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71. 发明公开

EP0756244A3 Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit 失效
公开(公告)号：EP0756244A3
公开(公告)日：1998-12-09
申请号：EP96112037
申请日：1996-07-25
申请人： GIESECKE & DEVRIENT GMBH
发明人： HAGHIRI-TEHRANI YAHYA , WELLING ANDO DR
IPC分类号： G06K19/077
CPC分类号： G06K19/0775 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01L2224/48091 , H01L2224/48227 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： Die Erfindung betrifft eine Schaltungseinheit mit einem isolierenden Trägersubstrat (1), auf dem sich eine leitende, flache Spule (3) befindet. Die Spule (3) kann aus mehreren Spulenlagen (9, 17) bestehen, die durch isolierende Schichten (11) getrennt sind. Um die einzelnen Spulenlagen (9, 17) zu einer Spule zusammenzuschalten, ist in jeder der isolierenden Schichten (11) wenigstens eine Durchbrechung (13) vorgesehen. Die Verbindung zwischen den Spulenenden (15, 19) der Spule (3) und einem integrierten Schaltkreis (7) bzw. einem Modul (23), das den integrierten Schaltkreis (7) enthält, kann allein dadurch erfolgen, daß sich die Spulenenden (15, 19) und die Anschlußpunkte (27) des integrierten Schaltkreises (7) bzw. die Kontakte (25) des Moduls (23) berühren. Die einzelnen Spulenwindungen der Spule (3) können so angeordnet und so dimensioniert werden, daß innerhalb eines von der Norm vorgesehenen Bereichs (37, 38) ein Hochprägen der Schaltungseinheit uneingeschränkt möglich ist.
摘要翻译：该智能卡具有层压塑料结构，其中嵌入了集成电路芯片Ä7Ü。通过由平面线圈装置Ä3Ü提供的非接触耦合来与芯片通信。线圈Ä17Ü的一个部分处于一个级别，而在较低级别的第二个环路与隔离层交替。通过层之间的孔进行连接。线圈端Ä15,19Ü或者与芯片触点直接接触或电容耦合。

72. 发明公开

EP0870627A1 SEMICONDUCTOR DEVICE 失效
标题翻译：然而，半导体器件
公开(公告)号：EP0870627A1
公开(公告)日：1998-10-14
申请号：EP96913742.1
申请日：1996-05-14
申请人： Hitachi, Ltd.
发明人： USAMI, Mitsuo , TSUBOSAKI, Kunihiro , MIYAZAKI, Masaru
IPC分类号： B42D15/10 , H01L25/04
CPC分类号： G06K19/07728 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01L23/49855 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3511 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated.
Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.

73. 发明公开

EP0768620A2 Radio frequency identification transponder and method of making same 失效
标题翻译： Radiofrequenz-Indentifikationstransponder和Verfahren zu seiner Herstellung
公开(公告)号：EP0768620A2
公开(公告)日：1997-04-16
申请号：EP96306467.0
申请日：1996-09-05
申请人： Palomar Technologies Corporation
发明人： De Vall, Franklin B.
IPC分类号： G06K13/077
CPC分类号： G06K19/07779 , G06K7/10336 , G06K19/0723 , G06K19/07749 , G06K19/07783 , G06K19/07784 , H01L2224/05554 , H01L2224/48091 , H01L2924/30107 , H01Q1/36 , H01Q7/00 , H01L2924/00014 , H01L2924/00
摘要： A transponder is formed of a very thin flexible substrate (10) on opposite sides of which are formed first (26) and second (31) series connected halves of a single antenna coil having ends connected to an integrated circuit die (50) mounted to a corner of the substrate. A plurality of bond pads (12a-12e) and programming pads (14a-14e) are also formed on the substrate and operatively connected to couple the antenna coils and the programming pads through the bond pads to the integrated circuit die. Unique configurations and arrangements of a die mounting site (46), bond pads (12a-12e), program pads (14a-14e), and vias (22,24) through the substrate enable an inexpensive simple construction. Protective laminates (58,60) on either side of the substrate are bonded to one another around the edges that circumscribe the substrate and also are bonded to one another at interior portions through a slot (20) formed in the substrate. In one embodiment narrow closely spaced coil turns are grouped in a perimetrical area of the substrate, leaving a large area in the center of the substrate free of antenna coil turns. The thin flexible substrate is stiffened in the area of the die and bond site by thin copper stiffener sheets (46,202,234) that are laid down as part of the antenna coil forming process.
摘要翻译：应答器由非常薄的柔性基板（10）形成，其相对的两侧形成有单个天线线圈的第一（26）和第二（31）串联连接的半部，其具有连接到集成电路管芯（50）的端部，安装到基板的一角。多个接合焊盘（12a-12e）和编程焊盘（14a-14e）也形成在衬底上并且可操作地连接以通过接合焊盘将天线线圈和编程焊盘耦合到集成电路管芯。通过基板的模具安装部位（46），接合焊盘（12a-12e），编程焊盘（14a-14e）和通孔（22,24）的独特配置和布置能够实现便宜的简单结构。在衬底两侧的保护层压板（58,60）围绕衬底边缘彼此接合，并且还通过形成在衬底中的槽（20）的内部部分彼此粘结。在一个实施例中，窄的紧密间隔的线圈匝被分组在衬底的周边区域中，在衬底的中心处留下大面积而没有天线线圈匝。薄的柔性基板在模具的区域中被加强，并且通过被布置为天线线圈成形过程的一部分的薄铜加强板（46,202,234）而被粘结。

