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1. 发明公开

EP0512724A2 Acidic palladium strike bath 失效
标题翻译： Saures Bad zum Aufbringen einer Palladiumzwischenschicht。
公开(公告)号：EP0512724A2
公开(公告)日：1992-11-11
申请号：EP92303778.2
申请日：1992-04-27
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Straschil, Heinrich Karl
IPC分类号： C25D3/52 , C25D5/10
CPC分类号： C25D3/52
摘要： This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.
摘要翻译：本发明是一种酸性钯冲洗浴，其改善了钯或钯合金在金属基材上的粘合性和孔隙率，特别是易于钝化的那些，例如镍，铬，青铜和钢。可用于低速和高速电镀操作的酸性钯冲洗浴包括选自有机二胺的络合剂，其pH为2.0-6.0，优选3.7-4.1。当用于容易腐蚀的底物（如铜）时，钯撞击沉积物可以保护部件免受后续主池中的化学侵蚀，并防止其污染。

2. 发明公开

EP0415632A1 Palladium alloy electroplating process 失效
标题翻译： Palladiumlegierung-Elektroplattierungsverfahren。
公开(公告)号：EP0415632A1
公开(公告)日：1991-03-06
申请号：EP90309166.8
申请日：1990-08-21
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Straschil, Heinrich Karl
IPC分类号： C25D3/56
CPC分类号： C25D3/567
摘要： An electroplating process is described for electroplating alloys of palladium and arsenic. The resulting electrodeposits are bright, ductile and remain ductile and crack-free even when the electrodeposits are quite thick The deposits are quite hard and suitable for contact surfaces particularly in situations where wear characteristics require thick deposits. The electroplating process is also useful for making articles such as bellows by electroform procedures particularly since the electroplated material has extraordinary physical properties (good resilience, low stress and ductility) as well as good corrosion resistance.
摘要翻译：描述了用于电镀钯和砷的合金的电镀工艺。所得到的电沉积物是明亮的，延性的并且即使当电沉积物相当厚时也保持韧性和抗裂性。沉积物相当硬并且适合于接触表面，特别是在磨损特征需要厚沉积物的情况下。电镀方法也可用于通过电铸方法制造诸如波纹管的制品，特别是因为电镀材料具有非凡的物理性能（良好的回弹性，低应力和延展性）以及良好的耐腐蚀性。

3. 发明授权

EP0661388B1 Chemical etchant for palladium 失效
标题翻译：钯化学腐蚀剂
公开(公告)号：EP0661388B1
公开(公告)日：2001-07-11
申请号：EP94309195.9
申请日：1994-12-09
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Maisano, Joseph John, Jr. , Straschil, Heinrich Karl
IPC分类号： C23F1/44 , C23F1/40
CPC分类号： C23F1/44

5. 发明授权

EP0415631B1 Electrodeposition of palladium films 失效
标题翻译：电沉积钯层。
公开(公告)号：EP0415631B1
公开(公告)日：1994-05-18
申请号：EP90309165.0
申请日：1990-08-21
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Chinchankar, Vijay , Eckert, Virginia Toohey , Kadija, Igor Veljko , Kudrak, Edward John, Jr. , Maisano, Joseph John, Jr. , Straschil, Heinrich Karl
IPC分类号： C25D3/52 , C25D3/56
CPC分类号： C25D3/52

6. 发明公开

EP0466386A1 Electroplating cell 失效
标题翻译：电镀。
公开(公告)号：EP0466386A1
公开(公告)日：1992-01-15
申请号：EP91306010.9
申请日：1991-07-02
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Kadija, Igor Veljko
IPC分类号： C25D5/04 , G01N27/42
CPC分类号： G01N27/42 , C25D5/04 , C25D17/02 , C25D17/12 , C25D21/12 , Y10S204/07
摘要： Electrodeposition in surface finishing as well as in electroforming can be performed in a broad range of hydrodynamic conditions. In some instances, such as barrel plating, the liquid is barely moving relative to the work piece, while in jet plating the solution moves up to several meters per second relative to the piece to be plated. In such a wide range of hydrodynamic conditions, the selection of appropriate quality control (QC) methods for each particular operation is very critical. The QC method has to resemble the manufacturing operation in terms of the hydrodynamic conditions otherwise the quality control and the functional test for the bath performance have no meaning. Available Hull Cell systems have a limited capability in varying the liquid velocity. At best a relative velocity of up to 20 or perhaps 30 cm/sec can be achieved with uneven distribution.
The invention provides, in electroplaring QC methods for manufacturing, better similarity and relevance between a Hull Cell QC test and a particular plating operation. The invention is a simple and yet functional instrument which can be used to identify the performance of the plating bath prior to manufacturing operation under similar hydrodynamic conditions. The instrument is a rotaring cylinder with a flexible Cu test panel attached to its surface. Like a Hull Cell, a range of current density can be simultaneously applied. Unlike a Hull Cell, the rotating speed of the cylinder and hence the solution agitation is practically unlimited. The operator can identify the operating window for the particular process and apply them to the production line. The instrument has also demonstrated usefulness in developing proprietary electroplating chemistries.

7. 发明授权

EP0583057B1 instrument and method for measuring throwing power of an electrolyte. 失效
标题翻译：用于通过旋转电极来测量的沉积电解液的散射功率的方法和设备
公开(公告)号：EP0583057B1
公开(公告)日：1997-08-20
申请号：EP93304510.6
申请日：1993-06-10
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Kadija, Igor Veljko , Maisano, Joseph, Jr.
IPC分类号： G01N27/42 , C25D21/12
CPC分类号： G01N27/426 , Y10S204/07

8. 发明授权

EP0512724B1 Acidic palladium strike bath 失效
标题翻译：酸浴施加钯中间层。
公开(公告)号：EP0512724B1
公开(公告)日：1995-07-05
申请号：EP92303778.2
申请日：1992-04-27
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Straschil, Heinrich Karl
IPC分类号： C25D3/52 , C25D5/10
CPC分类号： C25D3/52

9. 发明公开

EP0375225A2 Palladium alloy plating process 失效
标题翻译： Verfahren zur Plattierung einer Palladium-Legierung。
公开(公告)号：EP0375225A2
公开(公告)日：1990-06-27
申请号：EP89312859.5
申请日：1989-12-08
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Eckert, Virginia Toohey
IPC分类号： C25D3/52 , C25D3/56
CPC分类号： H05K3/244 , C25D3/52 , C25D3/567
摘要： A process is described for electroplating palladium and palladium alloys. The process involves the use of an alkyl hydroxyamine as complexing agent and is particularly good for palladium alloys such as palladium-nickel and palladium-cobalt.
摘要翻译：描述了用于电镀钯和钯合金的方法。该方法包括使用烷基羟胺作为络合剂，并且对钯合金如钯 - 镍和钯 - 钴特别有利。

10. 发明授权

EP0466386B1 Electroplating cell 失效
标题翻译： Elektroplattierungszelle。
公开(公告)号：EP0466386B1
公开(公告)日：1995-11-08
申请号：EP91306010.9
申请日：1991-07-02
申请人： AT&T Corp.
发明人： Abys, Joseph Anthony , Kadija, Igor Veljko
IPC分类号： C25D5/04 , G01N27/42
CPC分类号： G01N27/42 , C25D5/04 , C25D17/02 , C25D17/12 , C25D21/12 , Y10S204/07

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