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2. 发明公开

EP2950343A1 LED LIGHT-EMITTING DEVICE 有权
标题翻译： LICHTEMITTIERENDE LED-VORRICHTUNG
公开(公告)号：EP2950343A1
公开(公告)日：2015-12-02
申请号：EP14743894.9
申请日：2014-01-22
申请人： Zhejiang Zhongzhou Lighting Technology Co., Ltd. , Zheng, Qunliang
发明人： ZHU, Xiaobiao
IPC分类号： H01L25/075 , H01L33/48 , H01L33/62 , H01L33/56
CPC分类号： H01L25/0753 , H01L24/83 , H01L24/97 , H01L25/075 , H01L33/54 , H01L33/62 , H01L33/641 , H01L2224/83805 , H01L2924/01322 , H01L2924/12041 , H01L2924/00
摘要： An LED light-emitting technology, specifically there is provided a LED light-emitting device, comprising: a carrier (11), which is a transparent body, and on a carrying surface of which conductors (30) are provided; a plurality of LED chips (12), which are electrically connected to the conductors (30) by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips (12); an encapsulation structural member (13), which is a transparent body and encapsulates on the periphery of the carrier (11) and the LED chips (12); and a pair of electrodes (20a, 20b), wherein positive electrode/negative electrodes in the pair of electrodes (20a, 20b) are electrically connected to the LED chips (12) located at the most upstream/most downstream of a current transmission in the plurality of LED chips (12) by means of the conductors (30), and extend to the outside of the encapsulation structural member (13). The provided LED light-emitting device not only can improve luminous efficiency of the LED light-emitting device, but also can reduce generation of heat, thus having the characteristics of high luminous efficiency, high reliability, long service life, etc.
摘要翻译：一种LED发光技术，特别是提供了一种LED发光装置，包括：作为透明体的载体（11），设置有导体（30）的承载面; 通过共晶接合与导体（30）电连接的多个LED芯片（12），以实现多个LED芯片（12）之间的电连接。封装结构构件（13），其是透明体并且封装在载体（11）和LED芯片（12）的周边上; 和一对电极（20a，20b），其中所述一对电极（20a，20b）中的正极/负极电连接到位于当前变速器最上游/最下游的LED芯片（12）所述多个LED芯片（12）通过所述导体（30）延伸到所述封装结构构件（13）的外部。所提供的LED发光装置不仅可以提高LED发光装置的发光效率，而且可以减少发热，从而具有发光效率高，可靠性高，使用寿命长等特点。

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