会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明公开
    • A STRUCTURE AND MANUFACTURING METHOD OF METAL WIRING ON MULTILAYERED BOARD
    • 结构与方法的金属布线在多层电路板
    • EP2161973A1
    • 2010-03-10
    • EP07721251.2
    • 2007-05-24
    • Princo Corp.
    • YANG, Chih-Kuang
    • H05K3/04H05K3/24H05K3/28H05K3/46
    • H05K3/048H05K1/0219H05K3/0041H05K3/107H05K3/244H05K3/381H05K2201/0154H05K2201/0166H05K2201/09809H05K2203/095
    • Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.
    • 本发明公开了金属结构的多层基板和结构及其制造方法。 本发明的制造方法包括下列步骤:介电层的表面上的涂层的至少一个光致抗蚀剂层,然后将光刻胶暴露电介质层,以限定所述金属结构的预定位置; 因此,在预定的位置除去光致抗蚀剂层和金属结构的表面上形成至少一个顶盖金属层之前,形成在预定位置处的金属结构。 本发明可以形成在顶表面上的覆盖金属层覆盖和两个侧表面,即使是金属结构的下表面上,由一个一个光掩模。 更以上,具有较高的可靠性的更细的金属结构可以被制造。 进一步,可以使用的金属结构作为同轴结构因此实现。