74. 发明公开

EP0541323A2 Noncontacting card, terminal and transmission system therfore 失效
标题翻译： Kontaktlose Karte，Terminal undÜbertragungssystemdafür。
公开(公告)号：EP0541323A2
公开(公告)日：1993-05-12
申请号：EP92310043.2
申请日：1992-11-03
申请人： MITSUBISHI DENKI KABUSHIKI KAISHA
发明人： Inoue, Takesi, c/o Mitsubishi Denki K.K.
IPC分类号： G06K19/077 , G06K7/08 , H05K1/16
CPC分类号： G06K19/07779 , G06K7/10336 , G06K19/07749 , G06K19/07781 , G06K19/07783 , G06K19/07784 , G07C9/00111
摘要： A noncontacting card 41 contains a coil circuit having at least two circuits of spiral coils 42, 47 connected to each other in parallel and electromagnetically coupled with a terminal 61, and a processing circuit 46 connected to the coil circuit for signal processing. This can perform high efficiency transmission of electric power and data from/to a terminal. A terminal 61 for a noncontacting card contains a coil circuit 62, 67 having at least two circuits of spiral coils connected to each other in parallel and electromagnetically coupled with a noncontacting card 41, and a processing circuit connected to the coil circuit for signal processing; this can perform high efficiency transmission of electric power and data to/from a noncontacting card. The card and terminal form a noncontacting transmission system. The spiral coils are of stranded wire. Selection means (71, 72) are provided for selecting a desired number of spiral coil wires and connecting these in parallel.
摘要翻译：非接触卡41包含线圈电路，该线圈电路具有至少两个螺旋线圈42,47的电路，它们彼此并联并与端子61电磁耦合，以及处理电路46，连接到线圈电路用于信号处理。这可以实现从终端到终端的电力和数据的高效传输。用于非接触卡的端子61包括线圈电路62,67，其具有并联连接的螺旋线圈的至少两个电路和与非接触卡41电磁耦合的线圈电路62,67以及连接到用于信号处理的线圈电路的处理电路; 这可以高效率地传输电力和数据到非接触卡。卡和终端形成非接触传输系统。螺旋线圈是绞线。提供选择装置（71,72）用于选择期望数量的螺旋线圈线并且并联它们。

