专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

EP2557633B1 PRESS FIT TERMINAL AND SEMICONDUCTOR MODULE 有权
公开(公告)号：EP2557633B1
公开(公告)日：2018-05-30
申请号：EP11765647.0
申请日：2011-03-30
申请人： Mitsubishi Electric Corporation
发明人： EGUSA Minoru , SUDO Shingo , HAYASHI Kenichi
IPC分类号： H01R13/03 , H01R12/58 , H05K3/30
CPC分类号： H01R12/585 , H01R13/03 , H05K3/308 , H05K2201/10295 , H05K2201/1059 , H05K2201/10818 , H05K2201/10856
摘要： The objective of the present invention is to obtain a press-fit terminal that can be worked readily and accurately and can reduce the contact resistance between the press-fit terminal and a through-hole, without increasing the press-fitting force when it is pressed into the through-hole and to obtain a semiconductor module provided with the press-fit terminal. The press-fit terminal is configured in such a way that there are laminated in a thickness direction (y direction) a plurality of press-fit terminal units (10 L ), each of which is made of a plate material and includes a front end portion (14) formed in the shape of a taper and press-contact portion (15) that is formed in such a way to have a pair of portions (15a) branched from the front end portion (14), and respective side faces of the pair of portions (15a) face each other through a predetermined spacing (15s), and that are inserted and press-fitted into the through-hole (31); the press-fit terminal is characterized in that respective board thicknesses (t L ) of the plurality of press-fit terminal units (10 L ) are smaller than width (Ws) of the predetermined spacing (15s) or respective widths (Wa) of the pair of portions (15a) branched from the front end portion.

62. 发明授权

EP3131160B1 TERMINAL-EQUIPPED CIRCUIT BOARD 失效
公开(公告)号：EP3131160B1
公开(公告)日：2018-05-23
申请号：EP15777559.4
申请日：2015-03-23
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： KAMI, Yoshitaka , SAKAI, Tatsurou , HACHIYA, Yoshikazu , NAGAI, Mamoru , IWATA, Makoto , SHI, Wenjie
IPC分类号： H01R13/52 , H01R13/44 , H02G3/16 , H01R12/58
CPC分类号： H01R12/58 , H01R13/521 , H01R2201/26
摘要： An aim is to provide a terminal-equipped circuit board that has a novel configuration that is simple and can prevent a vehicle from catching fire after submersion. A terminal-equipped circuit board (10) includes: a circuit board (14); and a plurality of terminals (12) that are provided upright on the circuit board (14). The plurality of terminals (12) include a positive terminal (12a) that is connected to a power supply line and a negative terminal (12b) that is connected to a ground line. At least one of the positive terminal (12a) and the negative terminal (12b) is enclosed by an impervious insulating tube member (42) that is provided therearound. The positive terminal (12a) and the negative terminal (12b) are located adjacent to each other.

63. 发明授权

EP2476165B1 STECKVERBINDUNG MIT ABSCHIRMUNG 有权转让
公开(公告)号：EP2476165B1
公开(公告)日：2018-05-23
申请号：EP10773231.5
申请日：2010-09-08
申请人： ERNI Production GmbH & Co. KG
发明人： LAPPÖHN, Jürgen
IPC分类号： H01R13/6587 , H01R13/6471 , H01R13/514 , H01R12/58 , H01R12/72 , H01R12/71
CPC分类号： H01R13/6587 , H01R12/585 , H01R12/716 , H01R12/724 , H01R13/514 , H01R13/6471

64. 发明公开

EP3316404A1 CONTACT PART AND PRESS-FIT TERMINAL 有权转让
标题翻译：接点部分和按压端子
公开(公告)号：EP3316404A1
公开(公告)日：2018-05-02
申请号：EP17198427.1
申请日：2017-10-26
申请人： DAI-ICHI SEIKO CO., LTD.
发明人： ENDO, Takayoshi , MUKUNOKI, Jun , TAKEDA, Takuya , TANAKA, Shota
IPC分类号： H01R12/58 , H01R11/12
摘要： A contact part (20), which is connected to a pillar-like pin (10) of a press-fit terminal (1) and which has spring characteristics, includes: a first retention contact piece (40A) that comes into contact with an inner surface of a through hole (H) in a circuit board (B), which is the connection target (B) of the press-fit terminal (1), and that includes a first retention part (41A) to be retained on a lower edge of the through hole (H) in the circuit board (B); and a lower coupling part (60) that supports the first retention contact piece (40A).
摘要翻译：与压配端子（1）的柱状销（10）连接并且具有弹簧特性的接触部分（20）包括：第一保持接触件（40A），其与第一保持接触件（1）的连接目标（B）的电路板（B）中的通孔（H）的内表面并且包括待保持在第一保持部分（41A）上的第一保持部分电路板（B）中通孔（H）的下边缘; 和支承第一保持接触片（40A）的下部连结部（60）。

