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    • 72. 发明公开
    • Method of and apparatus for laminating disc-shaped substrates
    • Verfahren und Vorrichtung zum LaminierenplattenförmigerSubstrate
    • EP0932149A2
    • 1999-07-28
    • EP99101392.1
    • 1999-01-26
    • Kitano Engineering Co., Ltd.
    • Amo, Mikuni c/o Kitano Engineering Co., Ltd.
    • G11B7/26
    • B29C65/52B29C63/0013B29C65/4825B29C65/483B29C65/4845B29C65/521B29C65/7847B29C66/1122B29C66/452B29C66/8322B29L2017/005B32B37/0007B32B37/1284B32B38/162B32B38/1875B32B2429/02G11B7/26Y10T156/1705Y10T156/1707
    • There is provided a method of and an apparatus for laminating disc-shaped substrates capable of automatically bonding an adhesive agent to the disc-shaped substrates very effectively and continuously. The method of laminating disc-shaped substrates comprising preparing an adhesive sheet body (S) comprising a plurality of adhesive agents (S2) each covered with a release paper (S3), peeling off the release paper (S3) from the adhesive sheet body (S), positioning the adhesive sheet body (S) from which the release paper (S3) is peeled off over a lower disc-shaped substrate (D1), pressing the adhesive sheet body (S) to allow the adhesive agent (S2) adhered to the lower surface of the adhesive sheet body (S) to bond or transfer onto a surface of the lower disc-shaped substrate (D1), peeling off the adhesive sheet body (S) from the adhesive agent (S2) bonded onto the surface of the lower disc-shaped substrate (D1), placing an upper disc-shaped substrate (D2) on the lower disc-shaped substrate (D1), pressing the upper disc-shaped substrate (D2) against the lower disc-shaped substrate (D1), thereby bonding the lower disc-shaped substrate (D1) and the upper disc-shaped substrate (D2). The laminating apparatus for laminating disc-shaped substrates comprising a holding table (2) to place a lower disc-shaped substrate (D1) thereon, supporting members (tension rollers 5A, 5B) for extending an adhesive sheet body (S) therebetween at a given interval over the holding table (2), a centering shaft (3) for positioning the adhesive sheet body (S), a laminating roller (1) for pressing the adhesive sheet body (S) against the lower disc-shaped substrate (D1) to bond the adhesive sheet body (S) onto the lower disc-shaped substrate (D1) while moving on the lower disc-shaped substrate (D1) from one end thereof to the other thereof, and a peeling member (4) for peeling off the adhesive sheet body (S) bonded onto the lower disc-shaped substrate (D1) from the lower disc-shaped substrate (D1).
    • 提供了一种用于层压盘形基底的方法和装置,其能够非常有效和连续地自动地将粘合剂粘合到盘形基底上。 层压盘状基材的方法包括制备包含多个粘合剂(S)的粘合片体(S),每个粘合剂层(S2)各自用隔离纸(S3)覆盖,从剥离纸(S3)剥离粘合片体( S),将剥离纸(S3)从其剥离的粘合片体(S)定位在下盘形基板(D1)上,按压粘合片体(S)以使粘合剂(S2)粘附 到粘合片体(S)的下表面粘合或转移到下盘形基板(D1)的表面上,从粘合到表面上的粘合剂(S2)剥离粘合片体(S) 的下盘形基板(D1),将上盘状基板(D2)放置在下盘状基板(D1)上,将上盘状基板(D2)压靠在下盘状基板( D1),从而结合下盘形基板(D1)和上盘形基板(D2)。 用于层压盘形基板的层压装置包括:用于在其上放置下盘形基板(D1)的保持台(2),用于在其间延伸粘合片体(S)的支撑构件(张紧辊5A,5B) 在保持台(2)上具有用于定位粘合片体(S)的定心轴(3)的定位间隔,用于将粘合片体(S)压靠在下盘形基板(D1)上的层压辊 ),在从其一端到另一端在下盘状基板(D1)上移动的同时将粘合片体(S)粘合到下盘状基板(D1)上,以及剥离部件(4),用于剥离 从下盘形基板(D1)脱离粘接到下盘形基板(D1)上的粘合片体(S)。