专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP4180483A1 RESIN COMPOSITION, FILM, AND CURED PRODUCT 无效转让
公开(公告)号：EP4180483A1
公开(公告)日：2023-05-17
申请号：EP21837474.2
申请日：2021-07-06
申请人： Showa Denko Materials Co., Ltd.
发明人： YOSHIDA, Kazuhiro , MATSUMOTO, Takuro , NAKAMURA, Koji , ISHIDA, Yasuhisa , YAMAMOTO, Takaya , MIZUNOE, Saori
IPC分类号： C08K5/54 , C08K7/18 , C08L101/02 , C08J5/18 , C08K3/22 , C08K3/36
摘要： A resin composition that contains: a resin that has a polar group; and an insulating filler that, on a volume-based particle size distribution curve, has a particle size of no more than 5.0 µm at an accumulation of 50% from the smaller side and a particle size of no more than 10.0 µm at an accumulation of 99% from the smaller side. The insulating filler is at least 50 volume% of the total solid content of the resin composition.

2. 发明公开

EP4148832A1 NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, AND LITHIUM-ION SECONDARY BATTERY 审中-实审转让
公开(公告)号：EP4148832A1
公开(公告)日：2023-03-15
申请号：EP21935934.6
申请日：2021-04-05
申请人： Showa Denko Materials Co., Ltd.
发明人： TSUCHIYA, Hideyuki , SUGA, Keita
IPC分类号： H01M4/587 , H01M10/0566
摘要： An anode material for a lithium-ion secondary battery, includes a carbon material satisfying the following (1) and (2):
(1) D90/D10 of a particle size on a volume basis is larger than 2.0 and less than 4.3;
(2) N/S, which is a value obtained by dividing a number N of particles with an equivalent circle diameter of 5 µm or less based on a number standard in a total number of measured particles of 10,000, by a specific surface area S determined by nitrogen adsorption measurement at 77 K, is 750 (particles · g/cm 2 ) or more.

3. 发明公开

EP4148824A1 METHOD FOR MANUFACTURING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY AND METHOD FOR MANUFACTURING LITHIUM ION SECONDARY BATTERY 审中-实审转让
公开(公告)号：EP4148824A1
公开(公告)日：2023-03-15
申请号：EP21923021.6
申请日：2021-09-27
申请人： Showa Denko Materials Co., Ltd.
发明人： MATSUMOTO, Yoshiyuki , SAKAMOTO, Takashi , UCHIYAMA, Yoshinori , KUBOTA, Takashi
IPC分类号： H01M4/1393 , H01M4/583 , H01M10/058
摘要： A method of manufacturing an anode material for a lithium-ion secondary battery includes (a) a step of obtaining a mixture containing a graphitizable aggregate, a graphitizable binder, and an aromatic compound; (b) a step of obtaining a molded product with a density of 1.3 g/cm 3 or less by molding the mixture; (c) a step of obtaining a graphitized product by graphitizing the molded product; and (d) a step of obtaining a ground product by grinding the graphitized product.

4. 发明公开

EP4140737A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：EP4140737A1
公开(公告)日：2023-03-01
申请号：EP21822911.0
申请日：2021-06-08
申请人： Showa Denko Materials Co., Ltd.
发明人： NAKAZAWA Takashi , SAKAI Hiroyuki , FUKUI Masato , NARITOMI Kazuya , YAMAZAKI Tomoharu
IPC分类号： B32B27/00 , C08G59/24 , C09J9/02 , C09J201/00 , C09J7/38 , H05K1/14
摘要： Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 µm or less.

5. 发明公开

EP4099381A2 MEMBER CONNECTION METHOD BY MEANS OF A COPPER SINTERED FILM WITH A PLURALITY OF RADIALLY ARRANGED REGIONS AND A PLURALITY OF CONCENTRICALLY ARRANGED REGIONS 无效转让
公开(公告)号：EP4099381A2
公开(公告)日：2022-12-07
申请号：EP22185781.6
申请日：2018-10-23
申请人： Showa Denko Materials Co., Ltd.
发明人： NEGISHI, Motohiro , NAKAKO, Hideo , KAWANA, Yuki , ISHIKAWA, Dai , SUGAMA, Chie , EJIRI, Yoshinori
IPC分类号： H01L23/488 , H01L21/60 , H01L21/603 , B23K35/02 , B23K35/30 , B22F7/08
摘要： A member connection method for connecting a first member and a second member by means of a copper sintered compact includes: a printing step of forming a coating film (8) of a copper paste for connection in a connection region (5) of respective members (2) and (3) into a predetermined print pattern (9); a lamination step of laminating the respective members (2) and (3) with the coating film (8) interposed therebetween; and a sintering step of sintering the coating film (8) to form a copper sintered compact (4) and connecting the respective members (2) and (3) by means of this copper sintered compact (4), in which in the printing step, a coating film-formed region (10) in which the coating film (8) is formed and a coating film non-formed region (20) in which the coating film (8) is not formed are formed in the print pattern (9), and the coating film-formed region (10) is divided into a plurality of radial regions (12a) to (12c) and a plurality of concentric regions (13a) and (13b) by means of a plurality of line-shaped regions (21a) to (21c) provided so as to connect various points A to D which are separated apart from one another in the marginal part (6) of the connection region (5). The connection region (5) may be a rectangular-shaped region, and the coating film-formed region (10) may include regions disposed correspondingly to the corners (R1) to (R4) of the connection region (5). The plurality of the regions (12a-12c, 13a-13b) in the coating film-formed region (10) may have larger areas as the regions (12a-12c, 13a-13b) are disposed at positions closer to the marginal part of the connection region (5). In an embodiment, the coating film-formed region (10) includes division regions (11) and corner regions (14), wherein the division regions (11) include radial regions (12), concentric regions (13) and corner vicinity regions (19). Examples of the respective members (2) and (3) include semiconductor elements such as an IGBT, a diode, a Schottky barrier diode, an MOS-FET, a thyristor, a logic circuit, a sensor, an analog integrated circuit, an LED, a semiconductor laser, and a transmitter; substrates for mounting semiconductor elements such as a lead frame, a metal plate-attached ceramic substrate (for example, a DBC), and an LED package; members for power feeding such as a copper ribbon, a metal block, and a terminal; a heat radiation plate; and a water cooling plate. The copper paste for connection includes metal particles and a dispersing medium, wherein the metal particles may include submicron copper particles (of various shapes, preferably of a spherical shape, an approximately spherical shape or a flake shape), micro-copper particles (of various shapes, preferably of a flake shape) and other metal particles, for example, particles of nickel, silver, gold, palladium or platinum. In this member connection method, since a plurality of regions in the coating film-formed region (10) includes regions that are arranged radially (12a-12c) and regions that are arranged concentrically (13a-13b), it is possible to efficiently release air out of the connection region (5) by means of the coating film non-formed region (10) while uniformly expanding the coating film (8) in the connection region (5). Therefore, a void-suppressing effect can be sufficiently secured.