75. 发明公开

EP0374018A1 Dispositif pour l'échange d'informations à distance entre un objet portatif et une station 有权转让
标题翻译：装置，用于在便携式物体和站之间的信息交换的远程。
公开(公告)号：EP0374018A1
公开(公告)日：1990-06-20
申请号：EP89403398.4
申请日：1989-12-07
申请人： FRANCE TELECOM
发明人： Levionnais, Philippe
IPC分类号： H04B5/00 , E05B49/00 , G06K7/08
CPC分类号： H04B5/0012 , G06K7/0008 , G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G07C9/00111 , G07C2009/00777 , G07F7/0866
摘要： La station, notamment un terminal, comprend un oscillateur (OS) comportant une boucle de réaction (1), possédant un élément inductif-station (L10), et susceptible de lui conférer une fréquence de travail variable relativement à une fréquence de repos, ainsi que des moyens de traitement-station, reliés à l'oscillateur, et capables de traiter les variations de la fréquence de travail.L'objet portatif, notamment une carte à mémoire, comprend un circuit électronique commutable entre un état inactif et un état actif dans lequel il forme un circuit résonant accordé sur une fréquence distincte de ladite fréquence de repos, tout en demeurant apte au couplage inductif avec la boucle de réaction (1) à ladite fréquence de repos, et des moyens de traitement-objet, capables de commuter le circuit électronique en fonction d'informations à transmettre vers la station.La variante de la fréquence de travail de l'oscillateur, ainsi induite par ces commutations, permettant aux moyens de traitement-station d'en déduire lesdites informations.

76. 发明公开

EP3136300A4 WIRELESS IC DEVICE, RESIN MOLDED PRODUCT, AND MANUFACTURING METHOD THEREFOR 有权
公开(公告)号：EP3136300A4
公开(公告)日：2017-12-13
申请号：EP15869588
申请日：2015-08-05
申请人： MURATA MANUFACTURING CO
发明人： KATO NOBORU , YASUTAKE MAKOTO , BANBA SHINICHIRO
IPC分类号： G06K19/077 , B42D25/305 , G06K19/07 , H01Q1/38 , H01Q1/40 , H01Q7/00 , H01Q7/06
CPC分类号： H04B5/0081 , G06K19/07 , G06K19/0723 , G06K19/077 , G06K19/07722 , G06K19/07745 , G06K19/0775 , G06K19/07754 , G06K19/07779 , G06K19/07784 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/3121 , H01L23/49838 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2924/15313 , H01L2924/19041 , H01L2924/19105 , H01Q1/2283 , H01Q7/00 , H04B5/0062
摘要： A wireless IC device (101) includes a resin member (70) including a first surface (VS1) and a second surface (VS2), a substrate (1) including a first principal surface (PS1) and a second principal surface (PS2), a coil antenna provided in the resin member (70), and an RFIC element (61) mounted on the substrate (1) and connected to the coil antenna. The substrate (1) is embedded in the resin member (70) so that the second principal surface (PS2) is at the second-surface-(VS2) side. The coil antenna is formed of first linear conductor patterns (20A to 20G) formed on the second surface (VS2), first metal posts (30A to 30F) that extend between the first surface (VS1) and the second surface (VS2), second metal posts (40A to 40F) that extend between the first surface (VS1) and the second surface (VS2), and second linear conductor patterns (50A to 50F) formed on the first surface (VS1). The RFIC element (61) is disposed in the coil antenna.

77. 发明公开

EP3236394A2 CHIPKARTE MIT ZWEI SPULEN UND FERRIT 审中-公开
公开(公告)号：EP3236394A2
公开(公告)日：2017-10-25
申请号：EP17000661.3
申请日：2017-04-19
申请人： Giesecke+Devrient Mobile Security GmbH
发明人： Kluge, Stefan
IPC分类号： G06K19/077
CPC分类号： G06K19/07779 , G06K19/07784
摘要： Die vorliegende Erfindung betrifft einen kartenförmigen Datenträger mit einem kartenförmigen Kartenkörper und zwei Spulen, wobei mindestens ein Ferritelement in dem Kartenkörper angeordnet ist. Die erfindungsgemäße Chipkarte hat den Vorteil, dass eine verbesserte Ansprechfeldstärke bei mindestens einer der Spulen gegeben ist.

