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    • 3. 发明公开
    • Mounting device
    • Montagevorrichtung
    • EP0743461A1
    • 1996-11-20
    • EP96302743.8
    • 1996-04-19
    • Elta Plastics Ltd.
    • Chapman, Paul Nicholas
    • F16B5/06
    • B60N3/026
    • A device suitable for mounting an item upon a wall, panel or other surface not readily accessible from the rear is in the form of a clip (10) made of a resilient material such as a spring steel. The clip has an aperture (11) therein to receive a part (17) of the item (15) to be mounted and also has, rearwardly of that aperture, a first section (13) resiliently urged towards that part and adapted to engage it and a second section (14) resiliently urged outwardly with respect to the part and adapted to engage the rear of the wall, panel (19) or other surface.
    • 适于将物品安装在不容易从后面接近的墙壁,面板或其他表面上的装置是由诸如弹簧钢的弹性材料制成的夹子(10)的形式。 夹子具有一个孔(11),以容纳要安装的物品(15)的一部分(17),并且还具有该孔的向后弹性地向该部分推动的第一部分(13)并适于与其啮合 以及第二部分(14),其相对于所述部分向外弹性地推压并适于接合所述壁,面板(19)或其他表面的后部。
    • 10. 发明公开
    • Method for the preparation of a resin membrane
    • 制备树脂膜的方法
    • EP0528529A3
    • 1993-05-05
    • EP92306322.6
    • 1992-07-09
    • Shin-Etsu Chemical Co., Ltd.
    • Kashida, MeguruKubota, YoshihiroNagata, Yoshihiko
    • B29C41/28B29D7/01
    • B29D7/01B29C41/28
    • A method is described for the preparation of a resin membrane (11) suitable for use, for example, as a covering pellicle of a photolithographic mask for patterning of semiconductor devices in the electronic industry. The method comprises the steps of: (a) coating a substrate (6) with a solution (2) of the resin by using a roller coater (3) to form a coating layer of the resin solution; (b) drying the coating layer by evaporating the solvent to form a dry resin film on the substrate surface; and (c) peeling the resin film from the surface of the substrate, preferably in water (9). The method is advantageous over conventional methods in respect of the uniformity in the thickness of the resin membrane and the possibility of producing resin membranes of larger sizes, as well as for the high productivity which the method makes possible.
    • 描述了一种用于制备适用于电子工业中用于图案化半导体器件的光刻掩模的覆盖薄膜的树脂膜的方法。 该方法包括以下步骤:(a)使用辊式涂布机用树脂溶液涂布基材以形成树脂溶液的涂层; (b)通过蒸发溶剂干燥涂层以在基材表面上形成干树脂膜; (c)优选在水中从树脂膜的表面剥离树脂膜。 该方法相对于常规方法在树脂膜的厚度均匀性和生产尺寸更大的树脂膜的可能性方面是有利的,以及该方法可以实现的高生产率。