地保持陶瓷基板由于结合的陶瓷的金属化层内的存在。

9. 发明公开

EP0550176A1 Manufacturing method, including etch-rate monitoring 失效
标题翻译： Herstellungsverfahren mitÜberwachungderÄtzgeschwindigkeit。
公开(公告)号：EP0550176A1
公开(公告)日：1993-07-07
申请号：EP92311257.7
申请日：1992-12-10
申请人： AT&T Corp.
发明人： Law, Henry Hon
IPC分类号： C23F1/00
CPC分类号： H05K3/06 , C23F1/00 , H05K1/0269 , H05K2201/09781 , H05K2201/098 , H05K2203/0384 , H05K2203/163
摘要： A method is described for monitoring the rate at which metal layers are chemically etched. The method involves an indicator layer of metal formed on a surface of a monitor substrate. The thickness of the indicator layer varies according to a wedge-shaped profile along a longitudinal axis. The indicator layer is exposed to an etchant medium for a predetermined duration. During such exposure, a portion of the indicator layer is completely removed, exposing the underlying surface and creating an edge 30 between the exposed surface and the remaining portion of the indicator layer. The etching rate is determined by reference to the longitudinal location of the edge.
摘要翻译：描述了用于监测金属层被化学蚀刻的速率的方法。该方法包括在监视器基板的表面上形成的金属的指示层。指示层的厚度根据纵向轴线的楔形轮廓而变化。指示剂层暴露于蚀刻剂介质预定的持续时间。在这种曝光期间，指示剂层的一部分被完全去除，暴露下面的表面并在曝光表面和指示剂层的剩余部分之间产生边缘30。参考边缘的纵向位置来确定蚀刻速率。

10. 发明公开

EP0785296A1 Electroplating of nickel on nickel ferrite devices 失效
标题翻译： Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen
公开(公告)号：EP0785296A1
公开(公告)日：1997-07-23
申请号：EP96309396.8
申请日：1996-12-23
申请人： AT&T Corp.
发明人： Law, Henry Hon , Wu, Te-Sung , Schneemeyer, Lynn Frances
IPC分类号： C25D3/12
CPC分类号： C25D3/12
摘要： This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.
摘要翻译：本发明基于本申请人的发现，常规镀镍浴中的硼酸负责镍铁氧体衬底上镍的电镀过度横向生长。虽然没有硼酸的镍浴不能产生可接受的电沉积，但是硼酸与铁素体衬底相互作用以引起过度的横向生长。申请人进一步发现，通过除去硼酸并加入另一种酸性电镀缓冲液如柠檬酸，可以获得各向同性的镀镍并产生可焊接的表面。

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