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1. 发明公开

EP0270925A3 Method for temporarily sealing holes in printed circuit boards 失效
标题翻译：印刷电路板中短路密封方法
公开(公告)号：EP0270925A3
公开(公告)日：1989-08-23
申请号：EP87117392.8
申请日：1987-11-25
申请人： MultiTek Corporation
发明人： Choinski, Edward J.
IPC分类号： H05K3/42
CPC分类号： H05K3/0094 , H05K3/064 , H05K3/3452 , H05K2203/0278 , H05K2203/0582 , H05K2203/0759 , H05K2203/1105 , Y10T29/49155
摘要： A sheet of deformable material (18) is placed on one side of the PCB (10) and then deformed so that the material extends into each hole to form a protectively sealing plug (20) therein. Thereafter, the other side of the PCB is coated with a suitable resist (24) for subsequent processing. The resist can be either photo-imagable or non-photo-imagable, such as silk screening inks, lacquers and varnishes. After conventional processing of the resist coated PCB, the deformed sheet material (18) that forms the protectively sealing plugs (20) is removed from the PCB. In the preferred embodiment, deformation of the sheet material is accomplished by thermally deforming a thermodeformable sheet material with a pressure differential applied across the thickness of the sheet material (18). The thermodeformable sheet material (18) preferably comprises either a low or high density polyethylene or polypropylene that can be re-used many times in order to reduce the material costs of practicing the method of the invention.

2. 发明公开

EP0269085A3 Apparatus and method for temporarily sealing holes in printed circuit boards 失效
标题翻译：打印机电路板中临时密封孔的装置及方法
公开(公告)号：EP0269085A3
公开(公告)日：1989-08-23
申请号：EP87117393.6
申请日：1987-11-25
申请人： MultiTek Corporation
发明人： Choinski, Edward J.
IPC分类号： H05K3/00 , H05K3/42
CPC分类号： H05K3/0094 , H05K2203/0278 , H05K2203/0582 , H05K2203/0759 , H05K2203/085 , Y10T29/49155
摘要： The apparatus comprises two major assemblies: a heater block assembly (28) and a vacuum table assembly (30). The heater block assembly employs a temperature controlled, insulated heater block (32) having a surrounding, movable vacuum collar (36). A flexible, thermally conductive vacuum skin (38) is mounted on the movable vacuum collar (36) and forms a vacuum chamber in cooperation with a movable vacuum table (42) having a flat, porous plate (44) whose upper surface is parallel to the vaccum table surface. A sandwich comprising a porous release sheet (64), the printed circuit board (66), a thermodeformable material (70) and a thermally conductive cover sheet (72) is positioned on the vacuum table flat, porous plate (44). Thereafter, the vacuum table (42) and sandwich are moved together so that the table forms a sealing relation with the flexible, thermally conductive vacuum skin (38). A vacuum is then drawn in the now formed vacuum chamber (74) forcing the flexible, thermally conductive vacuum skin (38) against the sandwich to compress the porous release sheet (64) between the printed circuit board (66) and the flat, porous plate (44). At this point, the flexible, thermally conductive vacuum skin (38), sandwich and vacuum table (42) are moved into a position in which the flexible, thermally conductive vacuum skin (38) is forced into thermally conductive contact with the heater block (32). Heat from the heater block softens the thermodeformable material (70) so that it deforms into the holes (68) of the printed circuit board (66) forming protectively sealing plugs (76) therein. After cooling, the vacuum table (42) is moved in the reverse direction to permit removal of the sandwich.
摘要翻译：该装置包括两个主要组件：加热器组件（28）和真空工作台组件（30）。加热器组件采用温度控制绝缘的加热器块（32），其具有环绕的可移动的真空环（36）。柔性的导热真空表皮（38）安装在可移动的真空套环（36）上并与可移动的真空工作台（42）配合形成一个真空室，该真空室具有一个平坦的，多孔的板（44），其上表面平行于真空表面。包含多孔隔离片（64），印刷电路板（66），热变形材料（70）和导热覆盖片（72）的夹层位于真空台平板多孔板（44）上。此后，真空台（42）和三明治一起移动，使得工作台与柔性导热真空表皮（38）形成密封关系。然后在现在形成的真空室（74）中抽真空，迫使柔性导热真空表层（38）抵靠三明治，以压缩印刷电路板（66）和平坦多孔的多孔隔离片（64）板（44）。此时，柔性导热真空表皮（38），夹层和真空台（42）被移动到柔性导热真空表皮（38）被强制与加热器块导热接触的位置 32）。来自加热器块的热量使热可变形材料（70）软化，使得其变形到印刷电路板（66）的孔（68）中，从而在其中形成保护性的密封塞（76）。在冷却之后，真空台（42）沿相反方向移动以允许去除三明治。