65. 发明公开

EP3200635A4 GARMENT INTEGRATED ELECTRICAL INTERFACE SYSTEM AND METHOD OF MANUFACTURE 审中-公开
公开(公告)号：EP3200635A4
公开(公告)日：2018-04-11
申请号：EP15847342
申请日：2015-09-29
申请人： MAD APPAREL INC
发明人： BERG JAMES ARTEL , MACMILLAN GASTON , GLAISTER CHRIS , GROOM WESLEY , YAO LIANG
IPC分类号： A41D1/00 , A61B5/00 , H01R4/30 , H01R12/58 , H01R12/61 , H01R12/71
CPC分类号： A61B5/6804 , A61B5/6839 , A61B2562/12 , A61B2562/225 , H01R4/30 , H01R12/58 , H01R12/616 , H01R12/714 , H01R2201/12
摘要： A system for electrically coupling a garment to a mating object, the system comprising: a fabric interiayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interiayer and a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and a set of holes aligned with the set of vias and the set of ports, and a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners.

66. 发明公开

EP3249751A3 PRESS-FIT CIRCUIT BOARD CONNECTOR 有权转让
公开(公告)号：EP3249751A3
公开(公告)日：2018-02-28
申请号：EP17172071.7
申请日：2017-05-19
申请人： TE Connectivity Corporation
发明人： Annis, Kyle Gary , Storry, Mitchell Kunane , Yohn, Brent David
IPC分类号： H01R12/58 , H01R12/70 , H01R13/20 , H01R12/71
CPC分类号： H01R12/585 , H01R12/7082 , H01R12/716 , H01R13/20
摘要： A press-fit circuit board connector (100) is provided including a housing (104) having a mating end (106) and a mounting end (108). The housing (104) has a contact holder (110) including a plurality of contact channels (114). Contacts (112) are received in corresponding contact channels (114). Each contact (112) has a mating pin (116) and a mounting pin (118) opposite the mating pin (116). The mating pin (116) is compliant and configured for compliant mating with a corresponding socket contact of a mating connector. The mounting pin (118) is compliant and configured for press-fit mechanical and electrical connection to a circuit board (102). The mating pins (116) of the contacts (112) are arranged at the mating end (106) to define a pin mating interface (120) having a first pattern and the mounting pins (118) of the contacts (112) are arranged at the mounting end (108) to define a pin mounting interface (122) having a second pattern different than the first pattern.

67. 发明授权

EP2943999B1 ELECTRICAL PRESS-FIT PIN FOR A SEMICONDUCTOR MODULE 有权转让
标题翻译：用于半导体模块的电子压合销
公开(公告)号：EP2943999B1
公开(公告)日：2017-11-29
申请号：EP14738326.9
申请日：2014-01-14
申请人： Vishay General Semiconductor LLC
发明人： MATTIUZZO, Emilio
IPC分类号： H01R13/415 , H01R12/58
CPC分类号： H01R13/415 , H01R12/585 , H01R43/26 , Y10T29/49147
摘要： An electrical module includes a housing, at least one electrical component mounted within the housing and an electrical press-fit contact. The electrical press-fit contact is located in part within the housing and has a press fit portion and a stop portion at its distal end and a mounting portion at its proximal end. The mounting portion is electrically coupled to the electrical component. The press-fit portion is located exterior of the housing such that the stop portion is able to block movement of the press-fit section into the housing when a press-in force is introduced onto the press-in contact to press the press-fit contact into the housing.

