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    • 10. 发明公开
    • SMALL FORM-FACTOR PLUGGABLE (SFP) TRANSCEIVERS
    • 小型表面因素可插拔(SFP)收发器
    • EP3276838A1
    • 2018-01-31
    • EP17183352.8
    • 2017-07-26
    • Laird Technologies, Inc.
    • EDGREN, BjörnIHREFJORD, GöranTAPPING, MatthewPOULSEN, Michael ScottSTRADER, Jason L.PRUSS, Eugene Anthony
    • H04B1/036G02B6/38H01R13/6591
    • H04B1/38F25B21/02F25B2321/023F25B2321/0251G02B6/4269H01R13/2457H01R13/6591H04B1/036H05K5/0247H05K7/20418
    • In an exemplary embodiment, a device generally includes a housing, an external heat sink, and at least one of a thermal interface material and a thermoelectric module generally between a side of the housing and the external heat sink. At least one spring contact may be coupled to the side of the housing generally between the housing and the at least one of a thermal interface material and a thermoelectric module. The at least one spring contact and the at least one of a thermal interface material and a thermoelectric module may define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. Additionally, or alternatively, the at least one of a thermal interface material and a thermoelectric module may include a thermal interface material having a thermally-conductive and electrically-conductive material wrapped around at least a portion of the thermal interface material, The thermal interface material and the thermally-conductive and electrically-conductive material may define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. The thermally-conductive and electrically-conductive material wrapped around at least a portion of the thermal interface material may be operable for electrically grounding the housing.
    • 在示例性实施例中,设备通常包括壳体,外部散热器以及通常在壳体的一侧和外部散热器之间的热界面材料和热电模块中的至少一个。 至少一个弹簧触点可以大致在壳体与热界面材料和热电模块中的至少一个之间联接到壳体的侧面。 至少一个弹簧触点以及热界面材料和热电模块中的至少一个可限定壳体与外部散热器之间的导热热路径的至少一部分。 另外地或可替代地,热界面材料和热电模块中的至少一个可以包括热界面材料,该热界面材料具有缠绕在至少一部分热界面材料周围的导热和导电材料。热界面材料 并且导热和导电材料可限定壳体和外部散热器之间的导热热路径的至少一部分。 缠绕在至少一部分热界面材料周围的导热和导电材料可操作用于使壳体电接地。