专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明公开

EP2477463A1 Apparatus and method for sensing failure 有权
标题翻译： Vorrichtung und Verfahren zur Fehlererkennung
公开(公告)号：EP2477463A1
公开(公告)日：2012-07-18
申请号：EP12151393.1
申请日：2012-01-17
申请人： Samsung LED Co., Ltd.
发明人： Nam, Kyung Pil
IPC分类号： H05B37/03 , H05B33/08
CPC分类号： H05B33/0887 , H05B33/0893 , H05B37/034
摘要： Provided is an apparatus for sensing a failure that may apply, using a current control unit, a current to at least one first light emitting diode (LED) string and at least one second LED string that may be connected in parallel with each other, and as a result of sensing whether a failure occurs with respect to each of the at least one first LED string and the at least one second LED string, when a failure is sensed with respect to at least one of the at least one first LED string and the at least one second LED string, may transmit failure information to the current control unit, thereby blocking the entire current that may be applied to the at least one first LED string and the at least one second LED string, using the current control unit.
摘要翻译：提供了一种用于感测可能使用电流控制单元将电流应用于至少一个第一发光二极管（LED）串和可以彼此并联连接的至少一个第二LED串的故障的装置，以及作为感测相对于至少一个第一LED串和至少一个第二LED串中的每一个发生故障的结果，当相对于至少一个第一LED串和所述至少一个第二LED串可以将故障信息发送到当前控制单元，由此使用电流控制单元阻断可施加到至少一个第一LED串和至少一个第二LED串的整个电流。

82. 发明公开

EP2475018A2 Light-emitting device package and method of manufacturing the same 有权转让
标题翻译：发光器件封装及其制造方法
公开(公告)号：EP2475018A2
公开(公告)日：2012-07-11
申请号：EP12150120.9
申请日：2012-01-04
申请人： Samsung LED Co., Ltd.
发明人： Lim, Jae-yun , Oh, Kook-jin , Lee, Joon-gil
IPC分类号： H01L33/62
摘要： A light-emitting device package includes: a package body (2) on which a mount portion (210) and a terminal portion (220) are disposed; a light-emitting device chip (300) that is mounted on the mount portion; and a bonding wire (401) that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion (410) that rises from the light-emitting device chip to a loop peak (412), and an extended portion (440) that connects the loop peak and the terminal portion. A first kink portion (413), which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion (410).
摘要翻译：发光器件封装包括：封装主体（2），其上设置有安装部分（210）和端子部分（220）;封装主体发光器件芯片（300），其安装在所述安装部分上; 以及电连接发光器件芯片的电极和端子部分的接合线（401）。接合线包括从发光器件芯片上升到环峰（412）的上升部分（410）以及连接环峰值和端子部分的延伸部分（440）。在立起部分410上设置有第一弯折部分413，该第一弯折部分413在与立起部分上升的方向相交的方向上弯曲。

83. 发明公开

EP2475017A2 LED Package with a lens 审中-公开
标题翻译： LED-Baugruppe mit einer Linse
公开(公告)号：EP2475017A2
公开(公告)日：2012-07-11
申请号：EP11180841.6
申请日：2011-09-12
申请人： Samsung LED Co., Ltd.
发明人： Park, Cheon Ho , You, Jae Sung
IPC分类号： H01L33/58
CPC分类号： H01L33/58
摘要： A light emitting device (LED) package is disclosed. The light emitting device package includes a light emitting device (10), a substrate (20) on which the light emitting device is mounted; and a lens (30) mounted on the substrate so as to cover and seal the light emitting device and having an accommodating groove formed in a lower surface thereof contacting the substrate, the accommodating groove (31) accommodating the light emitting device, and a concave portion (32) formed in an upper surface thereof in such a manner as to be disposed at a position corresponding to the light emitting device, wherein the concave portion has a radius of curvature on an optical axis of the lens and is formed to be depressed from the upper surface to the lower surface.
摘要翻译：公开了一种发光器件（LED）封装。发光器件封装包括发光器件（10），其上安装有发光器件的衬底（20）; 以及透镜（30），其安装在所述基板上以覆盖和密封所述发光器件并且具有形成在其与所述基板接触的下表面中的容纳槽，所述容纳槽（31）容纳所述发光器件，以及凹部形成在其上表面上的部分（32），以便设置在与发光装置相对应的位置，其中凹部具有在透镜的光轴上的曲率半径并形成为被压下从上表面到下表面。