68. 发明授权

EP2667453B1 INTER-SUBSTRATE CONNECTION TERMINAL, AND INVERTER AND ELECTRIC COMPRESSOR USING SAME 有权转让
标题翻译： INTER-SUBSTRATE CONNECTION TERMINAL，AND INVERTER AND ELECTRIC COMPLESSOR USING SAME
公开(公告)号：EP2667453B1
公开(公告)日：2017-08-09
申请号：EP12736691.2
申请日：2012-01-17
申请人： Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd.
发明人： HATTORI, Makoto , ASAI, Masahiko , NIWA, Kazuki , KAMITANI, Hiroyuki , HATTORI, Takashi
IPC分类号： H01R12/52 , F04B39/00 , H01R13/533 , H05K1/14 , H01R12/70 , H01R12/58 , H01R13/405
CPC分类号： H01R13/11 , F04B35/04 , H01R12/52 , H01R12/58 , H01R12/7052 , H01R13/405 , H02K5/22 , H05K1/144 , H05K3/368 , H05K2201/042 , H05K2201/10295 , H05K2201/10424

69. 发明公开

EP3192130A1 VERFAHREN ZUR LÖTFREIEN ELEKTRISCHEN EINPRESSKONTAKTIERUNG VON ELEKTRISCH LEITFÄHIGEN EINPRESS-STIFTEN IN LEITERPLATTEN 有权
标题翻译： VERFAHREN ZURLÖTFREIENELEKTRISCHEN EINPRESSKONTAKTIERUNG VON ELEKTRISCHLEITFÄHIGENEINPRESS-STIFTEN IN LEITERPLATTEN
公开(公告)号：EP3192130A1
公开(公告)日：2017-07-19
申请号：EP15730766.1
申请日：2015-06-19
申请人： Robert Bosch GmbH
发明人： OTTO, Andreas , HALM, Cynthia
IPC分类号： H01R12/58 , H01R43/20 , H05K13/04 , B23P19/033
CPC分类号： H01R43/205 , H01R12/585 , H05K3/325 , H05K3/328 , H05K2201/10189 , H05K2201/10303 , H05K2203/0195 , H05K2203/0278 , H05K2203/0285
摘要： The invention relates to a method for solderless electrical press-in contacting of conductive press-in pins (210) in circuit boards (100), comprising the following steps: providing a circuit board (100) having at least one contact opening (130) for press-in contacting. Providing at least one press-in component (200) having at least one conductive press-in pin (210). Providing a sonotrode (500) for exerting a force and applying ultrasonic energy. In order to electrically and mechanically contact press-in pins (210) to a circuit board (100) by means of ultrasonic press-in technology, according to the invention, the press-in component (200), together with the press-in pin (210) thereof, is fastened during a press-in step, in particular held stationary, and a force (F) and ultrasonic energy (I) are directly applied to the circuit board (100) by means of the sonotrode (500) such that the circuit board (100) is pressed at the location of the contacting opening (130) thereof to the press-in pin (210) of the press-in component (200), which is not directly applied by means of the sonotrode (500).
摘要翻译：包括以下步骤：提供具有至少一个接触开口（130）的电路板（100），所述电路板（100）具有至少一个接触开口（130）用于压入联系。提供具有至少一个导电压入销（210）的至少一个压入部件（200）。提供用于施加力和施加超声波能量的超声波发生器（500）。为了通过超声压入技术使压入销（210）与电路板（100）电和机械接触，根据本发明，压入部件（200）与压入部分（210）在压入步骤期间固定，尤其是保持静止，并且力（F）和超声波能量（I）借助超声波发生器（500）直接施加到电路板（100）使得电路板（100）在其接触开口（130）的位置处被挤压到压入部件（200）的压入销（210），压入部件（200）不直接借助超声波发生器（500）。

70. 发明授权

EP2667457B1 Gehäuseschale für einen Verschleisssensor einer Fahrzeugbremsanlage 有权
标题翻译：外壳用于Verschleisssensor的车辆制动系统
公开(公告)号：EP2667457B1
公开(公告)日：2017-04-12
申请号：EP13000823.8
申请日：2013-02-19
申请人： Kunststoff Schwanden AG
发明人： Kiener, Albert , Küsperth, Josef
IPC分类号： B60T17/22 , H01R12/58 , F16D66/02 , H01R13/52
CPC分类号： B60T17/22 , F16D66/021 , F16D66/022 , H01R12/585 , H01R13/5202

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式