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82. 发明授权

EP3228654B1 GAS BARRIER POLYMER, GAS BARRIER FILM, AND GAS BARRIER LAMINATE 有权
公开(公告)号：EP3228654B1
公开(公告)日：2021-02-24
申请号：EP15865243.8
申请日：2015-11-13
发明人： KIDOKORO Masako , NOMOTO Akira
IPC分类号： C08G81/02 , C08J5/18 , C08J7/04

83. 发明授权

EP3163631B1 RESIN COMPOSITION FOR SOLAR CELL ENCAPSULATING MATERIAL, SOLAR CELL ENCAPSULATING MATERIAL, AND SOLAR CELL MODULE 有权
公开(公告)号：EP3163631B1
公开(公告)日：2021-01-06
申请号：EP15811905.7
申请日：2015-06-22
发明人： MUROFUSHI Takanobu , TOKUHIRO Jun
IPC分类号： C08K5/3492 , C08K5/5425 , C08L23/08 , H01L31/048

84. 发明公开

EP3624176A1 COMPONENT MANUFACTURING TOOL AND COMPONENT MANUFACTURING METHOD 审中-公开
公开(公告)号：EP3624176A1
公开(公告)日：2020-03-18
申请号：EP18797556.0
申请日：2018-05-08
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： HAYASHISHITA, Eiji
IPC分类号： H01L21/683 , C09J7/20 , C09J201/00 , H01L21/301
摘要： For the purpose of providing both a component-manufacturing tool, which can be chucked to a chuck table even under a heated environment, and a component-manufacturing method, a component-manufacturing tool 1 includes a frame body 10 and a holding film 20 covering an opening 10h, in which: a frame body 20 includes a first frame 11 and a second frame 12; the holding film 20 includes a base layer 21 and a holding layer 22 provided on one surface of the base layer 21, and the holding film 20 is sandwiched and held between the first frame 11 and the second frame 12 in a stretched state; and a ratio R E1 (= E'(100)/E'(25)) of an elastic modulus E'(100°C) of the base layer 21 to an elastic modulus E'(25°C) of the base layer 21 is 0.2 ≤ R E1 ≤ 1, and E'(25) is 35 MPa or more and 3500 MPa or less. The present component-manufacturing method includes: a component holding step of holding components to the holding layer 22 of the component-manufacturing tool 1; and a chucking step of chucking and fixing the holding film, to which the components are held, to a surface of a heated chuck table.

85. 发明公开

EP3603953A1 MULTILAYER BARRIER FILM 审中-实审
公开(公告)号：EP3603953A1
公开(公告)日：2020-02-05
申请号：EP18776134.1
申请日：2018-03-28
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： KOUDA Chikako , SHIBATA Tatsuya , FUKUDA Kazuyuki , UCHIDA Takashi , ODAGAWA Kenji , TAHARA Shuji , SUZUKI Shingo , MATOBA Daisuke , SHINKAWA Yasuaki , MORIYA Eiichi , NOMOTO Akira
IPC分类号： B32B9/00 , B32B7/02 , B32B27/34 , B32B27/36 , B32B27/40 , B65D65/40
摘要： A barrier laminate film (100) of the present invention includes: a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103), and a barrier resin layer (104) in this order. The barrier resin layer (104) includes an amide cross-linked compound of a polycarboxylic acid and a polyamine, and the stress relaxation layer (102) includes a polyurethane-based resin having an aromatic ring structure in a main chain.

86. 发明授权

EP2924741B1 SOLAR-CELL SEAL MATERIAL AND SOLAR CELL MODULE 有权
公开(公告)号：EP2924741B1
公开(公告)日：2020-01-01
申请号：EP13857078.3
申请日：2013-11-18
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： IKENAGA Shigenobu , TAKEUCHI Fumito , ITO Tomoaki , YARIMIZU Kazuhiro , OHSHIMIZU Kaoru , ODOI Masaaki
IPC分类号： C08L23/08 , C08K5/14 , H01L31/048 , C08F210/16 , C09K3/10