3. 发明公开

EP0270925A2 Method for temporarily sealing holes in printed circuit boards 失效
标题翻译： Verfahren zur zeitweisen Abdichtung vonLöchern在gedruckten Leiterplatten。
公开(公告)号：EP0270925A2
公开(公告)日：1988-06-15
申请号：EP87117392.8
申请日：1987-11-25
申请人： MultiTek Corporation
发明人： Choinski, Edward J.
IPC分类号： H05K3/42
CPC分类号： H05K3/0094 , H05K3/064 , H05K3/3452 , H05K2203/0278 , H05K2203/0582 , H05K2203/0759 , H05K2203/1105 , Y10T29/49155
摘要： A sheet of deformable material (18) is placed on one side of the PCB (10) and then deformed so that the material extends into each hole to form a protectively sealing plug (20) therein. Thereafter, the other side of the PCB is coated with a suitable resist (24) for subsequent processing. The resist can be either photo-imagable or non-photo-imagable, such as silk screening inks, lacquers and varnishes. After conventional processing of the resist coated PCB, the deformed sheet material (18) that forms the protectively sealing plugs (20) is removed from the PCB. In the preferred embodiment, deformation of the sheet material is accomplished by thermally deforming a thermodeformable sheet material with a pressure differential applied across the thickness of the sheet material (18). The thermodeformable sheet material (18) preferably comprises either a low or high density polyethylene or polypropylene that can be re-used many times in order to reduce the material costs of practicing the method of the invention.
摘要翻译：一块可变形材料（18）被放置在PCB（10）的一侧上，然后变形，使得材料延伸到每个孔中以在其中形成保护性密封塞（20）。此后，PCB的另一侧涂有合适的抗蚀剂（24），用于后续处理。抗蚀剂可以是可光成像的或非可照像的，例如丝印油墨，油漆和清漆。在抗蚀剂涂布的PCB的常规处理之后，形成保护性密封塞（20）的变形的片材（18）从PCB去除。在优选实施例中，片材的变形是通过在片材（18）的厚度上施加压差来热变形热变形片材来实现的。热致变形片材（18）优选包含可以重复使用多次的低密度或高密度聚乙烯或聚丙烯，以减少实施本发明方法的材料成本。

4. 发明公开

EP0269085A2 Apparatus and method for temporarily sealing holes in printed circuit boards 失效
标题翻译：装置和方法用于在印刷电路板的临时密封的孔。
公开(公告)号：EP0269085A2
公开(公告)日：1988-06-01
申请号：EP87117393.6
申请日：1987-11-25
申请人： MultiTek Corporation
发明人： Choinski, Edward J.
IPC分类号： H05K3/00 , H05K3/42
CPC分类号： H05K3/0094 , H05K2203/0278 , H05K2203/0582 , H05K2203/0759 , H05K2203/085 , Y10T29/49155
摘要： The apparatus comprises two major assemblies: a heater block assembly (28) and a vacuum table assembly (30). The heater block assembly employs a temperature controlled, insulated heater block (32) having a surrounding, movable vacuum collar (36). A flexible, thermally conductive vacuum skin (38) is mounted on the movable vacuum collar (36) and forms a vacuum chamber in cooperation with a movable vacuum table (42) having a flat, porous plate (44) whose upper surface is parallel to the vaccum table surface. A sandwich comprising a porous release sheet (64), the printed circuit board (66), a thermodeformable material (70) and a thermally conductive cover sheet (72) is positioned on the vacuum table flat, porous plate (44). Thereafter, the vacuum table (42) and sandwich are moved together so that the table forms a sealing relation with the flexible, thermally conductive vacuum skin (38). A vacuum is then drawn in the now formed vacuum chamber (74) forcing the flexible, thermally conductive vacuum skin (38) against the sandwich to compress the porous release sheet (64) between the printed circuit board (66) and the flat, porous plate (44). At this point, the flexible, thermally conductive vacuum skin (38), sandwich and vacuum table (42) are moved into a position in which the flexible, thermally conductive vacuum skin (38) is forced into thermally conductive contact with the heater block (32). Heat from the heater block softens the thermodeformable material (70) so that it deforms into the holes (68) of the printed circuit board (66) forming protectively sealing plugs (76) therein. After cooling, the vacuum table (42) is moved in the reverse direction to permit removal of the sandwich.
摘要翻译：该装置包括两个主要组件：一个加热器块组件（28）和一个真空台组件（30）。加热器块组件采用具有周边，活动真空环（36）控制的温度，绝缘加热器块（32）。甲柔韧导热真空表层（38）安装在所述活动真空环（36）和在合作用具有扁平的多孔板（44），其上表面是平行的可动真空台（42）形成了一个真空室所述真空台面。包括多孔防粘片（64）夹心，所述印刷电路板（66），一热致变形材料（70）和导热性的罩片（72）被定位在真空台面扁平的多孔板（44）。那里之后，在真空台（42）和三明治一起移动所以没有表形成与柔韧导热真空表层（38）的密封关系。真空然后在已形成真空腔（74）迫使所述柔韧导热真空表层（38）抵靠三明治以压缩所述印刷电路板（66）和平坦的，多孔的多孔防粘片（64）吸入板（44）。在这一点上，所述柔韧导热真空表层（38），夹心和真空台（42）被移动到在其中柔韧导热真空表层（38）被强制进入与加热器块导热接触（位置 32）。从加热块热软化的热致变形材料（70），以便做到了变形为形成保护性密封孔塞（76）在其中的印刷电路板（66）的孔（68）。冷却后，在真空台（42）在相反的方向上移动，以允许去除所述夹层的。

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