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1. 发明公开

EP2866539A1 Electronic device with waterproof enclosure 有权转让
标题翻译： Elektronische Vorrichtung mit wasserdichtemGehäuse
公开(公告)号：EP2866539A1
公开(公告)日：2015-04-29
申请号：EP13190094.6
申请日：2013-10-24
申请人： ABB Oy
发明人： Huesgen, Till , Schrödl, Christoph , Kearney, Daniel , Riedel, Gernot , Sukanen, Jarmo , Tuomola, Juha , Suomela, Kalle , Kasza, Krzysztof , Malinowski, Lukasz , Matysiak, Lukasz , Nupponen, Mikko , Drofenik, Uwe
IPC分类号： H05K7/20
CPC分类号： H05K7/20945 , H05K5/0091 , H05K7/202 , H05K7/20409 , H05K7/20481 , H05K7/209 , H05K7/20909
摘要： An electronic device comprising electronic components arranged inside a sealed enclosure, the electronic device comprising high-loss high-temperature components and a main heat sink (21), wherein the high-loss high-temperature components of the electronic device are attached to the main heat sink (21), the ribs of which main heat sink are arranged outside the enclosure. A cavity formed inside the enclosure is divided into two or more channel-like sections (41, 42), the sections providing air flow guidance inside the enclosure and being interconnected at their ends, and at least one of the channel-like sections (41) contains electronic components of the electronic device and at least one of the other channel-like sections contains an air-to-air heat exchanger (22, 43) extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one of the channel-like sections are adapted to be cooled by air flow inside the sealed enclosure.
摘要翻译：一种电子设备，包括布置在密封外壳内的电子部件，所述电子设备包括高损耗高温部件和主散热器（21），其中所述电子设备的高损耗高温部件附接到主体散热器（21），其主散热器的肋布置在外壳外部。形成在外壳内部的空腔被分成两个或多个通道状部分（41,42），这些部分在外壳内部提供气流引导并且在它们的端部互连，并且至少一个通道状部分）包含电子设备的电子部件，并且其它通道状部分中的至少一个包含从密封外壳内部延伸到密封外壳外部的空气 - 空气热交换器（22,43），其中电子部件所述至少一个所述通道状部分中的内部适于被所述密封外壳内的空气流冷却。

2. 发明授权

EP2866539B1 Electronic device with waterproof enclosure 有权转让
标题翻译：带防水外壳的电子设备
公开(公告)号：EP2866539B1
公开(公告)日：2018-05-02
申请号：EP13190094.6
申请日：2013-10-24
申请人： ABB Oy
发明人： Huesgen, Till , Schrödl, Christoph , Kearney, Daniel , Riedel, Gernot , Sukanen, Jarmo , Tuomola, Juha , Suomela, Kalle , Kasza, Krzysztof , Malinowski, Lukasz , Matysiak, Lukasz , Nupponen, Mikko , Drofenik, Uwe
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20945 , H05K5/0091 , H05K7/202 , H05K7/20409 , H05K7/20481 , H05K7/209 , H05K7/20909
摘要： An electronic device comprising electronic components arranged inside a sealed enclosure, the electronic device comprising high-loss high-temperature components and a main heat sink (21), wherein the high-loss high-temperature components of the electronic device are attached to the main heat sink (21), the ribs of which main heat sink are arranged outside the enclosure. A cavity formed inside the enclosure is divided into two or more channel-like sections (41, 42), the sections providing air flow guidance inside the enclosure and being interconnected at their ends, and at least one of the channel-like sections (41) contains electronic components of the electronic device and at least one of the other channel-like sections contains an air-to-air heat exchanger (22, 43) extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one of the channel-like sections are adapted to be cooled by air flow inside the sealed enclosure.

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