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1. 发明公开

EP1830167A2 Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate 审中-公开
标题翻译：与接触层和所述硅衬底之间的共晶金 - 硅晶体层的压力传感器
公开(公告)号：EP1830167A2
公开(公告)日：2007-09-05
申请号：EP07004164.5
申请日：2007-02-28
申请人： ALPS ELECTRIC CO., LTD.
发明人： Fukuda, Tetsuya , Kikuiri, Katsuya , Nakamura, Yoshinobu , Yamauchi,Shigeaki
IPC分类号： G01L9/12
CPC分类号： G01L9/0073 , G01L9/0075
摘要： In the pressure sensor of the invention, since the gold-silicon eutectic crystal layer is interposed between the contact layer and the silicon substrate, that is, since the contact layer and the silicon substrate are connected electrically to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, a Q value of the sensor can be stabilized, and the satisfactory sensor characteristic can be performed. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.
摘要翻译：在本发明的压力传感器中，由于金 - 硅共晶层在接触层和所述硅衬底之间，就是做，由于接触层和所述硅衬底是通过使用金硅电连接到海誓山盟在贴合硅基板和玻璃基板的时间共晶反应，在接触层和所述硅衬底之间的接触电阻可以稳定，可以稳定传感器的Q值，并且能够进行良好的传感器特性。此外，由于接触层和所述硅衬底是由金 - 硅共晶反应彼此结合，接合强度是足够的。

2. 发明公开

EP1780525A1 Capacitive pressure sensor 有权
标题翻译： Kapazitiver Drucksensor
公开(公告)号：EP1780525A1
公开(公告)日：2007-05-02
申请号：EP06022314.6
申请日：2006-10-25
申请人： ALPS ELECTRIC CO., LTD.
发明人： Kikuiri, Katsuya , Sato, Kiyoshi , Fukuda, Tetsuya , Nakamura, Yoshinobu , Kobayashi, Hiroyuki
IPC分类号： G01L9/00
CPC分类号： G01L9/0073
摘要： In a capacitive pressure sensor, a first silicon substrate has a fixed electrode and a projection, and the fixed electrode and the projection pass through the glass substrate to be exposed at one main surface of a glass substrate. The first silicon substrate is bonded to the other main surface of the glass substrate. In the first silicon substrate, the projection is located outside the fixed electrode, and a lead electrode for the fixed electrode is formed at the top surface of the projection. A second silicon substrate that has a pressure-sensitive diaphragm serving as a movable electrode is bonded to a bonded surface of the one main surface of the glass substrate.
摘要翻译：在电容式压力传感器中，第一硅基板具有固定电极和突起，并且固定电极和突起穿过玻璃基板以暴露在玻璃基板的一个主表面。第一硅衬底结合到玻璃衬底的另一个主表面。在第一硅衬底中，突起位于固定电极的外侧，并且在突起的顶表面上形成用于固定电极的引线电极。具有用作可动电极的压敏膜的第二硅衬底被结合到玻璃衬底的一个主表面的接合表面。

3. 发明授权

EP1788372B1 Capacitive pressure sensor 有权
标题翻译：一种电容压力传感器
公开(公告)号：EP1788372B1
公开(公告)日：2013-09-18
申请号：EP06023560.3
申请日：2006-11-13
申请人： ALPS ELECTRIC CO., LTD.
发明人： Fukuda, Tetsuya , Kikuiri, Katsuya , Sato, Kiyoshi , Nakamura, Yoshinobu , Kobayashi, Hiroyuki
IPC分类号： G01L9/00
CPC分类号： G01L9/0073

4. 发明授权

EP1780525B1 Capacitive pressure sensor 有权
标题翻译：一种电容压力传感器
公开(公告)号：EP1780525B1
公开(公告)日：2008-05-07
申请号：EP06022314.6
申请日：2006-10-25
申请人： ALPS ELECTRIC CO., LTD.
发明人： Kikuiri, Katsuya , Sato, Kiyoshi , Fukuda, Tetsuya , Nakamura, Yoshinobu , Kobayashi, Hiroyuki
IPC分类号： G01L9/00
CPC分类号： G01L9/0073