6. 发明公开

EP4084020A1 CONNECTION STRUCTURE AND MANUFUCTURING METHOD THEREFOR 审中-实审转让
公开(公告)号：EP4084020A1
公开(公告)日：2022-11-02
申请号：EP20906432.8
申请日：2020-12-04
申请人： Showa Denko Materials Co., Ltd.
发明人： AKAI Kunihiko , MIYAJI Masayuki , KAKEHATA Junichi , EJIRI Yoshinori , MORIYA Toshimitsu
IPC分类号： H01B13/00 , H01L21/60 , H01R11/01 , H05K3/32 , H05K3/34
摘要： A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

7. 发明公开

EP4030474A1 ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART AND DEVICE 审中-实审转让
公开(公告)号：EP4030474A1
公开(公告)日：2022-07-20
申请号：EP20862814.9
申请日：2020-09-11
申请人： Showa Denko Materials Co., Ltd.
发明人： KANG, Dongchul , OKUBO, Seigo
IPC分类号： H01L23/29 , H01L23/31 , C08K9/06 , C08L63/00 , B29C43/18
摘要： This encapsulating material for compression molding contains an epoxy resin, a curing agent, and an inorganic filler, wherein, in the image that is obtained when this encapsulating material for compression molding is compression-molded on a substrate via a silicon chip and the resultant compression-molded body is observed using an ultrasonic flaw detector, it is found that the surface area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is at least 86% of the surface area of the entire region corresponding to the compression-molded body on the chip.

8. 发明公开

EP4023362A1 COPPER PASTE FOR FORMING SINTERED COPPER PILLAR AND METHOD FOR PRODUCING BONDED BODY 审中-实审转让
公开(公告)号：EP4023362A1
公开(公告)日：2022-07-06
申请号：EP20868602.2
申请日：2020-09-18
申请人： Showa Denko Materials Co., Ltd.
发明人： YANAKA, Yuichi , NAKAKO, Hideo , KAWANA, Yuki , NEGISHI, Motohiro , SUGAMA, Chie , EJIRI, Yoshinori
IPC分类号： B22F1/00 , B22F7/08 , B82Y30/00 , B82Y40/00 , H01B1/22 , B22F1/052 , B22F1/0545 , B22F1/054 , B22F1/068 , B22F1/107 , B22F1/145 , B22F7/06 , C22C1/04 , B22F7/04
摘要： Provided is copper paste for forming a sintered copper pillar that bonds members to each other, the copper paste contains metal particles, and an organic dispersion medium, the metal particles including copper particles, and the organic dispersion medium containing a high-boiling-point solvent having a boiling point of 280°C or higher in an amount of 50% by mass to 99% by mass on the basis of a total mass of the organic dispersion medium.

9. 发明公开

EP4007015A1 METHOD FOR MANUFACTURING NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY AND METHOD FOR MANUFACTURING LITHIUM ION SECONDARY BATTERY 有权转让
公开(公告)号：EP4007015A1
公开(公告)日：2022-06-01
申请号：EP19939689.6
申请日：2019-07-31
申请人： Showa Denko Materials Co., Ltd.
发明人： SATO, Takeshi , MIYAUCHI, Takayuki , IKEDA, Yusuke , KAGAWA, Takuya
IPC分类号： H01M4/587 , C01B32/205 , H01M4/1393
摘要： A method of manufacturing a negative electrode material for a lithium ion secondary battery, the method includes (a) a step of obtaining a mixture containing a graphitizable aggregate and a graphitizable binder; (b) a step of obtaining a molded product by molding the mixture; (c) a step of obtaining a graphitized product by graphitizing the molded product; and (d) a step of obtaining a ground product by grinding the graphitized product, and a standard deviation of particle size distribution of the aggregate is less than 0.20.

10. 发明公开

EP3978544A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 审中-实审转让
公开(公告)号：EP3978544A1
公开(公告)日：2022-04-06
申请号：EP20814695.1
申请日：2020-05-25
申请人： Showa Denko Materials Co., Ltd.
发明人： NAKAMURA, Akihiro , TAKASE, Yuji , SAWAMOTO, Hayato , SUZUKI, Yoshikazu , NOMOTO, Shuji , OKADE, Shota
IPC分类号： C08F290/14 , C08G59/02 , H01L23/14 , G03F7/004 , G03F7/027 , G03F7/20 , H05K3/28 , H05K3/46
摘要： The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式