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1. 发明公开

EP3197005A1 AUXILIARY BATTERY DEVICE FOR ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备用辅助电池装置
公开(公告)号：EP3197005A1
公开(公告)日：2017-07-26
申请号：EP17151615.6
申请日：2017-01-16
申请人： Nexark, Inc.
发明人： ELIYAHU, Menachem
IPC分类号： H02J7/00 , H01M10/46
CPC分类号： H02J7/0042 , H02J7/0052 , H02J7/0054 , H02J2007/0062
摘要： The present invention concerns a power supply apparatus configured for coupling to an electronic device having a power port integral to the electronic device and a particular hardware profile. The power supply apparatus includes: a housing configured to extend the hardware profile of the electronic device in at least one dimension, a power source integral to the housing, and a power interface extending from the housing and configured to couple with the power port of the electronic device. A securing device integral to the housing is configured to couple the housing to the electronic device. Where the electronic device has a door covering its power port in a closed position and uncovering its port in an open extended position, the housing has a cover receiver for receiving the floor and maintaining the form factor of the electronic device and power supply.
摘要翻译：本发明涉及一种供电设备，其被配置用于耦合到具有集成到电子设备的电源端口和特定硬件配置文件的电子设备。该供电设备包括：外壳，其被配置为在至少一个维度上延伸电子设备的硬件外形;电源，其与外壳成一体;以及电源接口，其从外壳延伸并且被配置为与电源设备的电源端口电子设备。与壳体成一体的固定装置被构造成将壳体连接到电子装置。在电子设备具有在关闭位置覆盖其电源端口的门并且在打开的延伸位置打开其端口的情况下，该外壳具有用于接收地板并保持电子设备和电源的形状因子的盖接收器。

2. 发明公开

EP4121835A1 ENCLOSING A PORTABLE SOLID STATE DEVICE 审中-实审
公开(公告)号：EP4121835A1
公开(公告)日：2023-01-25
申请号：EP21771112.6
申请日：2021-03-19
申请人： Nexark, Inc.
发明人： ELIYAHU, Menachem
IPC分类号： G06F1/00 , H05K5/02 , H05K5/00 , H05K7/16 , A47B81/00

3. 发明公开

EP4170465A1 COOLING APPARATUS FOR A SSD MEMORY IN A VIDEO GAME CONSOLE 审中-实审
公开(公告)号：EP4170465A1
公开(公告)日：2023-04-26
申请号：EP22201343.5
申请日：2022-10-13
申请人： Nexark, Inc.
发明人： ELIYAHU, Menachem
IPC分类号： G06F1/20 , G06F1/18 , H05K7/20
摘要： A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

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