84. 发明公开

EP2469614A2 Light emitting device package and method of manufacturing the same 审中-公开
标题翻译：发光器件封装及其制造方法
公开(公告)号：EP2469614A2
公开(公告)日：2012-06-27
申请号：EP11194777.6
申请日：2011-12-21
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol Jun , Song, Young Hee , Hwang, Seong Deok , Lee, Sang Hyun
IPC分类号： H01L33/48
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
摘要翻译：提供一种发光器件封装，包括：多个引线框架，所述多个引线框架设置为彼此分离; 至少一个发光器件，安装在所述引线框架上并且通过设置在引线接合焊盘上的接合引线电连接到所述引线框架，所述引线接合焊盘被设置在与设置为所述引线框架的上表面的光发射表面相同的表面上，发光装置; 主体部分，被形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架，并且具有形成在其上表面中的反射凹槽，以将发光表面暴露到外面; 以及布置在主体部分上以覆盖发光器件的透镜部分。

85. 发明公开

EP2469594A2 Light emitting module and method of manufacturing the same 审中-公开
标题翻译： Lichtemittierendes Modul und Verfahren zu dessen Herstellung
公开(公告)号：EP2469594A2
公开(公告)日：2012-06-27
申请号：EP11194829.5
申请日：2011-12-21
申请人： Samsung LED Co., Ltd.
发明人： An, Ji Young
IPC分类号： H01L25/075
CPC分类号： H05B37/02 , G02B6/0068 , G02B6/0083 , G02F1/133603 , G02F1/133615 , G02F2001/133612 , G02F2001/133613 , G09G3/342 , G09G2330/021 , H01L25/0753 , H01L2924/0002 , H05B33/0857 , H05K3/30 , Y10T29/4913 , H01L2924/00
摘要： There is provided a light emitting module (100) and a method of manufacturing the same. The light emitting module includes a circuit board (101), and a plurality of light emitting devices (102A, 102B) disposed on the circuit board (101), wherein the plurality of light emitting devices (102A, 102B) include at least one light emitting device having a driving voltage less than an average driving voltage of the plurality of light emitting devices (102A, 102B) and at least a further one of light emitting devices adjacent thereto having a driving voltage greater than the average driving voltage. In the light emitting module (100), variations in driving voltages between light emitting modules that may be caused due to driving voltage distribution among the light emitting devices may be minimized.
摘要翻译：提供了一种发光模块（100）及其制造方法。发光模块包括电路板（101）和设置在电路板（101）上的多个发光器件（102A，102B），其中多个发光器件（102A，102B）包括至少一个光具有小于多个发光器件（102A，102B）的平均驱动电压的驱动电压的发光器件和与其相邻的至少另一个发光器件具有大于平均驱动电压的驱动电压。在发光模块（100）中，由于发光装置之间的驱动电压分布而可能引起的发光模块之间的驱动电压的变化可能被最小化。

86. 发明公开

EP2466373A1 Flash Lens and Flash Module Employing the Same 审中-公开
标题翻译： Blitz und Blitzmodul damit
公开(公告)号：EP2466373A1
公开(公告)日：2012-06-20
申请号：EP11193544.1
申请日：2011-12-14
申请人： Samsung LED Co., Ltd.
发明人： You, Jae-sung
IPC分类号： G03B15/04 , F21V5/04 , H01L33/58
CPC分类号： G03B15/05 , G03B2215/0567 , H01L33/58
摘要： A flash lens and a flash module. The flash lens includes a circular first incidence surface on which light emitted from a light source in a center direction is incident; a second incidence surface arranged to be tilted with respect to an optical axis and on which light emitted from the light source in a lateral direction is incident; a reflective surface that reflects light incident from the second incidence surface; a bottom surface that connects the second incidence surface and the reflective surface; and a circular emission surface that emits light transmitted through the first incidence surface and light reflected by the reflective surface. The flash module includes an LED chip; and the flash lens of claim 1 that is arranged above the LED chip.
摘要翻译：闪光镜头和闪光灯模块。闪光灯透镜包括从中心方向从光源发射的光入射的圆形第一入射面; 第二入射面，被布置成相对于光轴倾斜，并且在所述第二入射表面上从所述光源沿横向方向发射的光入射; 反射从第二入射面入射的光的反射面; 连接第二入射面和反射面的底面; 以及发出透过第一入射面的光和被反射面反射的光的圆形发射面。闪光灯模块包括LED芯片; 以及布置在LED芯片上方的权利要求1的闪光镜片。

