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    • 10. 发明公开
    • ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREFOR
    • ELEKTRONISCHE KOMPONENTE UND HERSTELLUNGSVERFAHRENDAFÜR
    • EP3070720A1
    • 2016-09-21
    • EP14862954.6
    • 2014-11-12
    • Nippon Chemi-Con Corporation
    • AIZAWA, Shogo
    • H01C17/02H01C1/034H01C7/10
    • H01C17/02C08K3/22C08K2003/2224C08K2003/2227C09D7/61H01C1/034H01C7/10H01C7/1006H01C7/102
    • A production method for an electronic component using an exterior packaging material containing a silicone resin comprises a step of dipping an element into an exterior packaging material containing a silicone resin to which aluminum hydroxide or magnesium hydroxide and a nonpolar solvent are added, an additive amount of the aluminum hydroxide or the magnesium hydroxide being controlled to a range of 60 [wt.%] or more to less than 70 [wt.%], a step of drying the exterior packaging material formed on a surface of the element to evaporate the nonpolar solvent and cause a silicone resin component to appear on a surface of the exterior packaging material, and a curing step of curing the exterior packaging material. As a result, the silicone resin can be reduced while maintaining the incombustibility and insulation withstand voltage of the exterior packaging material.
    • 使用含有硅树脂的外包装材料的电子部件的制造方法包括将元件浸渍在含有添加有氢氧化铝或氢氧化镁和非极性溶剂的有机硅树脂的外包装材料中的添加量 将氢氧化铝或氢氧化镁控制在60重量%以上至小于70重量%的范围内;干燥形成在元件表面上的外部包装材料以蒸发非极性的步骤 使外部包装材料的表面上露出有机硅树脂成分,固化外部包装材料的固化工序。 结果,可以降低硅树脂,同时保持外部包装材料的不燃性和绝缘耐受电压。