78. 发明公开

EP3005242A1 ANTENNA MODULES FOR DUAL INTERFACE SMARTCARDS, BOOSTER ANTENNA CONFIGURATIONS, AND METHODS 审中-公开
标题翻译：天线模块对于双界面智能卡，增益天线结构和方法
公开(公告)号：EP3005242A1
公开(公告)日：2016-04-13
申请号：EP14704337.6
申请日：2014-02-13
申请人： Féinics AmaTech Teoranta
发明人： FINN, David , CZORNACK, Jan-Thomas , FENDT, Theodore , LOTYA, Mustafa
IPC分类号： G06K19/077 , H01Q1/22
CPC分类号： G06K19/07794 , G06K19/07769 , G06K19/07781 , G06K19/07783 , G06K19/07784 , H01Q1/2225 , H01Q7/00
摘要： Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Techniques for embedding wire and for bonding wire are disclosed.

79. 发明授权

EP2840648B1 Wireless IC device 有权
标题翻译： Drahtlose integrierte Schaltungsvorrichtung
公开(公告)号：EP2840648B1
公开(公告)日：2016-03-23
申请号：EP14178344.9
申请日：2009-05-08
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Kato, Noboru , Ikemoto, Nobuo
IPC分类号： H01Q1/38 , G06K19/07 , G06K19/077 , H01Q1/50 , H01Q7/00 , H05K1/02
CPC分类号： G06K19/0775 , G06K19/0709 , G06K19/0723 , G06K19/07749 , G06K19/07779 , G06K19/07781 , G06K19/07783 , G06K19/07784 , H01Q1/2225 , H01Q1/48 , H01Q7/00 , H05K1/0243 , H05K2201/10098
摘要： To provide a wireless IC device capable of controlling the gain of transmission and reception signals. A wireless IC device includes a wireless IC chip (5) processing a certain radio signal; a power-supply circuit board (4) that is connected to the wireless IC chip (5) and that includes a power supply circuit including at least one coil pattern (23); and a radiation plate (3) radiating a transmission signal supplied from the power-supply circuit board (4) and/or receiving a reception signal to supply the reception signal to the power-supply circuit board (4). The radiation plate (3) includes an opening (7) provided in a part thereof and a slit (6) linking to the opening (7). Viewed in plan from the direction of the winding axis of the coil pattern (23), the opening (7) in the radiation plate (3) is overlapped with an inner area of the coil pattern (23) and the area of the inner area is approximately the same as that of opening (7).
摘要翻译：提供能够控制发送和接收信号的增益的无线IC器件。无线IC器件包括处理某个无线信号的无线IC芯片（5）连接到所述无线IC芯片的电源电路板（4），所述电源电路板（4）包括包括至少一个线圈图案（23）的电源电路; 以及辐射板（3），辐射从电源电路板（4）提供的发送信号和/或接收接收信号以将接收信号提供给电源电路板（4）。辐射板（3）包括设置在其一部分中的开口（7）和连接到开口（7）的狭缝（6）。从线圈图案（23）的卷绕轴的方向看平面图，辐射板（3）中的开口（7）与线圈图案（23）的内部区域和内部区域与开口（7）大致相同。

80. 发明公开

EP1978472A3 Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：EP1978472A3
公开(公告)日：2015-04-22
申请号：EP08005387.9
申请日：2008-03-20
申请人： Semiconductor Energy Laboratory Co., Ltd.
发明人： Yamazaki, Shunpei
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , G06K19/07775 , G06K19/07784 , H01L23/5227 , H01L23/5328 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： It is an object of the present invention to suppress poor connection or increase in contact resistance even in the case where an antenna is formed over an integrated circuit portion. An integrated circuit portion (102) having a first conductive film (104) is formed over a substrate (101), an insulating film is formed over the integrated circuit portion, a second conductive film (103) serving as an antenna is formed over the insulating film, an opening (107) is formed in the insulating film and the second conductive film to expose the first conductive film, and a third conductive film is formed in the opening and over a top surface of the second conductive film by a plating process to electrically connect the first conductive film and the second conductive film.
摘要翻译：本发明的目的是即使在集成电路部分上形成天线的情况下，也能够抑制连接不良或接触电阻的增加。在基板（101）上形成具有第一导电膜（104）的集成电路部（102），在该集成电路部上形成绝缘膜，在该集成电路部上形成作为天线的第二导电膜（103）在绝缘膜和第二导电膜中形成开口（107）以暴露第一导电膜，并且通过电镀工艺在开口中和第二导电膜的顶表面上形成第三导电膜以电连接第一导电膜和第二导电膜。

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