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61. 发明公开

EP3724185A1 OLIGOMERIC DIELECTRIC MATERIALS AND CAPACITOR THEREOF 审中-公开
公开(公告)号：EP3724185A1
公开(公告)日：2020-10-21
申请号：EP18887738.5
申请日：2018-12-14
申请人： Capacitor Sciences Incorporated
发明人： EDDER, Carine
IPC分类号： C07D409/14 , C08J5/18 , C07D417/14 , H01G4/00 , C08F120/10 , H01G4/18 , C08F120/52

62. 发明公开

EP3455286A1 CAPACITOR FILMS WITH HIGH TEMPERATURE PERFORMANCE, METHODS OF MANUFACTURE, AND ARTICLES THEREOF 有权转让
公开(公告)号：EP3455286A1
公开(公告)日：2019-03-20
申请号：EP17725031.3
申请日：2017-05-10
申请人： SABIC Global Technologies B.V.
发明人： MAHOOD, James Alan , MILANDOU, Fatime N. , NIEMEYER, Matthew Frank , PFEIFFENBERGER, Neal
IPC分类号： C08J5/18 , C08J5/22 , H01G4/00

63. 发明公开

EP3426703A1 IMPROVED HYDROPHILIC COMPOSITIONS 审中-公开
公开(公告)号：EP3426703A1
公开(公告)日：2019-01-16
申请号：EP16819356.3
申请日：2016-11-30
申请人： Superdielectrics Ltd
发明人： HIGHGATE, Donald James , HAMMERTON, Ian , HOWLIN, Brendan
IPC分类号： C08F226/06 , C08F226/10 , B29C67/00 , G02F1/13 , H01G4/00 , H01M10/06

64. 发明授权

EP2849190B1 Laminated chip electronic component, board for mounting the same, and packing unit thereof 有权
公开(公告)号：EP2849190B1
公开(公告)日：2018-07-25
申请号：EP14187377.8
申请日：2012-12-10
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Lee, Sun Cheol , Kim, Woo Sup , Kim, Dong Gun , Kim, Kyeong Jun , Lee, Kyu Ho
IPC分类号： H01G4/00 , H01G4/30 , H01G2/06 , H01G2/24 , H05K1/18 , H01L41/083 , H05K1/03 , H01C7/00 , H01C7/10
CPC分类号： H05K1/181 , H01C7/008 , H01C7/10 , H01G2/06 , H01G2/24 , H01G4/06 , H01G4/12 , H01G4/30 , H01L41/083 , H05K1/0306 , Y02P70/611
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

65. 发明公开

EP3326177A1 MULTI-LAYER CERAMIC CAPACITOR 有权转让
公开(公告)号：EP3326177A1
公开(公告)日：2018-05-30
申请号：EP16732551.3
申请日：2016-06-16
申请人： Epcos AG
发明人： IMURA, Tomoya , TAUCHI, Goushi , HIROSE, Masakazu , TERADA, Tomohiro
IPC分类号： H01B3/12 , H01G4/00 , C04B35/475
CPC分类号： H01G4/1227 , C01G23/006 , C01P2002/34 , C04B35/47 , C04B35/475 , C04B35/6262 , C04B35/62645 , C04B35/63 , C04B35/638 , C04B35/64 , C04B41/4578 , C04B41/5111 , C04B41/88 , C04B2235/3201 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3227 , C04B2235/3229 , C04B2235/3236 , C04B2235/3284 , C04B2235/3298 , C04B2235/602 , C04B2235/656 , C04B2235/6582 , C04B2235/6583 , C04B2235/768 , C04B2235/80 , H01B3/12 , H01G4/012 , H01G4/1218 , H01G4/248 , H01G4/30
摘要： A multi-layer ceramic capacitor is disclosed. In an embodiment the dielectric composition includes a perovskite crystal structure containing at least Bi, Na, Sr and Ti, wherein the dielectric composition includes a low-Bi phase in which a Bi concentration is no greater than 0.8 times the mean Bi concentration in the dielectric composition as a whole.

66. 发明公开

EP3194046A1 MESOPOROUS MATERIALS FROM NANOPARTICLE ENHANCED POLYSACCHARIDES 审中-公开
标题翻译：纳米颗粒增强多糖的介孔材料
公开(公告)号：EP3194046A1
公开(公告)日：2017-07-26
申请号：EP15784414.3
申请日：2015-09-15
申请人： The University of York , Consejo Superior De Investigaciones Científicas
发明人： BUDARIN, Vitaliy , CLARK, James Hanley , ELLIS, Gary James , SHUTTLEWORTH, Peter Samuel , SALAVAGIONE, Horacio Javier
IPC分类号： B01D24/00 , B01J21/00 , B29C67/00 , C01B32/00 , C08L1/00 , H01G4/00 , H01L31/00
CPC分类号： C04B35/78 , B01J21/18 , B01J35/0013 , B01J35/0026 , B01J35/0033 , B01J35/1038 , B01J35/1061 , B01J37/084 , C01B31/02 , C01B32/00 , C01P2002/82 , C01P2004/03 , C01P2004/04 , C01P2004/13 , C01P2006/12 , C01P2006/14 , C01P2006/16 , C01P2006/40 , C04B35/624 , C04B35/6261 , C04B38/0045 , C04B38/0067 , C04B2235/422 , C04B2235/48 , C04B2235/667 , C04B2235/77 , C04B2235/96 , C04B2235/9607 , C08L3/02 , H01G11/36 , H01G11/44 , H01M4/583 , H05K9/0073 , Y02E60/13
摘要： There is described a mesoporous composite material comprising carbon nanoparticles dispersed in a mesoporous carbonaceous material.
摘要翻译：描述了包含分散在中孔含碳材料中的碳纳米颗粒的中孔复合材料。

