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    • 71. 发明公开
    • Poly-hydroxynaphthalene compounds and epoxy resin composition
    • Polymere Hydroxynaphtalinverbindungen und Epoxydharzzusammensetzung。
    • EP0524433A2
    • 1993-01-27
    • EP92110397.4
    • 1992-06-19
    • DAI-ICHI KOGYO SEIYAKU CO., LTD.NITTO DENKO CORPORATION
    • Naka, AkihiroIto, ShuichiAkizuka, Shinya
    • C08G10/02C08G59/08
    • H01B3/40C08G8/08C08G59/3218C08L63/00C08L61/04
    • [Arrangement]
      The epoxy resin composition of the present invention comprises, as essential components: an epoxy resin containing a polyfunctional epoxy resin prepared from epihalohydrin and a poly-hydroxynaphthalene compound which has been obtained by copolycondensation of α-naphthol and β-naphthol with an aldehyde and which has an average molecular weight of from 300 to 2000, preferably from 400 to 1500; a curing agent; and a curing promoter.
      [Effects]
      The epoxy resin composition for encapsulating ICs of the present invention is high in glass transition point of cured resin and excellent in heat stability, mechanical strength, water absorption and moisture resistance. Further, when treated with soldering, the epoxy resin composition prevents cracking of packages. Thus, the epoxy resin composition of the present invention is suitable for encapsulating ICs.
    • α-萘酚和β-萘酚与醛化合物的共缩聚得到平均分子量为300〜2,000的聚羟基萘化合物。 该化合物可用作环氧树脂的固化剂和作为环氧树脂的前体。 环氧树脂组合物包括(1)包含环氧树脂和聚羟基萘化合物作为固化剂的组合物和(2)包含通过使聚羟基萘化合物与表卤代醇和固化剂反应获得的环氧树脂的组合物。 本发明的环氧树脂组合物的特征在于,固化树脂具有高玻璃化转变温度和高热稳定性和高耐湿性,即使在焊接处理中也几乎不允许包装破裂。 因此,该组合物适用于封装半导体。
    • 74. 发明公开
    • Polyurethane type curable coating composition
    • HärtbareBeschichtungszusammensetzung呕吐型聚氨酯。
    • EP0498370A2
    • 1992-08-12
    • EP92101827.1
    • 1992-02-04
    • DAI-ICHI KOGYO SEIYAKU CO., LTD.
    • Shiraiwa, TetsuoMori, Shigeo
    • C08G18/48C09D175/04
    • C08G18/4862
    • The invention relates to a polyurethane type curable coating composition. This coating composition comprises an organic compound having a number average molecular weight of 300 to 20,000, which is represented by formula (1), and a polyisocyanate compound.



              Z-[(A) m -(B) a -H] k    (1)



      wherein
         A means

         B means -R³O-;
         the mode of bonding between A and B may be random or block;
         Z means an active hydrogen compound residue;
         R¹ means an alkylene group containing 1 to 10 carbon atoms;
         R² means an alkyl group, an alkenyl group, an aryl group, an alkylaryl group or an aralkyl group each containing 1 to 20 carbon atoms;
         R³ means an alkylene group containing 2 to 30 carbon atoms;
         a means a number of 0 to 100;
         k means a number of 1 to 12;
         m means a number of 1 to 250; and
         n means a number of 0 to 5.
      Coating a substrate with the coating composition of the invention yields a coating film which is high in flexibility and adhesion to the substrate even at low temperature.
    • 本发明涉及一种聚氨酯型可固化涂料组合物。 该涂料组合物包含由式(1)表示的数均分子量为300〜20,000的有机化合物和多异氰酸酯化合物。 Z - [(A)m-(B)aH] k(1>其中A表示 B表示-R 3 O-; A和B之间的键合模式可以是随机的或嵌段的; Z表示 活性氢化合物残基; R 1表示含有1至10个碳原子的亚烷基; R 2表示各自含有1至20个碳原子的烷基,烯基,芳基,烷基芳基或芳烷基 原子; R 3表示碳原子数2〜30的亚烷基,0〜100的数; k表示1〜12的数; m表示1〜250的数,n表示数 使用本发明的涂料组合物涂覆基材即使在低温下也能产生柔软性和对基材的粘附性的涂膜。
    • 78. 发明公开
    • Ion-conductive polymer electrolyte
    • Ionenleitender Polymerelektrolyt。
    • EP0460876A1
    • 1991-12-11
    • EP91304934.2
    • 1991-05-31
    • DAI-ICHI KOGYO SEIYAKU CO., LTD.
    • Motogami, KenjiMori, Shigeo
    • H01B1/12C08G65/26C08G65/32H01M6/18
    • H01M10/0565C08G65/22C08G65/2606H01B1/122H01M6/181H01M10/052
    • An ion-conductive polymer electrolyte comprises an organic polymer, a soluble electrolyte salt and an organic solvent. The organic polymer is the compound obtained by crosslinking an organic compound having a structure of the following general formula ⓛ;

              Z - [ (A m - X p ) - Y] k    ⓛ

      in which Z is a residue of a compound having at least one active hydrogen, Y is an active hydrogen group or polymerizable functional group, m is an integer of l to 25O, k is an integer of l to l2, A is a structure of the following general formula ②;

      wherein n is an integer of O to 25, R is an alkyl, alkenyl, aryl or alkylaryl group having l to 2O carbon atoms, X is -(CH₂-CH₂-O)- , and p is O or an integer of l to 45O, and, when p is not O, A and X are block-copolymerized, m shows the total number of copolymerized A units and p shows the total number of copolymerized X units.
    • 离子导电聚合物电解质包括有机聚合物,可溶性电解质盐和有机溶剂。 有机聚合物是通过将具有以下通式1 /< cir>的结构的有机化合物交联而获得的化合物; Z - [(Am-Xp)-Y] kl /&cir其中Z是具有至少一个活性氢的化合物的残基,Y是活性氢基团或可聚合官能团,m是1至25的整数, k为1〜12的整数,A为下述通式2的结构。 其中n为0至25的整数,R为具有1至20个碳原子的烷基,烯基,芳基或烷基芳基,X为 - (CH 2 -CH 2 -O) - ,p为O或整数 为1〜45,当p不为O时,A和X为嵌段共聚,m表示共聚A单元的总数,p表示共聚X单元的总数。