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83. 发明公开

EP3646911A1 SYRINGE 无效
公开(公告)号：EP3646911A1
公开(公告)日：2020-05-06
申请号：EP18823191.4
申请日：2018-04-18
申请人： Taisei Kako Co., Ltd.
发明人： OGAWA, Yukihiro , TANAKA, Yuji
IPC分类号： A61M5/32 , A61M5/28
摘要： In a syringe (1) that allows an administration operation while a coil spring (16) is held by a spring holder (17) in a compressed state and a further thrust operation of the syringe barrel (2) after completion of administration releases the coil spring (16) from the hold of the spring holder (17), the coil spring (16) is prevented from being released from the hold of by the spring holder (17) inadvertently during administration. When, upon completion of administration of the liquid drug, the syringe barrel (2) is thrust toward the distal end relative to the cover (6), the spring holder (17) is configured to be movable from a hooked position toward the distal end relative to the cover (6), where the hook members (17b) are hooked on the cover (6) when in the hooked position, and a guide surface (S) is provided on the inner periphery of the cover (6) adapted, when the spring holder (17) has moved from the hooked position toward the distal end, to cause the hook members (17b) to radially deform such that the hook members cease to be hooked on the cover (6).

87. 发明公开

EP3633332A1 INFRARED IMAGING ELEMENT, INFRARED IMAGING ARRAY, AND METHOD FOR MANUFACTURING INFRARED IMAGING ELEMENT 有权
公开(公告)号：EP3633332A1
公开(公告)日：2020-04-08
申请号：EP18806337.4
申请日：2018-01-29
申请人： Mitsubishi Electric Corporation
发明人： MAEGAWA, Tomohiro
IPC分类号： G01J1/02 , H01L27/144 , H01L27/146 , H04N5/33
摘要： This infrared imaging element includes: a substrate (31) which has a front surface and a back surface and to which a circuit unit (32) is provided; a support leg wiring line (4) that is disposed above the front surface of the substrate (31); and an infrared-ray detection unit (13) which is held on the support leg wiring line (4) and to which a diode (2) electrically connected to the circuit unit (32) via the support leg wiring line (4) is provided, wherein a temperature change of the infrared-ray detection unit (13) is detected as an electrical signal change of the diode (2) by the circuit unit (32). The substrate (31), the support leg wiring line (4), and the infrared-ray detection unit (13) are laminated at intervals in a direction perpendicular to the front surface of the substrate (31).

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