87. 发明公开

EP2461171A2 Tray, LED testing apparatus and testing method using the same 审中-公开
标题翻译： Schale，LED-Testvorrichtung und Testverfahren damit
公开(公告)号：EP2461171A2
公开(公告)日：2012-06-06
申请号：EP11191839.7
申请日：2011-12-05
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol Jun , Song, Young Hee , Hwang, Seong Deok
IPC分类号： G01R31/26 , G01J1/04
CPC分类号： G01R31/2635 , G01J1/0422 , G01J2001/4252
摘要： A tray, a testing apparatus and a testing method using the same are disclosed. The testing apparatus includes a tray (13) having a purality of light sources (11) received therein, the purality of light sources such as light emitting diodes, LEDs outputting light when power is applied thereto; a plurality of optical receiver units (15) arranged to correspond to the plurality of light sources (11) and receiving the light outputted from each of the plurality of light sources (11); a plurality of probe units (14) arranged to correspond to the plurality of light sources (11) and applying power to each of the plurality of light sources (11); a power supply control unit (18) selectively controlling power applied to the plurality of probe units (14); and an optical properties analyzing unit (19) analyzing properties of optical signals from the light received by the optical receiver units.
摘要翻译：公开了一种托盘，测试装置和使用该托盘的测试方法。测试装置包括具有多个光源（11）的托盘（13），多个光源（例如发光二极管），在施加电力时输出光的LED; 多个光接收器单元（15），被布置成对应于所述多个光源（11）并且接收从所述多个光源（11）中的每一个输出的光; 多个探针单元（14），其布置成对应于所述多个光源（11）并向所述多个光源（11）中的每一个施加电力; 选择性地控制施加到所述多个探针单元（14）的功率的电源控制单元（18）; 以及光学性质分析单元（19），分析由所述光接收单元接收的光的光信号的特性。

88. 发明公开

EP2452996A3 Apparatus and method for automatically mixing phosphor 审中-公开
标题翻译：的装置和方法的磷自动混合
公开(公告)号：EP2452996A3
公开(公告)日：2012-05-30
申请号：EP11188917.6
申请日：2011-11-14
申请人： Samsung LED Co., Ltd.
发明人： Noh, Myeong Ho , Kim, Choo Ho , Jeong, Song Ho , Lim, Dong Hee
IPC分类号： C09K11/02 , B01F5/00
CPC分类号： C09K11/02 , B01F13/1069 , B01F13/1072 , B01F15/0445 , C09K11/08
摘要： An apparatus and method for automatically mixing a phosphor are provided, which are capable of automatically supplying accurate quantities of a phosphor and silicon to a mixing container using a phosphor supply unit and a silicon supply unit.

89. 发明公开

EP2354631A3 LED Module and Backlight Unit having the Same 审中-公开
标题翻译： LED-Modul undRückbeleuchtungseinheitdamit
公开(公告)号：EP2354631A3
公开(公告)日：2012-05-09
申请号：EP11151606.8
申请日：2011-01-21
申请人： Samsung LED Co., Ltd.
发明人： Ko, Kun Yoo , Choi, Seung Hwan , Lee, Won Joon , Kim, Jin Mo
IPC分类号： F21K99/00 , H01L25/075 , F21S4/00 , H01L33/48 , H01L33/50 , F21Y103/00
CPC分类号： F21S4/28 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/505 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： There is provided an LED module, including a bar type circuit substrate formed with at least one groove so as to have a reflecting cup; a plurality of LED chips disposed in the groove of the circuit substrate and linearly arranged in a longitudinal direction of the circuit substrate; and a phosphor film spaced apart from the LED chips and disposed on the circuit substrate to cover the entire groove.
摘要翻译：提供了一种LED模块，包括形成有至少一个凹槽以便具有反射杯的条形电路基板; 多个LED芯片，设置在所述电路基板的所述槽中，并且在所述电路基板的长度方向上直线地配置; 以及与LED芯片间隔开并设置在电路基板上以覆盖整个槽的荧光膜。

90. 发明公开

EP2448017A2 Semiconductor light emitting device 有权转让
标题翻译：半导体发光器件
公开(公告)号：EP2448017A2
公开(公告)日：2012-05-02
申请号：EP11170630.5
申请日：2011-06-21
申请人： Samsung LED Co., Ltd.
发明人： Kim, Kyu Sang
IPC分类号： H01L33/44 , H01L33/50
CPC分类号： H01L33/501 , H01L33/08 , H01L33/20 , H01L33/505 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A semiconductor light emitting device includes: a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; and a wavelength conversion layer formed on at least a portion of a light emission surface of the light emission structure, made of a light-transmissive material including phosphor particles, and having a void therein. A semiconductor light emitting device includes: a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; and a wavelength conversion layer formed on at least a portion of a light emission surface of the light emission structure, made of a light-transmissive material including phosphor particles or quantum dots, and having a void therein.
摘要翻译：一种半导体发光器件，包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 以及波长转换层，其形成在发光结构的发光表面的至少一部分上，由包括荧光体颗粒的透光材料制成，并且其中具有空隙。一种半导体发光器件，包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 以及波长转换层，其形成在发光结构的发光表面的至少一部分上，由包括荧光体颗粒或量子点的透光材料制成，并且其中具有空隙。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式