67. 发明授权

EP2827351B1 LAMINATED CERAMIC CHIP ELECTRONIC COMPONENT 有权转让
标题翻译： MEHRSCHICHTIGE KERAMISCHE ELEKTRONISCHE CHIP-KOMPONENT
公开(公告)号：EP2827351B1
公开(公告)日：2017-02-22
申请号：EP14174616.4
申请日：2012-08-23
申请人： Samsung Electro-Mechanics Co., Ltd
发明人： Ahn, Young Ghyu , Park, Sang Soo , Park, Min Cheol , Jeong, Se Hwa
IPC分类号： H01G4/00 , H01G4/30 , H05K1/02 , H01G4/005
CPC分类号： H01G4/005 , H01G4/30 , H05K1/0271 , H05K1/111 , H05K3/3442 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , H05K2201/2045 , Y02P70/611

68. 发明公开

EP2232512A4 CHIP CAPACITOR 审中-公开
标题翻译：贴片电容
公开(公告)号：EP2232512A4
公开(公告)日：2015-10-07
申请号：EP08855235
申请日：2008-11-07
申请人： ATI TECHNOLOGIES ULC
发明人： DRAPKIN OLEG , TEMKINE GRIGORI , AU KRISTINA
IPC分类号： H01G4/00 , H01G4/30 , H01L27/08 , H01L49/02
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232 , H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/19104 , Y10T29/4913 , H01L2924/00

69. 发明授权

EP1842662B1 Hydrolysebeständige, mehrschichtige Polyesterfolie mit Hydrolyseschutzmittel 有权
标题翻译：耐水解的，具有抗水解的多层聚酯膜
公开(公告)号：EP1842662B1
公开(公告)日：2011-08-10
申请号：EP07006482.9
申请日：2007-03-29
申请人： Mitsubishi Polyester Film GmbH
发明人： Kliesch, Holger, Dr. , Jesberger, Martin, Dr. , Kuhmann, Bodo , Fischer, Ingo , Klein, Dagmar, Dr.
IPC分类号： B32B27/18 , B32B27/36 , C08K5/1515 , H01B7/00 , H01G4/00 , H01L31/00 , H01R9/00
CPC分类号： B32B27/18 , B32B27/08 , B32B27/36 , B32B2250/03 , B32B2250/244 , B32B2307/518 , C08K5/1515 , H01G4/18 , H01G4/224 , Y10S428/91 , Y10T428/24942 , Y10T428/25 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/2982 , Y10T428/2991 , Y10T428/31786 , C08L67/02

70. 发明公开

EP2239305A1 Method, filler material, polymer composition and product 审中-公开
标题翻译： Verfahren，Füllstoff，Polymerzusammensetzung und Produkt
公开(公告)号：EP2239305A1
公开(公告)日：2010-10-13
申请号：EP09157603.3
申请日：2009-04-08
申请人： Premix Oy
发明人： Vilkman, Taisto , Kiikka, Tuomas
IPC分类号： C09C1/36 , C09C3/08 , C09C3/12 , C08K3/22 , C08K3/24 , H01G4/00
CPC分类号： C09C1/36 , C01P2006/40 , C08L21/00 , C09C3/08 , C09C3/12 , H01G4/206 , H01G4/33
摘要： A method for producing a filler material having a high dielectric constant and for dispersing in a polymer matrix, a filler material, a polymer composition, an antenna element, and a buried capacitor are provided. The method comprises: obtaining a basic filler comprising carrier particles selected from Ba x Sr 1-x TiO 3 , wherein x = 0 to 1, Mg 2 TiO 4 , Bi 2 (TiO 3 ) 3 , PbTiO 3 , NiTiO 3 , CaTiO 3 , ZnTiO 3 , Zn 2 TiO 4 , BaSnO 3 , Bi 2 (SnO 3 ) 3 , CaSnO 3 , PbSnO 3 , MgSnO 3 , SrSnO 3 , ZnSnO 3 , BaZrO 3 , CaZrO 3 , PbZrO 3 , MgZrO 2 , SrZrO 3 and/or ZnZrO 3 , and coating the carrier particles by organic acid, alcohol, tiol or silane, such as stearine acid, stearyl alcohol, pentaerytritol, trimethylolethane, trimethylolpropane, alkylmercaptans, such as octadecylmercaptan or dodecylmercaptan, dialkyldisulphide (-S-S-) 4-pyridine or phosphine.
摘要翻译：提供一种制造具有高介电常数并用于分散在聚合物基质，填料，聚合物组合物，天线元件和埋入式电容器中的填充材料的方法。该方法包括：获得包含选自Ba x Sr 1-x TiO 3，其中x = 0至1，Mg 2 TiO 4，Bi 2（TiO 3）3，PbTiO 3，NiTiO 3，CaTiO 3的载体颗粒的基本填料，ZnTiO 3，Zn 2 TiO 4，BaSnO 3，Bi 2（SnO 3）3，CaSnO 3，PbSnO 3，MgSnO 3，SrSnO 3，ZnSnO 3，BaZrO 3，CaZrO 3，PbZrO 3，MgZrO 3，SrZrO 3和 /或ZnZrO 3，并通过有机酸，醇，硫醇或硅烷如硬脂酸，硬脂醇，季戊四醇，三羟甲基乙烷，三羟甲基丙烷，烷基硫醇如十八烷基硫醇或十二烷基硫醇，载体颗粒，二烷基二硫化物（-SS-）吡啶或膦。

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