5. 发明公开

EP1788372A2 Capacitive pressure sensor 有权
标题翻译：电容式压力传感器
公开(公告)号：EP1788372A2
公开(公告)日：2007-05-23
申请号：EP06023560.3
申请日：2006-11-13
申请人： ALPS ELECTRIC CO., LTD.
发明人： Fukuda, Tetsuya , Kikuiri, Katsuya , Sato, Kiyoshi , Nakamura, Yoshinobu , Kobayashi, Hiroyuki
IPC分类号： G01L9/12
CPC分类号： G01L9/0073
摘要： A first silicon substrate is bonded to one principal surface of a glass substrate. In a cavity in the other principal surface of the glass substrate, a protruding portion is formed. In the first silicon substrate, a protruding portion is disposed inside the cavity, and a protruding portion is disposed outside the cavity. A fixed electrode is formed on the protruding portion of the glass substrate. On the protruding portion, an electrode pad is formed with a contact layer and a seed layer therebetween. A second silicon substrate that has a diaphragm corresponding to a movable electrode of a capacitive pressure sensor is bonded to a bonding surface of the other principal surface of the glass substrate (region other than a recessed portion).
摘要翻译：第一硅衬底结合到玻璃衬底的一个主表面上。在玻璃基板的另一个主面中的空腔中形成突出部。在第一硅衬底中，突出部分设置在空腔内部，突出部分设置在空腔外部。固定电极形成在玻璃基板的突出部分上。在突出部分上，电极焊盘在其间形成有接触层和种子层。具有与电容式压力传感器的可动电极对应的振动板的第二硅基板与玻璃基板的另一个主面（凹部以外的区域）的接合面接合。

6. 发明公开

EP1830167A3 Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate 审中-公开
标题翻译：与接触层和所述硅衬底之间的共晶金 - 硅晶体层的压力传感器
公开(公告)号：EP1830167A3
公开(公告)日：2010-01-20
申请号：EP07004164.5
申请日：2007-02-28
申请人： ALPS ELECTRIC CO., LTD.
发明人： Fukuda, Tetsuya , Kikuiri, Katsuya , Nakamura, Yoshinobu , Yamauchi,Shigeaki
IPC分类号： G01L9/12 , G01L9/00
CPC分类号： G01L9/0073 , G01L9/0075
摘要： In the pressure sensor of the invention, since the gold-silicon eutectic crystal layer is interposed between the contact layer and the silicon substrate, that is, since the contact layer and the silicon substrate are connected electrically to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, a Q value of the sensor can be stabilized, and the satisfactory sensor characteristic can be performed. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.

7. 发明公开

EP1788372A3 Capacitive pressure sensor 有权
标题翻译：一种电容压力传感器
公开(公告)号：EP1788372A3
公开(公告)日：2009-11-04
申请号：EP06023560.3
申请日：2006-11-13
申请人： ALPS ELECTRIC CO., LTD.
发明人： Fukuda, Tetsuya , Kikuiri, Katsuya , Sato, Kiyoshi , Nakamura, Yoshinobu , Kobayashi, Hiroyuki
IPC分类号： G01L9/00
CPC分类号： G01L9/0073
摘要： A first silicon substrate is bonded to one principal surface of a glass substrate. In a cavity in the other principal surface of the glass substrate, a protruding portion is formed. In the first silicon substrate, a protruding portion is disposed inside the cavity, and a protruding portion is disposed outside the cavity. A fixed electrode is formed on the protruding portion of the glass substrate. On the protruding portion, an electrode pad is formed with a contact layer and a seed layer therebetween. A second silicon substrate that has a diaphragm corresponding to a movable electrode of a capacitive pressure sensor is bonded to a bonding surface of the other principal surface of the glass substrate (region other than a recessed portion).

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