87. 发明授权

EP2851964B1 SOLAR CELL MODULE 有权
公开(公告)号：EP2851964B1
公开(公告)日：2019-12-11
申请号：EP13790520.4
申请日：2013-05-15
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： MUROFUSHI, Takanobu
IPC分类号： H01L31/049 , H01L31/048 , H02S20/23 , C08K5/134 , C08K5/3475

88. 发明公开

EP3572478A1 ADHESIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 有权
公开(公告)号：EP3572478A1
公开(公告)日：2019-11-27
申请号：EP18741559.1
申请日：2018-01-17
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： IGARASHI, Kouji , KINOSHITA, Jin , KURIHARA, Hiroyoshi
IPC分类号： C09J7/20 , B32B27/00 , C09J11/06 , C09J133/00 , C09J201/00 , H01L21/56
摘要： An adhesive film (50) of the present invention is an adhesive film used when sealing an electronic component with a sealing material in a step of manufacturing an electronic apparatus to temporarily fix the electronic component, the adhesive film (50) including a base material layer (10), an adhesive resin layer (A) which is provided on a first surface (10A) side of the base material layer (10) and which is for temporarily fixing the electronic component, and an adhesive resin layer (B) which is provided on a second surface (10B) side of the base material layer (10) and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer (A) includes a polyvalent carboxylic acid ester-based plasticizer (X) and an adhesive resin (Y), and a content of the polyvalent carboxylic acid ester-based plasticizer (X) in the adhesive resin layer (A) is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (Y) included in the adhesive resin layer (A) .

89. 发明公开

EP3439024A1 ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING 有权
公开(公告)号：EP3439024A1
公开(公告)日：2019-02-06
申请号：EP17774499.2
申请日：2017-03-21
申请人： Mitsui Chemicals Tohcello, Inc.
发明人： KURIHARA Hiroyoshi , FUKUMOTO Hideki
IPC分类号： H01L21/304 , H01L21/683
摘要： An adhesive film for processing a semiconductor wafer (100) of the present invention includes a base material layer (10) and an ultraviolet-curable adhesive resin layer (20) provided on one surface side of the base material layer (10) and is used to protect a surface of a semiconductor wafer or fix the semiconductor wafer. In addition, in the adhesive film (100), the adhesive resin layer (20) includes an ultraviolet-curable adhesive resin, and a saturated electrostatic potential V 1 of the adhesive resin layer (20) after ultraviolet curing, which is measured using a method described below, is equal to or less than 2.0 kV.
(Method)
Ultraviolet rays having a main wavelength of 365 nm are radiated to the adhesive resin layer using a high-pressure mercury lamp in an environment of 25°C at a radiation intensity of 100 mW/cm 2 and an ultraviolet amount of 1,080 mJ/cm 2 , thereby photocuring the adhesive resin layer (20). Next, a voltage is applied to a surface of the adhesive resin layer (20) for 30 seconds under conditions of an applied voltage of 10 kV, a distance between a specimen and electrodes of 20 mm, 25°C, and 50%RH, and the saturated electrostatic potential (V 1 ) of the surface of the adhesive resin layer is computed according to JIS L1094.

90. 发明公开

EP3228654A4 GAS BARRIER POLYMER, GAS BARRIER FILM, AND GAS BARRIER LAMINATE 有权
公开(公告)号：EP3228654A4
公开(公告)日：2018-07-11
申请号：EP15865243
申请日：2015-11-13
申请人： MITSUI CHEMICALS TOHCELLO INC
发明人： KIDOKORO MASAKO , NOMOTO AKIRA
IPC分类号： C08G81/02 , C08J5/18 , C08J7/04
CPC分类号： B32B27/30 , B32B9/00 , B32B2307/7242 , B32B2309/105 , C08G81/02 , C08G81/024 , C08J7/047 , C08J2367/02 , C08J2433/08 , C08J2479/02 , C09D133/08
摘要： A gas barrier polymer of the present invention is formed by heating a mixture including a polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum of the gas barrier polymer, when a total peak area in a range of an absorption band of equal to or more than 1493 cm -1 and equal to or less than 1780 cm -1 is A, and a total peak area in a range of an absorption band of equal to or more than 1598 cm -1 and equal to or less than 1690 cm -1 is B, an area ratio of an amide bond indicated by B/A is 0.370 or more.

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